专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20050279739A1 Semiconductor structure processing using multiple laser beam spots spaced on-axis to increase single-blow throughput 有权
标题翻译：使用在轴上间隔开的多个激光束点的半导体结构处理来增加单次打击吞吐量
公开(公告)号：US20050279739A1
公开(公告)日：2005-12-22
申请号：US11052000
申请日：2005-02-04
申请人： Kelly Bruland , Brian Baird , Ho Lo , Stephen Swaringen , Frank Evans
发明人： Kelly Bruland , Brian Baird , Ho Lo , Stephen Swaringen , Frank Evans
IPC分类号： B23K26/00 , B23K26/06 , B23K26/067 , B23K26/08 , B23K26/10 , B23K26/38 , B23K26/40 , H01L21/768 , H01L23/525
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0624 , B23K26/067 , B23K26/10 , B23K2101/40 , H01L21/76894 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second pulsed laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs respective first and second pulses from the first and second pulsed laser beams onto distinct first and second structures in the row so as to complete irradiation of said structures with a single laser pulse per structure. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with either the first or the second laser beam. The moving step results in a speed that is greater than would occur if only a single laser beam were utilized to irradiate the structures in the row.
摘要翻译：方法和系统使用多个脉冲激光束选择性地照射半导体衬底上或内部的结构。这些结构被布置成在大体上沿长度方向延伸的一排。该方法产生沿着与半导体衬底相交的第一激光束轴传播的第一脉冲激光束和沿着与半导体衬底相交的第二激光束轴传播的第二脉冲激光束。该方法将来自第一和第二脉冲激光束的相应的第一和第二脉冲引导到行中不同的第一和第二结构，以便用每个结构的单个激光脉冲完成所述结构的照射。该方法相对于半导体衬底基本上在与行的长度方向平行的方向基本上一致地移动第一和第二激光束轴线，以便用第一或第二激光束选择性地照射该行中的结构。移动步骤导致的速度大于如果仅使用单个激光束来照射行中的结构的速度。

12. 发明申请

US20080223837A1 USE OF PREDICTIVE PULSE TRIGGERING TO IMPROVE ACCURACY IN LINK PROCESSING 有权
标题翻译：使用预测脉冲触发来提高链接处理中的精度
公开(公告)号：US20080223837A1
公开(公告)日：2008-09-18
申请号：US11687578
申请日：2007-03-16
申请人： Kelly Bruland , Clint Vandergiessen
发明人： Kelly Bruland , Clint Vandergiessen
IPC分类号： B23K26/02
CPC分类号： B23K26/0648 , B23K26/034 , B23K26/0344 , B23K26/04 , B23K26/0622 , B23K26/0643 , B23K26/08 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method.
摘要翻译：预测脉冲触发（PPT）方法能够在链路处理系统中精确触发激光束。 PPT方法需要基于目标和激光束轴的估计的相对运动参数触发激光束。与传统的完全基于测量的方法相比，PPT方法可以提高激光定位精度的六倍。

13. 发明授权

US08278595B2 Use of predictive pulse triggering to improve accuracy in link processing 有权
标题翻译：使用预测脉冲触发来提高链路处理的准确性
公开(公告)号：US08278595B2
公开(公告)日：2012-10-02
申请号：US11687578
申请日：2007-03-16
申请人： Kelly Bruland , Clint Vandergiessen
发明人： Kelly Bruland , Clint Vandergiessen
IPC分类号： B23K26/02
CPC分类号： B23K26/0648 , B23K26/034 , B23K26/0344 , B23K26/04 , B23K26/0622 , B23K26/0643 , B23K26/08 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method.
摘要翻译：预测脉冲触发（PPT）方法能够在链路处理系统中精确触发激光束。 PPT方法需要基于目标和激光束轴的估计的相对运动参数触发激光束。与传统的完全基于测量的方法相比，PPT方法可以提高激光定位精度的六倍。

14. 发明申请

US20070020785A1 Systems and methods for alignment of laser beam(s) for semiconductor link processing 有权
标题翻译：用于半导体连接处理的激光束对准的系统和方法
公开(公告)号：US20070020785A1
公开(公告)日：2007-01-25
申请号：US11481562
申请日：2006-07-05
申请人： Kelly Bruland , Stephen Swaringen
发明人： Kelly Bruland , Stephen Swaringen
IPC分类号： H01L21/66
CPC分类号： H01L23/5258 , B23K26/043 , G11C17/14 , G11C17/143 , H01L2924/0002 , H01L2924/00
摘要： A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The laser beam propagates along a beam path having an axis extending from a laser to a laser beam spot at a location on or within the semiconductor substrate. The method generates, based on at least one measured characteristic of the laser beam, at least one signal to control an adjustable optical element of the machine effecting the laser beam path. The method also sends said at least one signal to the adjustable optical element. The method then adjusts the adjustable optical element in response to said at least one signal so as to improve static alignment of the laser beam path axis.
摘要翻译：一种方法对机器中的激光束的静态对准进行离散调整，用于使用激光束选择性地照射半导体衬底上或内部的导电连接。激光束沿着具有从激光器延伸到半导体衬底上或内部的位置的激光束点的光束路径传播。该方法基于激光束的至少一个测量特性产生至少一个信号，以控制影响激光束路径的机器的可调节光学元件。该方法还将所述至少一个信号发送到可调光学元件。该方法然后响应于所述至少一个信号调整可调光学元件，以改善激光束路径轴线的静态对准。

