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11. 发明授权

US08360823B2 Splicing technique for fixed abrasives used in chemical mechanical planarization 有权
标题翻译：用于化学机械平面化的固定磨料的拼接技术
公开(公告)号：US08360823B2
公开(公告)日：2013-01-29
申请号：US12815764
申请日：2010-06-15
申请人： John J. Gagliardi
发明人： John J. Gagliardi
IPC分类号： B24B1/00 , B24B33/00
CPC分类号： B24D7/14 , B24B37/245
摘要： An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad.
摘要翻译：研磨制品包括支撑垫，第一研磨元件，第二研磨元件和固定机构。支撑垫具有第一主表面，第二主表面，第一边缘，第二边缘和通道。通道形成在第一主表面内并且从第一边缘延伸到第二边缘。第一和第二研磨元件各自位于支撑垫的一部分上。固定机构定位在通道内，将第一研磨元件的边缘和第二研磨元件的边缘固定到支撑垫。

12. 发明授权

US08092707B2 Compositions and methods for modifying a surface suited for semiconductor fabrication 有权
标题翻译：用于修改适合于半导体制造的表面的组合物和方法
公开(公告)号：US08092707B2
公开(公告)日：2012-01-10
申请号：US11839329
申请日：2007-08-15
申请人： L. Charles Hardy , Heather K. Kranz , Thomas E. Wood , David A. Kaisaki , John J. Gagliardi , John C. Clark , Patricia M. Savu , Philip G. Clark
发明人： L. Charles Hardy , Heather K. Kranz , Thomas E. Wood , David A. Kaisaki , John J. Gagliardi , John C. Clark , Patricia M. Savu , Philip G. Clark
IPC分类号： C09K13/00
CPC分类号： H01L21/31053 , B24B37/044 , B24B37/245 , C09G1/02 , H01L21/3212
摘要： The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.
摘要翻译：本公开涉及用于改性或精制适于半导体制造的晶片表面的组合物和方法。组合物包括可用于改性适于制造半导体器件的晶片表面的工作液体。在一些实施方案中，工作液体是基本上不含松散磨料颗粒的初始组分的水溶液，组分包括水，表面活性剂和显示出至少一个pKa大于7的pH缓冲液。在某些实施方案中，pH缓冲剂包括碱性pH调节剂和酸性络合剂，并且工作液体的pH为约7至约12.在另外的实施方案中，本公开提供了包含适于改性晶片表面的表面活性剂的固定磨料制品，以及方法制造固定的磨料制品。另外的实施例描述了可用于修改晶片表面的方法。

13. 发明申请

US20090176443A1 STRUCTURED FIXED ABRASIVE ARTICLES INCLUDING SURFACE TREATED NANO-CERIA FILLER, AND METHOD FOR MAKING AND USING THE SAME 有权
标题翻译：包括表面处理的纳米陶瓷填料的结构固定的磨料制品及其制备和使用方法
公开(公告)号：US20090176443A1
公开(公告)日：2009-07-09
申请号：US12359817
申请日：2009-01-26
申请人： Jeffrey S. Kollodge , Julie Y. Qian , Jimmie R. Baran, JR. , William D. Joseph , John J. Gagliardi
发明人： Jeffrey S. Kollodge , Julie Y. Qian , Jimmie R. Baran, JR. , William D. Joseph , John J. Gagliardi
IPC分类号： B24B1/00 , C09C1/00 , B24D3/28 , C09K3/14 , B24D18/00
CPC分类号： B24B37/245 , B24D3/20 , C09K3/1409 , C09K3/1436
摘要： Structured fixed abrasive articles including a multiplicity of three-dimensional abrasive composites fixed to the abrasive article, the abrasive composites further including a multiplicity of ceria abrasive particles having a volume mean diameter from 100 to 500 nanometers (nm) in a matrix material, the matrix material further including a polymeric binder and a multiplicity of surface treated ceria filler particles having a volume mean diameter less than 100 nm. Also provided are methods of making and using structured fixed abrasive articles according to the disclosure.
摘要翻译：结构化的固定磨料制品，包括固定在磨料制品上的多种三维磨料复合材料，磨料复合材料还包括多个在基质材料中体积平均直径为100至500纳米（nm）的二氧化铈磨料颗粒，基质材料还包括聚合物粘合剂和多个体积平均直径小于100nm的经表面处理的二氧化铈填料颗粒。还提供了根据本公开的制造和使用结构化固体磨料制品的方法。

14. 发明授权

US06186866B1 Abrasive article with separately formed front surface protrusions containing a grinding aid and methods of making and using 有权
标题翻译：具有单独形成的包含研磨助剂的前表面突起的制品和制造和使用方法
公开(公告)号：US06186866B1
公开(公告)日：2001-02-13
申请号：US09128692
申请日：1998-08-05
申请人： John J. Gagliardi
发明人： John J. Gagliardi
IPC分类号： B24B100
CPC分类号： B24D3/34 , B24D11/00
摘要： An abrasive article including (i) a first backing, (ii) a plurality of protrusions attached to the first surface of the first backing and including a grinding aid, wherein the first surface of the first backing is contoured by the protrusions so as to define a plurality of peaks and valleys, and (iii) a coating of abrasive particles adhered to the contoured first surface of the first backing so as to cover at least a portion of both the peaks and the valleys.
摘要翻译：一种磨料制品，包括（i）第一背衬，（ii）附接到第一背衬的第一表面上并包括研磨助剂的多个突起，其中第一背衬的第一表面由凸起构成，以便限定多个峰和谷，以及（iii）粘附到第一背衬的轮廓的第一表面上的磨料颗粒的涂层，以便覆盖两个峰和谷的至少一部分。

