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11. 发明申请

US20060055843A1 LCD Backlight unit and LCD having the same 有权
标题翻译： LCD背光单元和LCD具有相同的功能
公开(公告)号：US20060055843A1
公开(公告)日：2006-03-16
申请号：US10997895
申请日：2004-11-29
申请人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
发明人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
IPC分类号： G02F1/1335
CPC分类号： G02B6/0028 , G02B5/021 , G02B5/0284 , G02B6/0018 , G02B6/003 , G02B6/0038 , G02B6/0068 , G02B6/0073
摘要： The invention relates to an LCD backlight apparatus, which includes a light guide plate placed under an LCD panel of the LCD to guide light to the LCD panel. The light guide plate has an even upper surface and a scattering pattern formed in a bottom surface. A plurality of monochromatic light sources are placed in line at a side of the light guide plate to radiate light along the plane direction of the light guide plate between the upper and bottom surfaces of the light guide plate. The light sources are adapted to radiate light beams in a predetermined beam angle so that the light beams reach the scattering pattern only after having propagated a predetermined reference length necessary for forming white light when mixed together. The LCD backlight apparatus can reduce the Bezel width without increasing the thickness of an LCD.
摘要翻译：本发明涉及一种LCD背光装置，其中包括一个导光板，该导光板放置在LCD的LCD面板的下方，以将光引向LCD面板。导光板具有均匀的上表面和形成在底面中的散射图案。多个单色光源在导光板的一侧成直线放置，以在导光板的上表面和底表面之间沿着导光板的平面方向辐射光。光源适于以预定的光束角度辐射光束，使得光束仅在已经传播了当混合在一起形成白光所需的预定参考长度之后才到达散射图案。 LCD背光装置可以在不增加LCD的厚度的情况下减少边框宽度。

12. 发明申请

US20050265042A1 Vertical light emitting type backlight module 失效
标题翻译：垂直发光型背光模组
公开(公告)号：US20050265042A1
公开(公告)日：2005-12-01
申请号：US10917383
申请日：2004-08-13
申请人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
IPC分类号： F21K99/00 , F21V7/04 , G02F1/13357
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.
摘要翻译：本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板在水平方向读取，以将光线的路径改变为垂直方向。

13. 发明申请

US20070045644A1 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US20070045644A1
公开(公告)日：2007-03-01
申请号：US11491947
申请日：2006-07-25
申请人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
发明人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

14. 发明申请

US20070012939A1 Flip chip light emitting diode and method of manufacturing the same 审中-公开
标题翻译：倒装芯片发光二极管及其制造方法
公开(公告)号：US20070012939A1
公开(公告)日：2007-01-18
申请号：US11412984
申请日：2006-04-28
申请人： Seok Hwang , Je Kim , Young Park , Kun Ko , Jee Kim , Jung Park , Bok Min
发明人： Seok Hwang , Je Kim , Young Park , Kun Ko , Jee Kim , Jung Park , Bok Min
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/08 , H01L33/32 , H01L33/38 , H01L2933/0016
摘要： The present invention relates to a flip chip light emitting diode, in which the flow of current concentrated on a portion adjacent to an n-type electrode can be induced into the center of a light emitting section and a current-spreading effect is accordingly enhanced, thereby increasing light emission efficiency of a light emitting diode chip, and a method of manufacturing the same. The method of manufacturing a flip chip light emitting diode includes sequentially forming an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer on an optically-transparent substrate; etching predetermined regions of the active layer and p-type nitride semiconductor layer and exposing a plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of mesas; etching predetermined regions of the active layer and p-type nitride semiconductor layer positioned between the formed mesas and exposing the plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of grooves; forming an insulating layer on the surface of the groove; forming a p-type electrode across the insulating layer formed on the upper portion of the p-type nitride semiconductor layer and the surface of the groove; and forming an n-type electrode on the formed mesa.
摘要翻译：倒装芯片发光二极管技术领域本发明涉及一种倒装芯片发光二极管，其中集中在与n型电极相邻的部分上的电流可以被感应到发光部分的中心，从而相应地提高了电流扩展效果，从而提高发光二极管芯片的发光效率及其制造方法。制造倒装芯片发光二极管的方法包括在光学透明基板上依次形成n型氮化物半导体层，有源层和p型氮化物半导体层; 蚀刻有源层和p型氮化物半导体层的预定区域，并露出n型氮化物半导体层的多个区域以形成多个台面; 蚀刻位于形成的台面之间的有源层和p型氮化物半导体层的预定区域，并暴露出n型氮化物半导体层的多个区域以形成多个沟槽; 在所述槽的表面上形成绝缘层; 在形成在p型氮化物半导体层的上部和沟槽的表面上的绝缘层上形成p型电极; 并在形成的台面上形成n型电极。

