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11. 发明授权

US07961475B2 Apparatus and method for facilitating immersion-cooling of an electronic subsystem 有权
标题翻译：用于促进电子子系统的浸入冷却的装置和方法
公开(公告)号：US07961475B2
公开(公告)日：2011-06-14
申请号：US12256618
申请日：2008-10-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
IPC分类号： H05K1/00 , H05K7/20 , H05K5/00 , H01R13/40 , H02B1/01 , F28F7/00 , F25D23/12
CPC分类号： H05K7/20772 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.
摘要翻译：提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。

12. 发明授权

US07907406B1 System and method for standby mode cooling of a liquid-cooled electronics rack 失效
标题翻译：液冷电子机架待机模式冷却的系统和方法
公开(公告)号：US07907406B1
公开(公告)日：2011-03-15
申请号：US12567954
申请日：2009-09-28
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/202 , H05K7/20609
摘要： System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.
摘要翻译：提供了系统和方法来冷却电子机架。模块化冷却单元（MCU）与机架相关联，以向电子子系统和大容量电源组件提供系统冷却剂。 MCU包括液 - 液热交换器，并且限定设备和系统冷却剂回路的部分。来自设备源的冷冻冷却剂通过液体 - 液体热交换器以冷却流过系统冷却剂回路的系统冷却剂。该系统还包括与系统冷却剂回路流体连通的空气 - 液体热交换器，与系统冷却剂回路流体连通的泵和控制器。控制器控制泵的操作，以根据操作模式来调节通过系统冷却剂回路的系统冷却剂流动。在备用模式下，系统冷却剂以较低的流量流过空气对液体热交换器，并将热量排放到周围空气。

13. 发明申请

US20100147490A1 APPARATUS AND METHOD FOR PROVIDING IN SITU COOLING OF COMPUTER DATA CENTERS DURING SERVICE CALLS 失效
标题翻译：计算机数据中心在服务呼叫期间提供现场冷却的装置和方法
公开(公告)号：US20100147490A1
公开(公告)日：2010-06-17
申请号：US12332656
申请日：2008-12-11
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F28F7/00
CPC分类号： H05K7/20736 , H05K7/2079
摘要： An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, comprises a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges.
摘要翻译：提供一种用于在执行维护操作时冷却容纳在计算机机架中的电子部件的装置和方法。在一个实施例中，该装置包括设置在计算机机架的出口门盖内的热交换组件，其具有一个或多个穿孔。当门打开时，一个或多个空气移动装置也设置在出口门上并由致动器启动，使得装置在被激活时迫使热空气进入热交换器。冷空气然后通过具有多个边缘的平面容纳板排出。板沿其一个边缘固定在出口门的顶部。

14. 发明申请

US20100146996A1 DATA CENTER COOLING ENERGY RECOVERY SYSTEM 审中-公开
标题翻译：数据中心冷却能源回收系统
公开(公告)号：US20100146996A1
公开(公告)日：2010-06-17
申请号：US12332708
申请日：2008-12-11
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D15/00 , F25B39/02
CPC分类号： F25B27/02 , F02G2254/00 , H05K7/2079
摘要： A method and associated system is provided for cooling of a data center. The method includes providing coolant to multiple cooling elements in the data center using a heat pump refrigeration cycle to cool the coolant and provide a high temperature at the condenser. This allows the reclaiming of at least a portion of the heat removed from the refrigeration cycle using a heat engine. The engine is disposed between the refrigeration condenser and the ambient environment or cooling medium.
摘要翻译：提供了一种用于冷却数据中心的方法和相关系统。该方法包括使用热泵制冷循环向数据中心中的多个冷却元件提供冷却剂以冷却冷却剂并在冷凝器处提供高温。这允许使用热引擎回收从制冷循环中去除的热量的至少一部分。发动机设置在制冷冷凝器和周围环境或冷却介质之间。

