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11. 发明授权

US07541662B2 Packaging chip having inductor therein 失效
标题翻译：具有电感器的封装芯片
公开(公告)号：US07541662B2
公开(公告)日：2009-06-02
申请号：US11435985
申请日：2006-05-18
申请人： Dong-ha Sim , In-sang Song , Duck-hwan Kim , Yun-kwon Park , Seok-chul Yun , Kuang-woo Nam
发明人： Dong-ha Sim , In-sang Song , Duck-hwan Kim , Yun-kwon Park , Seok-chul Yun , Kuang-woo Nam
IPC分类号： H01L29/00 , H01L23/12
CPC分类号： H01L23/10 , H01F17/0006 , H01F27/027 , H01L23/49838 , H01L23/645 , H01L2924/16152
摘要： A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.
摘要翻译：提供其中具有电感器的封装芯片。封装芯片包括用于在其中安装电路元件的基板，形成在基板的表面上的至少一个端口，分别电连接到基板上的电路元件和至少一个端口的密封部分和封装基板通过密封部分粘合到基板上并封装电路元件。在这种情况下，密封部分具有一定的电感量，因为其由导电材料形成，从而用作电感器。因此，其中具有电感器的封装芯片可以实现为小尺寸。

12. 发明授权

US07663450B2 Monolithic duplexer 有权
标题翻译：单片双工器
公开(公告)号：US07663450B2
公开(公告)日：2010-02-16
申请号：US11262889
申请日：2005-11-01
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
IPC分类号： H03H9/70
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706 , Y10T29/42 , Y10T29/43 , Y10T29/4902 , Y10T29/49155
摘要： A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.
摘要翻译：公开了一种超小型高性能单片双工器。单片双工器包括基板，形成在基板的上表面上的第一区域中的透射端滤光器，形成在基板的上表面上的第二区域中的接收端滤光器，粘合在基板上的封装基板在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域，以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

13. 发明申请

US20070018281A1 Packaging chip having inductor therein 失效
标题翻译：具有电感器的封装芯片
公开(公告)号：US20070018281A1
公开(公告)日：2007-01-25
申请号：US11435985
申请日：2006-05-18
申请人： Dong-ha Sim , In-sang Song , Duck-hwan Kim , Yun-kwon Park , Seok-chul Yun , Kuang-woo Nam
发明人： Dong-ha Sim , In-sang Song , Duck-hwan Kim , Yun-kwon Park , Seok-chul Yun , Kuang-woo Nam
IPC分类号： H01L29/00
CPC分类号： H01L23/10 , H01F17/0006 , H01F27/027 , H01L23/49838 , H01L23/645 , H01L2924/16152
摘要： A packaging chip having inductors therein. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.
摘要翻译：一种其中具有电感器的封装芯片。封装芯片包括用于在其中安装电路元件的基板，形成在基板的表面上的至少一个端口，分别电连接到基板上的电路元件和至少一个端口的密封部分和封装基板通过密封部分粘合到基板上并封装电路元件。在这种情况下，密封部分具有一定的电感量，因为其由导电材料形成，从而用作电感器。因此，其中具有电感器的封装芯片可以实现为小尺寸。

14. 发明授权

US08720023B2 Method of manufacturing a monolithic duplexer 有权
标题翻译：制造单片双工器的方法
公开(公告)号：US08720023B2
公开(公告)日：2014-05-13
申请号：US12647188
申请日：2009-12-24
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
IPC分类号： H03H9/15 , H03H3/007
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706 , Y10T29/42 , Y10T29/43 , Y10T29/4902 , Y10T29/49155
摘要： A method for fabricating subminiature, high-performance monolithic duplexer is disclosed. The method comprises depositing and patterning a lower electrode on an upper surface of an insulation layer on a substrate, so as to expose a first part of the insulation layer; depositing a piezoelectric layer on an upper surface of the exposed insulation layer and the lower electrode; depositing a metal on the upper part of the piezoelectric layer and patterning the metal to form a resonance part and a trimming inductor, wherein the lower electrode electrically couples the resonance part and the trimming inductor; fabricating air gap type FBARs (film bulk acoustic resonances) by forming a cavity by etching the substrate under the resonance part; and bonding a packaging substrate on the substrate, the packaging substrate having a phase shifting part which substantially prevents inflow of signal between the air gap type FBARs.
摘要翻译：公开了一种用于制造超小型高性能单片双工器的方法。该方法包括在基板上的绝缘层的上表面上沉积和图案化下电极，以暴露绝缘层的第一部分; 在暴露的绝缘层和下电极的上表面上沉积压电层; 在所述压电层的上部沉积金属并图案化所述金属以形成谐振部分和微调电感器，其中所述下部电极电耦合所述谐振部分和所述微调电感器; 通过在谐振部分下蚀刻衬底来形成空腔来制造气隙型FBAR（膜体声共振）; 以及将封装基板接合在所述基板上，所述封装基板具有基本上防止所述气隙型FBAR之间的信号流入的相移部。

