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11. 发明授权

US07476839B2 Amplifier circuit for optical disk drive 有权
标题翻译：用于光盘驱动器的放大器电路
公开(公告)号：US07476839B2
公开(公告)日：2009-01-13
申请号：US10983737
申请日：2004-11-09
申请人： Hiroshi Yamaguchi , Masaki Taniguchi
发明人： Hiroshi Yamaguchi , Masaki Taniguchi
IPC分类号： H03F3/06 , H03F3/45 , H03G3/00 , G11B11/00
CPC分类号： H03F3/08 , H03F3/45085 , H03F2203/45466 , H03G3/3084
摘要： An operational amplifier including a pair of differential input transistors is provided with a feedback resistor switching circuit and a variable current source. When a loaded optical disk is a DVD-ROM, the feedback resistor switching circuit reduces a gain of the operational amplifier and the variable current source selects a large current (of, for example, 1 mA) as a common bias current supplied to the differential input transistors. When the loaded optical disk is a DVD-RAM with low reflectance and low recording/reproducing speed, the feedback resistor switching circuit enhances the gain of the operational amplifier and the variable current source selects a small current (of, for example, 0.5 mA) as the common bias current.
摘要翻译：包括一对差分输入晶体管的运算放大器设置有反馈电阻器切换电路和可变电流源。当加载的光盘是DVD-ROM时，反馈电阻器开关电路降低运算放大器的增益，并且可变电流源选择大电流（例如，1mA）作为提供给差分器的公共偏置电流输入晶体管。当装载的光盘是具有低反射率和低记录/再现速度的DVD-RAM时，反馈电阻器切换电路增强了运算放大器的增益，并且可变电流源选择小电流（例如，0.5mA）作为常见的偏置电流。

12. 发明申请

US20080179501A1 Output impedance varying circuit 有权
公开(公告)号：US20080179501A1
公开(公告)日：2008-07-31
申请号：US12076788
申请日：2008-03-24
申请人： Hiroshi Yamaguchi , Masaki Taniguchi
发明人： Hiroshi Yamaguchi , Masaki Taniguchi
IPC分类号： G01J1/44
CPC分类号： H03F3/3069 , H03F1/08 , H03F1/56 , H03F3/08 , H03F3/087 , H03F3/343
摘要： A photo detector IC (PDIC) is connected with a flexible printed circuit board (FPC). A signal converted into a voltage through light-to-voltage conversion in the PDIC is connected with the drain of a field effect transistor (FET), while the source of the FET is connected to an output terminal. A signal from the output terminal is input into a signal processing board of the main body via the FPC serving as an equivalent circuit composed of a coil and a capacitor. The gate of the FET is connected with a variable voltage source. Peaking occurs due to inductor components and capacitance components of the FPC. However, by application of voltage to the variable voltage source, the gate voltage value of the FET is adjusted to be an optimal value, whereby the peaking is suppressed by the on-resistance of the FET.

13. 发明申请

US20080176421A1 Connecting parts and multilayer wiring board 失效
标题翻译：连接件和多层接线板
公开(公告)号：US20080176421A1
公开(公告)日：2008-07-24
申请号：US11882028
申请日：2007-07-30
申请人： Kazuaki Suzuki , Masaki Taniguchi
发明人： Kazuaki Suzuki , Masaki Taniguchi
IPC分类号： H01R12/22
CPC分类号： H05K3/368 , H01R12/52 , H01R13/2414 , H05K1/186 , H05K3/325 , H05K3/4611 , H05K2201/0314 , H05K2201/0367 , H05K2201/10636 , H05K2201/10977 , Y02P70/611
摘要： A connecting part for ensuring a secure connection includes first connecting terminals that are arranged on one face of a supporting member and second connecting terminals that are arranged on the back face of the supporting member. The supporting member may have an elastic body. The connecting terminals are interconnected by conductive films which are formed on the face of the supporting member. Connecting parts are arranged between circuit boards on which electronic parts are mounted, and the circuit boards are mutually fixed in the state in which the connecting parts are compressed. The first and second connecting terminals are pushed against lands on the circuit boards by restoring force of the connecting parts, and then the circuit boards are electrically interconnected.
摘要翻译：用于确保安全连接的连接部分包括布置在支撑构件的一个面上的第一连接端子和布置在支撑构件的背面上的第二连接端子。支撑构件可以具有弹性体。连接端子由形成在支撑构件的表面上的导电膜互连。连接部件布置在其上安装电子部件的电路板之间，并且电路板在连接部件被压缩的状态下相互固定。第一和第二连接端子通过连接部件的恢复力而被推靠在电路板上的平台上，然后电路板电互连。

