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    • 17. 发明授权
    • Abrasive tape
    • 砂带
    • US5135546A
    • 1992-08-04
    • US564947
    • 1990-08-09
    • Masami SatoMitsuo Inoue
    • Masami SatoMitsuo Inoue
    • B24D3/00B24D3/28B24D11/00
    • B24D11/00B24D3/28
    • An abrasive tape comprises a flexible substrate and an abrasive layer, which is overlaid on the flexible substrate and which is primarily constituted of abrasive grains and a binder. The abrasive grains are composed of first abrasive grains and second abrasive grains. The first abrasive grains and the second abrasive grains are constituted of at least one type of angular grains which are selected from the group consisting of Cr.sub.2 O.sub.3, SiC, and Al.sub.2 O.sub.3, and which are obtained from a pulverizing process. The mean grain diameter of the first abrasive grains falls within the range of 6 .mu.m to 9 .mu.m. The mean grain diameter of the second abrasive grains falls within the range of 4 .mu.m to 6 .mu.m. The binder is contained in a proportion falling within the range of 10% by weight to 30% by weight with respect to the abrasive grains. A 40% by weight to 65% by weight portion of the binder is constituted of a polyisocyanate.
    • 研磨带包括柔性基底和研磨层,其覆盖在柔性基底上,并且主要由磨料颗粒和粘合剂构成。 磨粒由第一磨粒和第二磨粒构成。 第一磨粒和第二磨粒由至少一种选自Cr 2 O 3,SiC和Al 2 O 3的角粒组成,并由粉碎过程得到。 第一磨粒的平均粒径在6μm〜9μm的范围内。 第二磨粒的平均粒径在4μm〜6μm的范围内。 粘合剂的含量相对于磨粒为10重量%〜30重量%。 40重量%〜65重量%的粘合剂由多异氰酸酯构成。
    • 19. 发明申请
    • Brake-controllable brushless motor
    • 制动控制无刷电机
    • US20080224640A1
    • 2008-09-18
    • US12075489
    • 2008-03-12
    • Kazuo ItohToshiyuki TachibanaMitsuo Inoue
    • Kazuo ItohToshiyuki TachibanaMitsuo Inoue
    • H02P3/14H02P1/04H03K5/00
    • H02P6/24
    • A brake-controllable brushless motor has a rotor and a stator having polyphase coils; a polar position detector whereby electric power is supplied to the coil selected by its phase in response to the polar positions of the rotor detected by the polar position detector; a driver division for controlling the electric supply to the coils; a motor pulse identifier for recognizing motor pulse signals fed from the polar position detector; and a delayed pulse generator for producing phase-delayed pulse signals in response to the pulse signals fed from the motor pulse identifier, thereby ensuring that when the brushless motor is braked, the phase delay of the delayed pulse signals is progressively and continuously enlarged, and that the coils receive a controlled electric supply from the driver division in response to the delayed pulse signals.
    • 制动控制无刷电动机具有转子和具有多相线圈的定子; 极位置检测器,其响应于由极位置检测器检测的转子的极性位置,向由其相位选择的线圈提供电力; 用于控制线圈供电的驱动器部分; 用于识别从极位置检测器馈送的电动机脉冲信号的电动机脉冲识别器; 以及延迟脉冲发生器,用于响应于从电动机脉冲识别器馈送的脉冲信号产生相位延迟的脉冲信号,从而确保当无刷电动机被制动时,延迟脉冲信号的相位延迟逐渐地和连续地增大, 线圈响应于延迟的脉冲信号从驱动器分段接收受控电源。
    • 20. 发明申请
    • Production method for thin-film semiconductor
    • 薄膜半导体的生产方法
    • US20060141683A1
    • 2006-06-29
    • US10529373
    • 2004-08-17
    • Mitsuo InoueHidetada TokiokaShinsuke Yura
    • Mitsuo InoueHidetada TokiokaShinsuke Yura
    • H01L21/84H01L21/20C30B11/00
    • H01L21/02686H01L21/02678H01L21/02691H01L21/2026H01L29/66757
    • A method of fabricating a thin-film of a semiconductor material includes: a scanning irradiation step of, in order to form a polycrystalline silicon film on the surface of a substrate, focusing first pulse laser light having a visible wavelength into a line shape having an intensity distribution of an approximately Gaussian shape in a width direction on the surface of the substrate and applying the light such that the line shape is shifted in the width direction; an edge processing step of, after performing the scanning irradiation step in one position in one direction, applying second pulse laser light having an ultraviolet wavelength to an end region of an edge parallel to the width direction of a region having undergone the scanning irradiation; and a step of applying the scanning irradiation step again to cover a region that is adjacent to the region covered by the scanning irradiation step as well as overlaps the end region having undergone the edge processing step.
    • 制造半导体材料薄膜的方法包括:扫描照射步骤,为了在基板的表面上形成多晶硅膜,将具有可见波长的第一脉冲激光聚焦成具有 在基板的表面上的宽度方向上的大致高斯形状的强度分布,并且施加光,使得线形状在宽度方向上偏移; 边缘处理步骤,在沿一个方向的一个位置执行扫描照射步骤之后,将具有紫外线波长的第二脉冲激光施加到与经过扫描照射的区域的宽度方向平行的边缘的端部区域; 以及再次施加扫描照射步骤以覆盖与扫描照射步骤所覆盖的区域相邻的区域以及与已经经历边缘处理步骤的端部区域重叠的步骤。