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11. 发明授权

US5127196A Apparatus for planarizing a dielectric formed over a semiconductor substrate 失效
标题翻译：用于平坦化在半导体衬底上形成的电介质的装置
公开(公告)号：US5127196A
公开(公告)日：1992-07-07
申请号：US658019
申请日：1991-02-20
申请人： Seiichi Morimoto , Robert J. Patterson
发明人： Seiichi Morimoto , Robert J. Patterson
IPC分类号： B24B37/10 , B24B49/14 , B24B55/02 , H01L21/3105 , H01L21/768
CPC分类号： B24B37/107 , B24B49/14 , B24B55/02 , H01L21/31053 , H01L21/76819
摘要： An improved method for planarizing the surface of an dielectric deposited over a semiconductor substrate. The substrate is pressed face down against a table which has been coated with an abrasive material. In this way, the upper surface of the interlayer dielectric contacts the abrasive. Rotational movement of the wafer relative to the table facilitates removal of the protruding portions of the interlayer dielectric by the abrasive. Post-planarization step height variation is minimized by simultaneously cooling the table and the abrasive material during the abrasive or polishing process. By maintaining the table and the abrasive at about 10 degrees Celcius the step height variation is reduced by a factor of 2 over that normally realized in the prior art.
摘要翻译：一种用于平坦化沉积在半导体衬底上的电介质的表面的改进方法。将基板面朝下压靠在已经涂覆有磨料的工作台上。以这种方式，层间电介质的上表面接触磨料。晶片相对于工作台的旋转运动有助于通过磨料去除层间电介质的突出部分。通过在研磨或抛光过程中同时冷却工作台和研磨材料，使平面后台阶高度变化最小化。通过将台面和磨料保持在大约10摄氏度，台阶高度变化比现有技术中通常实现的要高2倍。

12. 发明授权

US4721548A Semiconductor planarization process 失效
标题翻译：半导体平面化工艺
公开(公告)号：US4721548A
公开(公告)日：1988-01-26
申请号：US49100
申请日：1987-05-13
申请人： Seiichi Morimoto
发明人： Seiichi Morimoto
IPC分类号： H01L21/3205 , H01L21/3105 , H01L21/311 , H01L21/768 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01L21/31111 , H01L21/31055
摘要： Planarization process for planarizing glass layer which receives first layer metal. Spin-on-glass is cured in steam and then etched back using hydrofluoric and nitric acids diluted in acetic acids.
摘要翻译：平面化接收第一层金属的玻璃层平面化处理。旋转玻璃在蒸汽中固化，然后用在乙酸中稀释的氢氟酸和硝酸进行回蚀。

13. 发明授权

US07405419B2 Unidirectionally conductive materials for interconnection 有权
标题翻译：用于互连的单向导电材料
公开(公告)号：US07405419B2
公开(公告)日：2008-07-29
申请号：US11321127
申请日：2005-12-28
申请人： Reza M. Golzarian , Robert P. Meagley , Seiichi Morimoto , Mansour Moinpour
发明人： Reza M. Golzarian , Robert P. Meagley , Seiichi Morimoto , Mansour Moinpour
IPC分类号： H01L47/00 , H01L23/52
CPC分类号： H01L21/76843 , H01L21/76849 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as by lining the walls and base of a trench and via. The unidirectional conductive material may be configured to conduct electricity in a direction corresponding to a projection to or from a contact point and conductive material overlying the unidirectional conductive material, but have no substantial electrical conductivity in other directions. Moreover, the unidirectional conductive material may be electrically conductive in a direction normal to a surface over which it is formed or in directions along or across a plane, but have no substantial electrical conductivity in other directions. Finally, the unidirectional conductive material may have properties tending to reduce metal diffusion, reduce electron migration, provide adhesion or bonding, and/or act as an etch stop.
摘要翻译：描述了一种形成方法和包括具有单向导电材料的互连结构的器件。单向导电材料可以覆盖互连材料，和/或可以围绕互连材料，例如通过衬套沟槽和通孔的壁和底座。单向导电材料可以被配置为在对应于与接触点的突出物相对应的方向上导电，并且覆盖在单向导电材料上方的导电材料，但是在其它方向上没有实质的导电性。此外，单向导电材料可以在垂直于其形成的表面的方向或沿着或跨平面的方向上导电，但在其它方向上不具有实质的导电性。最后，单向导电材料可能具有倾向于减少金属扩散，减少电子迁移，提供粘附或粘结和/或用作蚀刻停止的性质。

14. 发明申请

US20050070096A1 Unidirectionally conductive materials for interconnection 失效
标题翻译：用于互连的单向导电材料
公开(公告)号：US20050070096A1
公开(公告)日：2005-03-31
申请号：US10676294
申请日：2003-09-30
申请人： Reza Golzarian , Robert Meagley , Seiichi Morimoto , Mansour Moinpour
发明人： Reza Golzarian , Robert Meagley , Seiichi Morimoto , Mansour Moinpour
IPC分类号： H01L21/44 , H01L21/4763 , H01L21/768 , H01L23/532
CPC分类号： H01L21/76843 , H01L21/76849 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as by lining the walls and base of a trench and via. The unidirectional conductive material may be configured to conduct electricity in a direction corresponding to a projection to or from a contact point and conductive material overlying the unidirectional conductive material, but have no substantial electrical conductivity in other directions. Moreover, the unidirectional conductive material may be electrically conductive in a direction normal to a surface over which it is formed or in directions along or across a plane, but have no substantial electrical conductivity in other directions. Finally, the unidirectional conductive material may have properties tending to reduce metal diffusion, reduce electron migration, provide adhesion or bonding, and/or act as an etch stop.
摘要翻译：描述了一种形成方法和包括具有单向导电材料的互连结构的器件。单向导电材料可以覆盖互连材料，和/或可以围绕互连材料，例如通过衬套沟槽和通孔的壁和底座。单向导电材料可以被配置为在对应于与接触点的突出物相对应的方向上导电，并且覆盖在单向导电材料上方的导电材料，但是在其它方向上没有实质的导电性。此外，单向导电材料可以在垂直于其形成的表面的方向或沿着或跨平面的方向上导电，但在其它方向上不具有实质的导电性。最后，单向导电材料可能具有倾向于减少金属扩散，减少电子迁移，提供粘附或粘结和/或用作蚀刻停止的性质。