15. 发明申请

US20060187651A1 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US20060187651A1
公开(公告)日：2006-08-24
申请号：US11136529
申请日：2005-05-25
申请人： Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Young Park , Hun Hahm , Bum Kim
发明人： Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Young Park , Hun Hahm , Bum Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.
摘要翻译：直接照明背光装置使用LED作为光源。该背光装置包括：平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案，布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体，并且布置在散射图案周围以将从下方入射的光引入透明板，使得光被透明板内部反射。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。这可以去除透明板中的LED光源上方的任何暗区，从而减小直射照明背光装置的厚度。

16. 发明申请

US20060171151A1 Side-emission typy LED package 有权
标题翻译：侧排型式LED封装
公开(公告)号：US20060171151A1
公开(公告)日：2006-08-03
申请号：US11318837
申请日：2005-12-28
申请人： Young Park , Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Hun Hahm , Bum Kim
发明人： Young Park , Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Hun Hahm , Bum Kim
IPC分类号： F21V5/00
CPC分类号： H01L33/60 , F21K9/68 , H01L33/54
摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
摘要翻译：提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。下部结构具有下反射镜和透明密封构件。下部结构支持LED芯片。下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。透明密封件形成在下反射镜内部的LED芯片周围。上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

17. 发明申请

US20060146530A1 Led backlight apparatus 审中-公开
标题翻译： LED背光装置
公开(公告)号：US20060146530A1
公开(公告)日：2006-07-06
申请号：US11134430
申请日：2005-05-23
申请人： Jung Park , Hun Hahm , Ho Ahn , Bum Kim , Young Park , Hyung Kim , Young Jeong
发明人： Jung Park , Hun Hahm , Ho Ahn , Bum Kim , Young Park , Hyung Kim , Young Jeong
IPC分类号： F21V7/00
CPC分类号： G02F1/133603 , G02F1/133605
摘要： This invention relates to an LED backlight apparatus. The LED backlight apparatus comprises: a housing having an upper opening; a reflective sheet provided on a bottom inside the housing; a plurality of LED light sources arranged above the reflective sheet at a predetermined distance to emit light toward the reflective sheet; and a light source support connected to a side wall of the housing to support the LED light sources. The light sources are arranged opposite to the reflective sheet so that light beams emitted from the LED light sources reflect from the reflective sheet before entering a diffuser plate behind the LED light sources from the reflective sheet, thereby potentially reducing the thickness of the backlight apparatus while ensuring a distance for the light beams to sufficiently mix together before entering the differ plate.
摘要翻译：本发明涉及一种LED背光装置。 LED背光装置包括：具有上开口的壳体; 设置在所述壳体内的底部的反射片; 多个LED光源，以预定距离布置在反射片上方，以向反射片发射光; 以及连接到壳体的侧壁以支撑LED光源的光源支撑件。光源与反射片相对布置，使得从LED光源发射的光束从反射片反射到反射片之后，从LED反射片进入漫射板后面，从而潜在地减小背光装置的厚度，同时确保在进入不同板之前使光束充分混合在一起的距离。