15. 发明申请

US20060109065A1 Monolithic duplexer 有权
标题翻译：单片双工器
公开(公告)号：US20060109065A1
公开(公告)日：2006-05-25
申请号：US11262889
申请日：2005-11-01
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
IPC分类号： H03H9/70
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706 , Y10T29/42 , Y10T29/43 , Y10T29/4902 , Y10T29/49155
摘要： A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.
摘要翻译：公开了一种超小型高性能单片双工器。单片双工器包括基板，形成在基板的上表面上的第一区域中的透射端滤光器，形成在基板的上表面上的第二区域中的接收端滤光器，粘合在基板上的封装基板在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域，以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

16. 发明申请

US20060141650A1 MEMS device package and method for manufacturing the same 有权
标题翻译： MEMS器件封装及其制造方法
公开(公告)号：US20060141650A1
公开(公告)日：2006-06-29
申请号：US11270482
申请日：2005-11-10
申请人： Jong-seok Kim , Yun-kwon Park , Kuang-woo Nam , Seok-chul Yun , In-sang Song
发明人： Jong-seok Kim , Yun-kwon Park , Kuang-woo Nam , Seok-chul Yun , In-sang Song
IPC分类号： H01L21/00
CPC分类号： B81C1/00269
摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.
摘要翻译：提供了微机电系统（MEMS）装置封装及其制造方法。本发明的MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧，以提供MEMS有源器件所在的空间，以及用于MEMS有源器件的电气路径，每个内部电极焊盘，并且包括第一和第二垫彼此相对布置，其间具有间隙; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 每个所述连接部件形成在所述通孔的内表面上，以在其一端与所述内部电极焊盘接触; 以及形成在封闭基板的顶表面上的外部电极焊盘，使得外部电极焊盘与连接构件的另一端接触。

17. 发明授权

US07772026B2 MEMS device package and method for manufacturing the same 有权
标题翻译： MEMS器件封装及其制造方法
公开(公告)号：US07772026B2
公开(公告)日：2010-08-10
申请号：US11270482
申请日：2005-11-10
申请人： Jong-seok Kim , Yun-kwon Park , Kuang-woo Nam , Seok-chul Yun , In-sang Song
发明人： Jong-seok Kim , Yun-kwon Park , Kuang-woo Nam , Seok-chul Yun , In-sang Song
IPC分类号： H01L21/00 , H01L21/30 , H01L21/461
CPC分类号： B81C1/00269
摘要： A micro electro-mechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.
摘要翻译：提供了一种微机电系统（MEMS）器件封装及其制造方法。本发明的MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧，以提供MEMS有源器件所在的空间，以及用于MEMS有源器件的电气路径，每个内部电极焊盘，并且包括第一和第二垫彼此相对布置，其间具有间隙; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 每个所述连接部件形成在所述通孔的内表面上，以在其一端与所述内部电极焊盘接触; 以及形成在封闭基板的顶表面上的外部电极焊盘，使得外部电极焊盘与连接构件的另一端接触。