14. 发明授权

US07391265B2 Amplifier unit and optical disc drive 失效
标题翻译：放大器单元和光盘驱动器
公开(公告)号：US07391265B2
公开(公告)日：2008-06-24
申请号：US11430241
申请日：2006-05-09
申请人： Shinichi Miyamoto , Yousuke Kuroiwa , Masaya Ueda , Hideo Fukuda , Hiroshi Yamaguchi , Masaki Taniguchi
发明人： Shinichi Miyamoto , Yousuke Kuroiwa , Masaya Ueda , Hideo Fukuda , Hiroshi Yamaguchi , Masaki Taniguchi
IPC分类号： H03F3/45 , H03F3/08
CPC分类号： H03F3/3432 , H03F3/08 , H03F2200/78
摘要： An amplifier unit is provided, with which the need for manufacturing a photoelectric conversion IC in Bi-CMOS process is eliminated, and relatively low process cost of the photoelectric conversion IC is achieved. The input section of a buffer (the base of a transistor Q5) is connected with a plurality of patterns of phase compensation circuits each including a resistor and a capacitor connected in series. A bipolar transistor (Q6) is interposed between a positive power supply line and a capacitor (C2) forming a capacitance of the phase compensation circuit. By switching on/off the bipolar transistor (Q6), the capacitance value and resistance value of the phase compensation circuit are switched. Since the bipolar transistor (Q6) is interposed between the capacitor (C2) and the positive power supply line, base current (Isw) acting as a switch signal does not affect the amplifier unit.
摘要翻译：提供放大器单元，消除了在Bi-CMOS工艺中制造光电转换IC的需要，并且实现了光电转换IC的相对低的处理成本。缓冲器（晶体管Q 5的基极）的输入部分与多个相位补偿电路相连，每个相位补偿电路均包括串联连接的电阻器和电容器。在正电源线和形成相位补偿电路的电容的电容器（C 2）之间插入双极晶体管（Q6）。通过接通/关断双极晶体管（Q 6），相位补偿电路的电容值和电阻值被切换。由于双极晶体管（Q 6）插在电容器（C 2）和正电源线之间，所以作为开关信号的基极电流（Isw）不影响放大器单元。

15. 发明授权

US06924540B2 Integrated circuit device installed structure and installation method 有权
标题翻译：集成电路装置安装结构及安装方法
公开(公告)号：US06924540B2
公开(公告)日：2005-08-02
申请号：US10388617
申请日：2003-03-17
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： G11B7/13 , G11B7/24 , H01L21/50 , H01L21/56 , H01L23/02 , H01L23/28 , H01L23/50 , H01L27/14 , H01L31/02 , H01L31/0203 , H01L47/00
CPC分类号： G11B7/13 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。具有光检测部分的集成电路器件，引线和用于连接的引线被封装在封装部分中。在光检测部分上方的封装部分的光入射表面上形成凹部，以使光检测部分的表面上的封装部分变薄，从而降低由封装部分吸收的光的能量。

16. 发明申请

US20050151217A1 Integrated circuit device packaging structure and packaging method 有权
标题翻译：集成电路器件封装结构及封装方法
公开(公告)号：US20050151217A1
公开(公告)日：2005-07-14
申请号：US11073724
申请日：2005-03-08
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： H01L31/02 , G11B7/24 , G11B7/26 , H01L21/00 , H01L23/02 , H01L23/28 , H01L25/16 , H01L27/14 , H01L27/15 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/12 , H01L33/00
CPC分类号： H01L31/0203 , G11B7/13 , H01L25/167 , H01L31/02325 , H01L2224/16 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。引线安装基板被放置在具有光检测部分的集成电路装置的光接收表面的一侧。引线通过电极与集成电路器件电连接。集成电路器件和衬底用封装部分封装。基板在光检测部分上方的位置具有开口。

17. 发明申请

US20090086449A1 OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20090086449A1
公开(公告)日：2009-04-02
申请号：US12184495
申请日：2008-08-01
申请人： Masanori MINAMIO , Masaki Taniguchi , Hiroyuki Ishida , Noriyuki Yoshikawa
发明人： Masanori MINAMIO , Masaki Taniguchi , Hiroyuki Ishida , Noriyuki Yoshikawa
IPC分类号： H05K7/00 , B29D11/00
CPC分类号： H01L33/60 , H01L24/73 , H01L24/97 , H01L27/14618 , H01L31/0203 , H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/12041 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
摘要： An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. The recess has a two-level structure of a bottom recess and a portion located over the bottom recess. A stepped portion extends from an upper end of a first side surface of the bottom recess to a lower end of a second side surface of the bottom recess.
摘要翻译：安装在布线板上的光学元件由光学功能区域以外的密封树脂密封。将布线板与光学元件连接的电线也由密封树脂密封。光学功能区域作为其侧表面由密封树脂形成的凹部的底表面露出。凹部具有底部凹部和位于底部凹部上方的部分的两层结构。阶梯部从底凹部的第一侧面的上端延伸到底部凹部的第二侧面的下端。