18. 发明申请

US20060083021A1 Large size backlight apparatus reduced in thickness 失效
标题翻译：大尺寸背光设备厚度减小
公开(公告)号：US20060083021A1
公开(公告)日：2006-04-20
申请号：US11060286
申请日：2005-02-18
申请人： Young Jeong , Hyung Kim , Jung Park , Ho Ahn , Young Park , Bum Kim , Hun Hahm
发明人： Young Jeong , Hyung Kim , Jung Park , Ho Ahn , Young Park , Bum Kim , Hun Hahm
IPC分类号： F21V7/04
CPC分类号： G02B6/0021 , G02B6/0036 , G02B6/0055 , G02B6/0061 , G02B6/0068 , G02B6/0076
摘要： The present invention relates to a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources as a problem of a conventional large-sized backlight apparatus, thereby enhancing the overall uniformity of light. In this way, the backlight apparatus of the invention can be designed thin even when applied to a large-sized LCD.
摘要翻译：本发明涉及一种在LCD中使用的背光装置，其中上反射板和下反射板分别安装在上透明板和下透明板之下。下透明板和下反射板在向上方向引入由下光源产生的光，并且上透明板和上反射板将由上光源产生的光引入那些未被下光源照射的区域。这可以防止在较低光源之上形成暗区域作为常规大型背光装置的问题，从而增强光的整体均匀性。以这种方式，即使应用于大型LCD也能够将本发明的背光装置设计得很薄。

19. 发明申请

US20050280014A1 Light emitting diode and fabrication method thereof 失效
标题翻译：发光二极管及其制造方法
公开(公告)号：US20050280014A1
公开(公告)日：2005-12-22
申请号：US10954144
申请日：2004-09-30
申请人： Jung Park , Young Park
发明人： Jung Park , Young Park
IPC分类号： H01L29/22 , H01L29/24 , H01L33/48 , H01L33/54 , H01L33/58
CPC分类号： H01L33/58 , H01L33/483 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： An LED package in which an LED chip a body has a cup part housing an LED chip. The cup part has a step formed in the outer circumference of the top thereof. A lens is mounted on the cup part, and has a flange extended downward from the outer circumference of the lens along the outside wall of the cup part to form a gap between the flange and the downward step of the cup part and to seal the gap from the outside. Resin material fills a space formed between the underside of the lens and the cup part and at least partially the gap formed between the step of the cup part and the lens flange. The resin material is prevented from leaking out of the LED package. The LED package of the invention prevents the creation of voids in the resin material surrounding the LED chip or the leakage of the resin material to the outside.
摘要翻译：一种LED封装，其中LED芯片的主体具有容纳LED芯片的杯部分。杯部具有在其顶部的外周形成的台阶。透镜安装在杯部上，并且具有从透镜的外周沿杯部的外壁向下延伸的凸缘，以在凸缘与杯部的向下台阶之间形成间隙，并且密封间隙从外部。树脂材料填充在透镜的下侧和杯部之间形成的空间，并且至少部分地填充形成在杯部和台阶之间的间隙。防止树脂材料泄漏出LED封装。本发明的LED封装防止在LED芯片周围的树脂材料中产生空隙或树脂材料泄漏到外部。

20. 发明申请

US20050264716A1 LED package and backlight assembly for LCD comprising the same 失效
标题翻译：用于LCD的LED封装和背光组件包括相同的
公开(公告)号：US20050264716A1
公开(公告)日：2005-12-01
申请号：US10965257
申请日：2004-10-15
申请人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
IPC分类号： G02F1/13357 , G02F1/1335 , H01L25/075 , H01L33/54 , H01L33/56 , H01L33/60
CPC分类号： H01L33/54 , G02F1/133603 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an LED package used as a light source used in a backlight assembly for an LCD, and a backlight assembly for an LCD comprising the same. The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.
摘要翻译：本发明涉及一种用作LCD背光组件中使用的光源的LED封装，以及一种用于LCD的背光组件。 LED封装包括基板，一个LED或更多的隔离指定间隔的LED或更多的布置在基板上的一行中的模制部分，以及用于密封包括LED的基板的上表面的模制部分，该模制部分设置有包括两个具有圆周形状的曲面，其中每个曲面具有用于全反射从LED发射的光的曲率。 LED封装确保了其中的足够的光学行进路线，而不需要单独的导光板，从而发出具有均匀亮度的白光。

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