15. 发明授权

US5198732A Rotation control system for ultrasonic motor 失效
标题翻译：超声波电机旋转控制系统
公开(公告)号：US5198732A
公开(公告)日：1993-03-30
申请号：US750453
申请日：1991-08-27
申请人： Seiichi Morimoto
发明人： Seiichi Morimoto
IPC分类号： H01L41/04 , H02N2/14 , H02N2/16
CPC分类号： H02N2/14 , H02N2/142
摘要： A control system for a progressive wave type ultrasonic motor including an ultrasonic motor driver circuit which supplies driving electric power to an ultrasonic motor and a rotary encoder which is coupled with an output shaft of the ultrasonic motor and generates a pulse signal in accordance with rotation of the ultrasonic motor, comprising a reference clock signal generator which generates a clock signal and a phase locked loop circuit which transmits a control signal to an ultrasonic motor driver circuit based on the clock signal and the pulse signal from the rotary encoder, and controlling the speed of the ultrasonic motor; and a control apparatus, comprising a driving control means which transmits a driving signal to an ultrasonic motor driver in accordance with a command pulse instructing to start driving of the ultrasonic motor and transmits a suspension signal to the ultrasonic motor driver in accordance with the pulse signal from the rotary encoder, and driving the ultrasonic motor intermittently. In addition, an automatic frequency stabilizing circuit which may be used by combining with these control apparatus. More stabilized speed control and positioning control of an ultrasonic motor become possible.
摘要翻译：一种用于逐行波型超声波马达的控制系统，包括向超声波马达提供驱动电力的超声波马达驱动电路和与超声波马达的输出轴相连接的旋转编码器，并根据该超声波马达包括产生时钟信号的参考时钟信号发生器和基于时钟信号和来自旋转编码器的脉冲信号将控制信号发送到超声波马达驱动电路的锁相环电路，并控制速度的超声波马达; 以及控制装置，包括驱动控制装置，其根据指示开始驱动超声波马达的指令脉冲将驱动信号发送到超声波马达驱动器，并根据脉冲信号向超声波马达驱动器发送暂停信号并且间歇地驱动超声波马达。另外，可以与这些控制装置组合使用的自动频率稳定电路。可以实现超声波马达的更稳定的速度控制和定位控制。

16. 发明授权

US5104828A Method of planarizing a dielectric formed over a semiconductor substrate 失效
标题翻译：在半导体衬底上形成电介质的方法
公开(公告)号：US5104828A
公开(公告)日：1992-04-14
申请号：US487418
申请日：1990-03-01
申请人： Seiichi Morimoto , Robert J. Patterson
发明人： Seiichi Morimoto , Robert J. Patterson
IPC分类号： H01L21/304 , B24B37/10 , B24B49/14 , B24B55/02 , H01L21/3105 , H01L21/768
CPC分类号： B24B37/107 , B24B49/14 , B24B55/02 , H01L21/31053 , H01L21/76819 , Y10S148/017 , Y10S438/959
摘要： An improved method for planarizing the surface of an dielectric deposited over a semiconductor substrate. The substrate is pressed face down against a table which has been coated with an abrasive material. In this way, the upper surface of the interlayer dielectric contacts the abrasive. Rotational movement of the wafer relative to the table facilitates removal of the protruding portions of the interlayer dielectric by the abrasive. Post-planarization step height variation is minimized by simultaneously cooling the table and the abrasive material during the abrasive or polishing process. By maintaining the table and the abrasive at about 10 degrees Celsius the step height variation is reduced by a factor of 2 over that normally realized in the prior art.
摘要翻译：一种用于平坦化沉积在半导体衬底上的电介质的表面的改进方法。将基板面朝下压靠在已经涂覆有磨料的工作台上。以这种方式，层间电介质的上表面接触磨料。晶片相对于工作台的旋转运动有助于通过磨料去除层间电介质的突出部分。通过在研磨或抛光过程中同时冷却工作台和研磨材料，使平面后台阶高度变化最小化。通过将工作台和磨料保持在约10摄氏度，台阶高度变化比现有技术中通常实现的要高2倍。

17. 发明授权

US4948670A Vinyl chloride resin composition for coating electric wires 失效
标题翻译：用于涂覆电线的氯乙烯树脂组合物
公开(公告)号：US4948670A
公开(公告)日：1990-08-14
申请号：US332434
申请日：1989-03-31
申请人： Seiichi Morimoto , Kazuyuki Shiji , Hisahiro Kusu
发明人： Seiichi Morimoto , Kazuyuki Shiji , Hisahiro Kusu
IPC分类号： C08K5/12 , H01B3/44
CPC分类号： H01B3/443 , C08K5/12 , Y10T428/294 , Y10T428/2967
摘要： A vinyl chloride resin composition for coating electric wires, which comprises 100 parts by weight of a vinyl chloride resin and from 10 to 200 parts by weight of an alkyl biphenyltetracarboxylate.
摘要翻译：一种用于涂覆电线的氯乙烯树脂组合物，其包含100重量份的氯乙烯树脂和10至200重量份的联苯四羧酸烷基酯。

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