15. 发明申请

US20080278913A1 COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED 审中-公开
标题翻译：冷却装置和冷却电子模块，具有密封的冷却回路管状结构，密封到要冷却的表面的外围
公开(公告)号：US20080278913A1
公开(公告)日：2008-11-13
申请号：US12178033
申请日：2008-07-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28C3/08 , F28F7/00 , H01L23/4735 , H01L2224/73253 , Y10S165/908
摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.
摘要翻译：使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面其中基面被密封到待冷却的表面。

16. 发明授权

US07405936B1 Hybrid cooling system for a multi-component electronics system 有权
标题翻译：用于多组件电子系统的混合冷却系统
公开(公告)号：US07405936B1
公开(公告)日：2008-07-29
申请号：US12055455
申请日：2008-03-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20736 , F28F1/20 , F28F1/22 , H05K7/20009 , H05K7/20554 , H05K7/20772
摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.
摘要翻译：为多组件电子系统提供混合冷却系统和制造方法。该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

17. 发明授权

US07274566B2 Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths 有权
标题翻译：在冷却剂流动路径之间使用冷却剂流动驱动装置的电子系统的冷却装置
公开(公告)号：US07274566B2
公开(公告)日：2007-09-25
申请号：US11008732
申请日：2004-12-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F04B17/00
CPC分类号： H05K7/2079
摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.
摘要翻译：提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。次级流体流动路径与主冷却剂流动路径分离。流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

18. 发明授权

US07086247B2 Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack 有权
标题翻译：使用辅助热电容器单元的冷却系统和方法便于电子机架的连续运行
公开(公告)号：US07086247B2
公开(公告)日：2006-08-08
申请号：US10930079
申请日：2004-08-31
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： H01L23/4275 , F28D20/021 , H01L2924/0002 , H05K7/20654 , Y02E60/145 , H01L2924/00
摘要： A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.
摘要翻译：提供冷却方法来冷却诸如电子机架的电子子系统。冷却方式包括冷却剂调节单元和热电容器单元。冷却剂调节单元具有热交换器，第一冷却回路和第二冷却回路。第一冷却回路从设备冷却剂源接收设备冷却剂，并将其至少一部分通到热交换器。第二冷却回路将系统冷却剂提供给电子子系统，并将热交换器中的热量从电子系统排出到第一冷却回路中的设备冷却剂。热电容器单元与第二冷却回路流体连通，以在第一冷却回路中的设备冷却剂关闭或故障时将系统冷却剂的温度维持在限定范围内一段时间，从而允许电子装置的继续运行子系统。

19. 发明授权

US08955346B2 Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load 有权
标题翻译：冷却剂缓冲，蒸气压缩制冷装置和控制冷却剂热负荷的方法
公开(公告)号：US08955346B2
公开(公告)日：2015-02-17
申请号：US12939546
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12 , F25B49/02 , F25B25/00 , H05K7/20
CPC分类号： F25B49/02 , F25B25/005 , F25B2400/01 , F25B2400/06 , F25B2500/28 , F25B2600/13 , F25B2700/21171 , H05K7/20809 , H05K7/20836 , Y02B30/745
摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通地连接以冷却和供应的冷却剂与制冷剂热交换器冷却剂冷却剂冷却结构。该装置还包括与冷却剂 - 制冷剂热交换器流体连通的制冷剂回路，并且热交换器通过从冷却剂回路中的冷却剂向制冷剂回路中的制冷剂散热而冷却通过其中的冷却剂。可控制的冷却剂加热器与冷却剂回路相关联，以在冷却剂回路中的冷却剂上提供可调整的热负荷，以确保至少最小的热负荷从冷却剂消耗到通过热交换器的制冷剂。

20. 发明授权

US08369091B2 Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack 有权
标题翻译：用于电子机架的电子子系统的交错式浸入式冷却装置和方法
公开(公告)号：US08369091B2
公开(公告)日：2013-02-05
申请号：US12825761
申请日：2010-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F28D2021/0031 , F28F3/12 , G06F1/20 , G06F2200/201 , H05K7/20236 , H05K7/20827
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

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