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    • 16. 发明申请
    • Fuel supply device
    • 燃油供应装置
    • US20060169251A1
    • 2006-08-03
    • US11329106
    • 2006-01-11
    • Katsumi MoriAkihiro Kuroda
    • Katsumi MoriAkihiro Kuroda
    • F02M57/02
    • F02M37/22F02M37/0047F02M59/34F02M63/0225F02M2037/226
    • A fuel filter is located downstream of a feed pump to filter fuel discharged from the feed pump. An orifice is located between the fuel filter and a suction quantity control valve to restrict a flow rate of the fuel passing through the fuel filter. A positive pressure of the feed pump is applied to the fuel filter, and a passing pressure at the fuel filter increases. Even if viscosity of the fuel increases and the fuel becomes wax-like at low temperature, clogging of the fuel filter or an insufficient flow rate can be inhibited. The orifice restricts the flow rate of the fuel passing through the fuel filter. Accordingly, an increase in size of the fuel filter can be prevented even if the fuel filter is located downstream of the feed pump.
    • 燃料过滤器位于进料泵的下游,以过滤从进料泵排出的燃料。 在燃料过滤器和抽吸量控制阀之间设有孔口,以限制通过燃料过滤器的燃料的流量。 供给泵的正压被施加到燃料过滤器,并且燃料过滤器上的通过压力增加。 即使燃料的粘度升高,燃料在低温下变为蜡状,也能够抑制燃料过滤器的堵塞或流量不足。 孔口限制通过燃料过滤器的燃料的流量。 因此,即使燃料过滤器位于供给泵的下游,也能够防止燃料过滤器的尺寸增大。
    • 17. 发明授权
    • Methods for manufacturing semiconductor devices
    • 制造半导体器件的方法
    • US06417083B1
    • 2002-07-09
    • US09438164
    • 1999-11-11
    • Katsumi Mori
    • Katsumi Mori
    • H01L213205
    • H01L21/31138H01L21/28123H01L21/32136H01L21/32139
    • Certain embodiments provide a manufacturing method for a semiconductor device, in which an organic antireflection film can be etched while a resist layer maintains dimensions thereof. The method includes forming an oxide layer 24 on a p-type silicon substrate 10, and forming a polysilicon layer 26 on the oxide layer 24. An organic antireflection film 30 is formed on the polysilicon layer 26, and a resist layer R having a predetermined pattern is formed on a surface of the organic antireflection film 30. The method as includes etching the organic antireflection film 30 by using the resist layer R, in which an etching gas includes at least one of an oxygen-based gas and a chlorine-based gas, and forming a gate electrode by etching the polysilicon layer 26 with a predetermined pattern.
    • 某些实施例提供了半导体器件的制造方法,其中可以在抗蚀剂层保持其尺寸的同时蚀刻有机抗反射膜。 该方法包括在p型硅衬底10上形成氧化物层24,并在氧化物层24上形成多晶硅层26.在多晶硅层26上形成有机抗反射膜30,并且具有预定的 图案形成在有机抗反射膜30的表面上。包括通过使用抗蚀剂层R蚀刻有机抗反射膜30的方法,其中蚀刻气体包括氧基气体和氯系气体中的至少一种 气体,并通过以预定图案蚀刻多晶硅层26形成栅电极。