18. 发明授权

US07365302B2 Output impedance varying circuit 有权
标题翻译：输出阻抗变化电路
公开(公告)号：US07365302B2
公开(公告)日：2008-04-29
申请号：US11329029
申请日：2006-01-11
申请人： Hiroshi Yamaguchi , Masaki Taniguchi
发明人： Hiroshi Yamaguchi , Masaki Taniguchi
IPC分类号： G01J1/44
CPC分类号： H03F3/3069 , H03F1/08 , H03F1/56 , H03F3/08 , H03F3/087 , H03F3/343
摘要： A photo detector IC (PDIC) is connected with a flexible printed circuit board (FPC). A signal converted into a voltage through light-to-voltage conversion in the PDIC is connected with the drain of a field effect transistor (FET), while the source of the FET is connected to an output terminal. A signal from the output terminal is input into a signal processing board of the main body via the FPC serving as an equivalent circuit composed of a coil and a capacitor. The gate of the FET is connected with a variable voltage source. Peaking occurs due to inductor components and capacitance components of the FPC. However, by application of voltage to the variable voltage source, the gate voltage value of the FET is adjusted to be an optimal value, whereby the peaking is suppressed by the on-resistance of the FET.
摘要翻译：光电检测器IC（PDIC）与柔性印刷电路板（FPC）连接。在PDIC中通过光电压转换成电压的信号与场效应晶体管（FET）的漏极连接，而FET的源极连接到输出端子。来自输出端子的信号经由作为由线圈和电容器组成的等效电路的FPC输入到主体的信号处理板。 FET的栅极与可变电压源连接。由于FPC的电感器元件和电容元件引起峰化。然而，通过向可变电压源施加电压，将FET的栅极电压值调整为最佳值，由此通过FET的导通电阻来抑制峰值。

19. 发明授权

US07250664B2 Integrated circuit device packaging structure and packaging method 有权
标题翻译：集成电路器件封装结构及封装方法
公开(公告)号：US07250664B2
公开(公告)日：2007-07-31
申请号：US11073724
申请日：2005-03-08
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： H01L31/00
CPC分类号： H01L31/0203 , G11B7/13 , H01L25/167 , H01L31/02325 , H01L2224/16 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。引线安装基板被放置在具有光检测部分的集成电路装置的光接收表面的一侧。引线通过电极与集成电路器件电连接。集成电路器件和衬底用封装部分封装。基板在光检测部分上方的位置具有开口。

20. 发明申请

US20050147011A1 Optical integrated device 审中-公开
标题翻译：光学集成设备
公开(公告)号：US20050147011A1
公开(公告)日：2005-07-07
申请号：US11022816
申请日：2004-12-28
申请人： Shinya Esaki , Masaki Taniguchi
发明人： Shinya Esaki , Masaki Taniguchi
IPC分类号： G11B7/13 , G11B7/00 , G11B7/125 , G11B19/06 , H01S5/026
CPC分类号： G11B19/06
摘要： An optical integrated device includes a light source, a light-receiving element, a signal processing section, and a sleep control circuit. The light source irradiates a light beam onto an optical recording medium. The light-receiving element receives a reflected light of the light beam from the optical recording medium and outputs an electrical signal according to the reflected light. The signal processing section performs predetermined processing on the electrical signal outputted from the light-receiving element. The sleep control circuit is connected to a terminal which outputs a signal indicating the operation voltage of the light source, and controls whether to put the signal processing section in an operation state or a low power consumption state based on the voltage at the terminal.
摘要翻译：光学集成装置包括光源，光接收元件，信号处理部分和睡眠控制电路。光源将光束照射到光记录介质上。光接收元件从光记录介质接收光束的反射光，并根据反射光输出电信号。信号处理部对从光接收元件输出的电信号进行预定处理。睡眠控制电路连接到输出指示光源的操作电压的信号的端子，并且基于端子处的电压来控制是否将信号处理部分置于操作状态或低功耗状态。

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