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    • 13. 发明授权
    • Document sheet feeding apparatus
    • 文件进纸装置
    • US06213458B1
    • 2001-04-10
    • US09092173
    • 1998-06-05
    • Hitoshi TamuraHirohiko OkabeMinoru KawanoKatsunori Takahashi
    • Hitoshi TamuraHirohiko OkabeMinoru KawanoKatsunori Takahashi
    • B65H500
    • B65H9/006B65H3/0669B65H2403/40B65H2403/72B65H2403/942B65H2404/7231B65H2513/40B65H2220/02
    • A sheet feeding apparatus for picking up, aligning, and feeding single sheets from a stack of a plurality of such sheets. The apparatus includes a driving means for the pick up, separator, and sheet feeder having a driving motor with a coupling in the drive path which is capable of providing a delay period between forward and backward rotations of the motor. There is a torque regulator between the coupling and a reverse roller which interrupts the driving force for a predetermined time. The apparatus also includes a control which stops the registration rollers while the single sheet collides with the circumferential surfaces thereof for alignment and, upon reversal of the driving motor, the sheet is fed while the reverse roller first stops for the predetermined time and then rotates in a direction opposite to the direction of feeding. Thus, the single sheets are aligned and double feeding is prevented.
    • 一种纸张馈送装置,用于从多个这样的纸张的堆叠中拾取,对准和馈送单张纸。 该装置包括用于拾取器,分离器和片材给送器的驱动装置,该驱动装置具有在驱动路径中具有联接器的驱动电机,其能够提供电动机的向前和向后转动之间的延迟周期。 在耦合器和反转辊之间存在扭矩调节器,其将驱动力中断预定时间。 该装置还包括一个控制装置,当单张纸与其圆周表面碰撞以对准时停止定位辊,并且当反转辊驱动电机反转时,反转辊首先停止预定时间然后转动 与进给方向相反的方向。 因此,单张纸对齐,并且防止双重进纸。
    • 15. 发明授权
    • Semiconductor laser device and method of fabricating semiconductor laser
device
    • 半导体激光器件及半导体激光器件的制造方法
    • US5644586A
    • 1997-07-01
    • US526561
    • 1995-09-12
    • Minoru KawanoGo Sakaino
    • Minoru KawanoGo Sakaino
    • H01S5/00H01S5/02H01S5/40H01S3/18
    • H01S5/4043H01S5/02268H01L2224/48463H01L2224/73265H01S5/0207H01S5/02272H01S5/0425H01S5/4018
    • In a semiconductor laser device including a stack of semiconductor laser chips, each semiconductor laser chip includes opposite upper and lower surfaces, an upper electrode disposed on a portion of the upper surface, and a lower electrode disposed on a portion of the lower surface. Two adjacent semiconductor laser chips in the stack are connected such that the lower electrode of an upper laser chip is bonded to the upper electrode of a lower laser chip with solder. Since the upper electrode (lower electrode) is disposed on a portion of the upper surface (lower surface) of each laser chip, i.e., it is not disposed over the entire upper surface (lower surface) of the laser chip, the solder hardly flows over the side surface of the laser chip, so that unwanted short-circuiting between the upper electrode and the lower electrode of the laser chip is avoided. In addition, when solder is molten between two electrodes, the molten solder spreads over the surfaces of the electrodes, and the surface tension of the molten solder draws the electrodes to each other so that the electrodes are automatically aligned with each other. Therefore, in this stacked laser device, since the surface tension of the molten solder functions between the upper electrode and the lower electrode of the adjacent laser chips, automatic alignment is performed between these laser chips.
    • 在包括半导体激光器芯片堆叠的半导体激光器件中,每个半导体激光器芯片包括相对的上表面和下表面,设置在上表面的一部分上的上电极和设置在下表面的一部分上的下电极。 将堆叠中的两个相邻的半导体激光器芯片连接,使得上部激光器芯片的下部电极与焊料接合到下部激光器芯片的上部电极。 由于上电极(下电极)配置在激光芯片的上表面(下表面)的一部分上,即不设置在激光芯片的整个上表面(下表面)上,所以焊料几乎不流动 在激光芯片的侧表面上,从而避免了激光芯片的上电极和下电极之间的不希望的短路。 此外,当焊料在两个电极之间熔融时,熔融的焊料扩散在电极的表面上,并且熔融焊料的表面张力将电极彼此吸引,使得电极彼此自动对准。 因此,在该堆叠式激光装置中,由于熔融焊料的表面张力在相邻的激光芯片的上部电极和下部电极之间起作用,因此在这些激光芯片之间进行自动对准。