18. 发明授权

US08624369B2 Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
标题翻译：具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法
公开(公告)号：US08624369B2
公开(公告)日：2014-01-07
申请号：US11844084
申请日：2007-08-23
申请人： Kuang-woo Nam , Yun-kwon Park , In-sang Song , Jea-shik Shin , Seok-mo Chang , Seok-chul Yun
发明人： Kuang-woo Nam , Yun-kwon Park , In-sang Song , Jea-shik Shin , Seok-mo Chang , Seok-chul Yun
IPC分类号： H01L23/02
CPC分类号： H03H9/0547
摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.
摘要翻译：提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。因此，本发明可以减小元件尺寸并简化制造工艺。

19. 发明授权

US07535319B2 Band pass filter and duplexer having the same 有权
标题翻译：带通滤波器和双工器具有相同的功能
公开(公告)号：US07535319B2
公开(公告)日：2009-05-19
申请号：US11637768
申请日：2006-12-13
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Kuang-woo Nam
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Kuang-woo Nam
IPC分类号： H03H9/70 , H03H9/54
CPC分类号： H03H9/706
摘要： A band pass filter for improving filtering, realizing high integration, and reducing manufacturing costs, and a duplexer having the band pass filter. The band pass filter comprises a first resonant circuit in which n first resonators are connected in series, where n is a natural number greater than 1; a second resonator circuit which faces the first resonant circuit and has m second resonators connected in series, where m is a natural number greater than 1; and a third resonant circuit in which k third resonators are connected in parallel on branching lines linking the first and second resonant circuits, where k is a natural number greater than 1. By arranging the resonators of the respective resonant circuits in the bridge structure, the filtering characteristics can be improved, the number of inductors used to adjust the resonant frequency characteristics of the resonators can be reduced, high integration can be realized and manufacture cost can be reduced.
摘要翻译：用于改进滤波，实现高集成度和降低制造成本的带通滤波器，以及具有带通滤波器的双工器。带通滤波器包括第一谐振电路，其中n个第一谐振器串联连接，其中n是大于1的自然数; 面向第一谐振电路并具有串联连接的m个第二谐振器的第二谐振器电路，其中m是大于1的自然数; 以及第三谐振电路，其中k个第三谐振器并联在连接第一和第二谐振电路的分支线上，其中k是大于1的自然数。通过将各个谐振电路的谐振器布置在桥结构中，可以提高滤波特性，可以减少用于调节谐振器的谐振频率特性的电感器的数量，可以实现高集成度并且可以降低制造成本。

20. 发明授权

US07471167B2 Balun 有权
标题翻译：巴伦
公开(公告)号：US07471167B2
公开(公告)日：2008-12-30
申请号：US11638507
申请日：2006-12-14
申请人： Chul-soo Kim , Dal Ahn , Kwi-soo Kim , In-sang Song , Yun-kwon Park , Seok-chul Yun , Kuang-woo Nam
发明人： Chul-soo Kim , Dal Ahn , Kwi-soo Kim , In-sang Song , Yun-kwon Park , Seok-chul Yun , Kuang-woo Nam
IPC分类号： H01P5/10 , H03H7/42 , H01P3/08
CPC分类号： H01P5/10
摘要： A balun capable of a reduced whole size. The balun includes an input line receiving an unbalanced signal, an output line receiving the unbalanced signal from the input line and outputting a balanced signal, and a ground part. The input and output lines are formed on a layer, and the ground part is formed on a different layer from the layer. The ground part includes an opening and is electrically connected to the input line, and a portion of the ground part is removed to form the opening so that a potential difference occurs between first and second output lines. Thus, although a length of the output line is less than ¼ of an input wavelength λ, a difference between phases of first and second output signals can be about 180°. As a result, the whole size of the balun can be reduced.
摘要翻译：平衡 - 不平衡转换器能够减小整体尺寸。平衡 - 不平衡转换器包括接收不平衡信号的输入线，输入线接收来自输入线的不平衡信号并输出平衡信号的输出线和接地部分。输入和输出线形成在层上，并且接地部分形成在与该层不同的层上。接地部分包括开口并且电连接到输入线，并且去除接地部分的一部分以形成开口，使得在第一和第二输出线之间产生电位差。因此，尽管输出线的长度小于输入波长λ的1/4，但是第一和第二输出信号的相位差可以是大约180°。结果，平衡不平衡变换器的整体尺寸可以减小。

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