15. 发明申请

US20060180581A1 Method for correcting systematic errors in a laser processing system 有权
标题翻译：用于校正激光加工系统中的系统误差的方法
公开(公告)号：US20060180581A1
公开(公告)日：2006-08-17
申请号：US11059025
申请日：2005-02-15
申请人： Stephen Swaringen , Kelly Bruland , Andrew Wells
发明人： Stephen Swaringen , Kelly Bruland , Andrew Wells
IPC分类号： B23K26/03 , G06F19/00
CPC分类号： B23K26/04 , B23K2101/40
摘要： A method for calibrating a laser micro-machining system in three dimensions includes scanning a sample workpiece to determine the 3D surface, calculating the best fit surfaces to the scanned data in a series of steps, and storing the results so that subsequent workpieces can be calibrated to remove systematic errors introduced by variations in an associated material handling subsystem. The method optionally uses plate bending theory to model particulate contamination and splines to fit the 3D surface in a piecewise fashion to minimize the effect of local variations on the entire surface fit.
摘要翻译：用于在三维中校准激光微加工系统的方法包括扫描样品工件以确定3D表面，以一系列步骤计算扫描数据的最佳拟合曲面，并存储结果，使得随后的工件可以被校准以消除由相关材料处理子系统中的变化引入的系统误差。该方法可选地使用板弯曲理论来模拟颗粒污染物和花键以便以分段方式拟合3D表面，以最小化局部变化对整个表面拟合的影响。

16. 发明申请

US20060128073A1 Multiple-wavelength laser micromachining of semiconductor devices 审中-公开
标题翻译：半波长激光微加工半导体器件
公开(公告)号：US20060128073A1
公开(公告)日：2006-06-15
申请号：US11067464
申请日：2005-02-25
申请人： Yunlong Sun , Richard Harris , Kelly Bruland , Robert Hainsey , Ho Lo , Lei Sun
发明人： Yunlong Sun , Richard Harris , Kelly Bruland , Robert Hainsey , Ho Lo , Lei Sun
IPC分类号： H01L21/82 , B23K26/16
CPC分类号： H01L23/5258 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/067 , B23K26/361 , B23K26/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/172 , B23K2103/26 , B23K2103/50 , H01L2924/0002 , H01S3/10046 , H01S3/2383 , Y10S438/94 , H01L2924/00
摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.
摘要翻译：在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

17. 发明申请

US20050282319A1 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure 有权
标题翻译：使用在结构上纵向重叠的多个激光束点的半导体结构处理
公开(公告)号：US20050282319A1
公开(公告)日：2005-12-22
申请号：US11051261
申请日：2005-02-04
申请人： Kelly Bruland , Brian Baird , Ho Lo , Richard Harris , Yunlong Sun
发明人： Kelly Bruland , Brian Baird , Ho Lo , Richard Harris , Yunlong Sun
IPC分类号： B23K26/06 , B23K26/067 , H01L21/00 , H01L21/26 , H01L21/302 , H01L21/324 , H01L21/42 , H01L21/461 , H01L21/477 , H01L21/84 , H01L23/525
CPC分类号： B23K26/067 , B23K26/0604 , B23K26/0613 , H01L21/76894 , H01L23/5258 , H01L27/1052 , H01L27/10894 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots. The total region is larger than the first beam spot and also larger than the second beam spot. The method sets respective first and second energy values of the first and second laser beam pulses to cause complete depthwise processing of the selected structure across the width of the structure in at least a portion of the total region.
摘要翻译：方法和系统使用激光脉冲来处理半导体衬底上或其中的选定结构。该结构具有表面，宽度和长度。随着激光脉冲处理所选择的结构，激光脉冲沿着沿扫描光束路径相对于衬底移动的轴传播。所述方法同时在所选择的结构上产生沿相应的第一和第二激光束轴线在不同的第一和第二位置与所选择的结构相交的第一和第二激光束脉冲。第一和第二激光束脉冲冲击所选结构的表面上相应的第一和第二光束点。每个光束点至少包含所选链接的宽度。第一和第二光束斑点沿着所选择的结构的长度在空间上彼此偏移以限定由第一和第二光束点两者覆盖的重叠区域，以及由第一和第二光束斑点中的一个或两个覆盖的总区域。总区域大于第一束斑，并且大于第二束斑。该方法设置第一和第二激光束脉冲的相应的第一和第二能量值，以便在整个区域的至少一部分中跨结构的宽度对所选结构进行完全深度处理。

