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    • 16. 发明授权
    • Radar apparatus
    • 雷达装置
    • US07495747B2
    • 2009-02-24
    • US11325553
    • 2006-01-05
    • Takahiko YoshidaAkihiko Teshigahara
    • Takahiko YoshidaAkihiko Teshigahara
    • G01C3/08
    • G01S17/936G01S7/4813G01S2007/4977
    • In a radar apparatus, a radar device emits a transmission wave to a periphery of a vehicle and detects a reflected wave of the transmission wave through a window part. As a member for restricting or reducing adhesion of dirt and foreign materials to the window part, an air duct is provided to apply air toward the window part. An air outlet portion of the air duct is open at a periphery of the window part and has a passage area smaller than that of an air inlet portion, which opens to a vehicle forward direction. While the vehicle is running, air is blown from the air outlet portion to flow along the window part at high speed after its pressure is increased in the air duct. Thus, dirt and materials adhering or adhered to the window part is effectively blown off.
    • 在雷达装置中,雷达装置向车辆周边发射发送波,并通过窗口部分检测发射波的反射波。 作为用于限制或减少灰尘和异物粘附到窗户部分的构件,设置有空气导管以向窗户部分施加空气。 风道的出风部在窗部的周围开口,并且具有比通向车辆前方的空气入口部小的通路面积。 当车辆行驶时,空气从空气出口部分吹出,在空气管道中的压力增加之后,高速地沿窗户部分流动。 因此,粘附或粘附到窗户部分上的污物和材料被有效地吹走。
    • 18. 发明申请
    • Surface acoustic wave pressure sensor
    • 表面声波压力传感器
    • US20100186514A1
    • 2010-07-29
    • US12656209
    • 2010-01-21
    • Akihiko TeshigaharaHideaki Yamada
    • Akihiko TeshigaharaHideaki Yamada
    • G01L11/04
    • G01L9/0025G01L9/008
    • A sensor chip has a substrate and a comb-teeth electrode arranged on the substrate. The sensor chip is fixed to a diaphragm structure to be distorted by receiving pressure, and is fixed to the diaphragm structure only through a predetermined fix area so as to detect the pressure. The fix area is defined on only a part of the sensor chip opposing to the diaphragm structure. The sensor chip is restrained by the diaphragm structure in a direction of transmitting surface acoustic wave. Flexibility of the sensor chip in a perpendicular direction approximately perpendicular to the wave transmitting direction is larger than that in the transmitting direction.
    • 传感器芯片具有布置在基板上的基板和梳齿电极。 传感器芯片固定在膜片结构上,通过接受压力而变形,并且仅通过预定的固定区域固定到膜片结构,以便检测压力。 固定区仅限于与隔膜结构相对的传感器芯片的一部分。 传感器芯片在传播表面声波的方向上被隔膜结构约束。 传感器芯片在大致垂直于波浪传播方向的垂直方向上的灵活性大于传送方向的灵敏度。
    • 19. 发明授权
    • Surface acoustic wave pressure sensor
    • 表面声波压力传感器
    • US08006563B2
    • 2011-08-30
    • US12656209
    • 2010-01-21
    • Akihiko TeshigaharaHideaki Yamada
    • Akihiko TeshigaharaHideaki Yamada
    • G01L11/04
    • G01L9/0025G01L9/008
    • A sensor chip has a substrate and a comb-teeth electrode arranged on the substrate. The sensor chip is fixed to a diaphragm structure to be distorted by receiving pressure, and is fixed to the diaphragm structure only through a predetermined fix area so as to detect the pressure. The fix area is defined on only a part of the sensor chip opposing to the diaphragm structure. The sensor chip is restrained by the diaphragm structure in a direction of transmitting surface acoustic wave. Flexibility of the sensor chip in a perpendicular direction approximately perpendicular to the wave transmitting direction is larger than that in the transmitting direction.
    • 传感器芯片具有布置在基板上的基板和梳齿电极。 传感器芯片固定在膜片结构上,通过接受压力而变形,仅通过预定的固定区域固定在膜片结构上,以便检测压力。 固定区仅限于与隔膜结构相对的传感器芯片的一部分。 传感器芯片在传播表面声波的方向上被隔膜结构约束。 传感器芯片在大致垂直于波浪传播方向的垂直方向上的灵活性大于传送方向的灵敏度。