18. 发明申请

US20070228024A1 Methods and Systems for Decreasing the Effective Pulse Repetition of a Laser 有权
标题翻译：减少激光有效脉冲重复的方法和系统
公开(公告)号：US20070228024A1
公开(公告)日：2007-10-04
申请号：US11758497
申请日：2007-06-05
申请人： Kelly Bruland , Steve Swaringen , Steve Stone , Keith Grant
发明人： Kelly Bruland , Steve Swaringen , Steve Stone , Keith Grant
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/04 , B23K26/0622 , B23K26/0853 , B23K2101/40
摘要： A method selectively processes structures on a workpiece with laser pulses. The structures are arranged in a linear pattern having approximately equal pitch. The pulses propagate along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method fires a first processing pulse when the spot coincides with a first structure location, selectively blocks or clears the propagation path during the first pulse, moves the workpiece and the spot relative to one another such that the spot moves toward a second structure location at a speed less than the product of the laser's PRF and the pitch, fires a dummy pulse before the spot reaches the second structure location, blocks the propagation path during the dummy laser pulse, fires another processing pulse when the beam spot coincides with the second structure location, and selectively blocks or clears the propagation path during the second processing pulse.
摘要翻译：一种方法用激光脉冲选择性地处理工件上的结构。这些结构被布置成具有大致相等间距的线性图案。脉冲沿着终止于工件上的激光束点的激光束传播路径传播。当该点与第一结构位置一致时，该方法触发第一处理脉冲，在第一脉冲期间选择性地阻挡或清除传播路径，使工件和光点相对于彼此移动，使得光点向第二结构位置移动小于激光器PRF和音调的乘积的速度，在点到达第二结构位置之前触发虚拟脉冲，在伪激光脉冲期间阻挡传播路径，当光束点与第二结构重合时触发另一个处理脉冲并且在第二处理脉冲期间选择性地阻挡或清除传播路径。

19. 发明申请

US20070008534A1 Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing 有权
标题翻译：用于区分多个激光束的反射用于半导体结构处理的校准的系统和方法
公开(公告)号：US20070008534A1
公开(公告)日：2007-01-11
申请号：US11499394
申请日：2006-08-03
申请人： Ho Lo , David Hemenway , Brady Nilsen , Kelly Bruland
发明人： Ho Lo , David Hemenway , Brady Nilsen , Kelly Bruland
IPC分类号： G01B11/00
CPC分类号： H01L23/5258 , G11C17/14 , G11C17/143 , H01L2924/0002 , H01L2924/00
摘要： A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.
摘要翻译：系统确定半导体衬底和机器中半导体衬底上或半导体衬底内的多个激光束点的相对位置，用于使用多个激光束选择性地照射衬底上或衬底内的结构。该系统包括激光源，第一和第二激光束传播路径，第一和第二反射传感器以及处理器。激光源至少产生第一和第二激光束，其分别沿着第一和第二传播路径朝着衬底传播，其具有在相应的第一和第二点处与衬底相交的相应的第一和第二轴。反射传感器被定位成检测点的反射，因为光点相对于基板移动，从而产生反射信号。处理器被配置为基于反射信号确定基板上或内部的斑点的位置。

20. 发明申请

US20050282367A1 Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures 有权
标题翻译：使用在非相邻结构上在轴上间隔开的多个激光束点的半导体结构处理
公开(公告)号：US20050282367A1
公开(公告)日：2005-12-22
申请号：US11051263
申请日：2005-02-04
申请人： Kelly Bruland , Brian Baird , Ho Lo , Frank Evans
发明人： Kelly Bruland , Brian Baird , Ho Lo , Frank Evans
IPC分类号： B23K26/067 , H01L21/425
CPC分类号： B23K26/067
摘要： Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.
摘要翻译：方法和系统使用多个激光束选择性地照射半导体衬底上或内部的结构。这些结构被布置成在大体上沿长度方向延伸的一排。该方法产生沿着与半导体衬底相交的第一激光束轴传播的第一激光束和沿着与半导体衬底相交的第二激光束轴传播的第二激光束。该方法将第一和第二激光束引导到行中不相邻的第一和第二结构。该方法使第一激光束和第二激光束相对于半导体衬底在基本上平行于该行的长度方向的方向上大致一齐地沿着行移动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式