15. 发明授权

US06786810B2 Abrasive article having a window system for polishing wafers, and methods 有权
标题翻译：具有用于抛光晶片的窗口系统的磨料制品及方法
公开(公告)号：US06786810B2
公开(公告)日：2004-09-07
申请号：US10253559
申请日：2002-09-24
申请人： Michael J. Muilenburg , Chong-Yong J. Kim , Jerry J. Fizel , Richard J. Webb , John J. Gagliardi , Daniel B. Pendergrass, Jr. , Robert J. Streifel , Wesley J. Bruxvoort
发明人： Michael J. Muilenburg , Chong-Yong J. Kim , Jerry J. Fizel , Richard J. Webb , John J. Gagliardi , Daniel B. Pendergrass, Jr. , Robert J. Streifel , Wesley J. Bruxvoort
IPC分类号： B24B500
CPC分类号： B24D11/005 , B24B37/013 , B24B37/205
摘要： A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
摘要翻译：用于对晶片表面或其它工件进行平面化，抛光或提供其它修改的工艺。该方法包括使用具有附着在背衬上的纹理磨料涂层的磨料制品。研磨制品包括诸如窗口的监测元件，以允许辐射透过其中。在整个平坦化过程中监测辐射水平以确定所需端点的方法。研磨涂层中的窗口可以是没有研磨涂层或具有最小或变薄的磨料涂层的区域。

16. 发明授权

US06604985B2 Abrasive article having a window system for polishing wafers, and methods 有权
公开(公告)号：US06604985B2
公开(公告)日：2003-08-12
申请号：US10289750
申请日：2002-11-07
申请人： Michael J. Muilenburg , Chong-Yong J. Kim , Jerry J. Fizel , Richard J. Webb , John J. Gagliardi , Daniel B. Pendergrass, Jr. , Robert J. Streifel , Wesley J. Bruxvoort
发明人： Michael J. Muilenburg , Chong-Yong J. Kim , Jerry J. Fizel , Richard J. Webb , John J. Gagliardi , Daniel B. Pendergrass, Jr. , Robert J. Streifel , Wesley J. Bruxvoort
IPC分类号： B24B4900
CPC分类号： B24D11/005 , B24B37/013 , B24B37/205
摘要： A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

17. 发明授权

US5489235A Abrasive article and method of making same 失效
标题翻译：磨料制品及其制造方法
公开(公告)号：US5489235A
公开(公告)日：1996-02-06
申请号：US120297
申请日：1993-09-13
申请人： John J. Gagliardi , Roger C. Lokken
发明人： John J. Gagliardi , Roger C. Lokken
IPC分类号： B24B21/00 , B24D3/00 , B24D11/00 , B24D11/06
CPC分类号： B24D11/00
摘要： The invention provides an abrasive article having a surface having a machine direction axis and opposite side edges, each side edge being parallel to the machine direction axis and a plurality of parallel rows of abrasive composites in fixed position on the surface, each row being aligned at an angle with a side edge which is neither 0.degree. nor 90.degree., and methods for making such an abrasive article. The abrasive article of this invention also can be used in any convenient form including an endless belt. The resulting abrasive article provides a high rate of cut, long belt life, and a relatively fine surface finish on the workpiece being abraded.
摘要翻译：本发明提供了一种磨料制品，其具有具有机器方向轴线和相对侧边缘的表面，每个侧边缘平行于纵向轴线，并且多个平行的研磨复合体行在表面上处于固定位置，每排排列在与0°和90°的侧边缘成角度，以及制造这种磨料制品的方法。本发明的磨料制品也可以以任何方便的形式使用，包括环形带。所得到的磨料制品提供高的切割速度，长的皮带寿命，并且在被磨损的工件上具有相对精细的表面光洁度。

18. 发明授权

US5453078A Endoscopic wedge and organ positioner 失效
标题翻译：内镜楔和器官定位器
公开(公告)号：US5453078A
公开(公告)日：1995-09-26
申请号：US205799
申请日：1994-03-04
申请人： Douglas R. Valentine , John J. Gagliardi
发明人： Douglas R. Valentine , John J. Gagliardi
IPC分类号： A61F13/15 , A61F13/20 , A61F13/26 , A61F13/36 , A61F13/56 , A61F2/00 , A61M1/00
CPC分类号： A61F13/36 , A61B17/0218
摘要： An organ securing sponge device comprising a rigid dry absorbent linear compressed sponge body, sheet, net or pouch constructed of sponge material of polyvinyl acetal of a specific pore size density. The sponge when hydrated forming a wedge shaped sponge with a center cut out and an inclined surface which resists movement when engaging an organ, said sponge body when hydrated expands to position an organ which it has been laid adjacent to and having an absorbency of about times its weight.
摘要翻译：一种器官固定海绵装置，包括由具有特定孔径密度的聚乙烯醇缩醛的海绵材料构成的刚性干燥吸收性线性压缩海绵体，片状物，网状物或小袋。水合时的海绵形成楔形海绵，其中心切出，以及倾斜表面，当与器官接合时，该表面抵抗运动，所述海绵体在水合时膨胀以使其已被铺设的器官定位并具有大约几倍的吸收能力它的重量。

19. 发明申请

US20100243471A1 COMPOSITION, METHOD AND PROCESS FOR POLISHING A WAFER 审中-公开
标题翻译：用于抛光抛光的组合物，方法和方法
公开(公告)号：US20100243471A1
公开(公告)日：2010-09-30
申请号：US12739804
申请日：2008-08-25
申请人： Naichao Li , John J. Gagliardi , Philip G. Clark , Patricia M. Savu
发明人： Naichao Li , John J. Gagliardi , Philip G. Clark , Patricia M. Savu
IPC分类号： C09K13/00 , H01L21/302 , C25F3/30
CPC分类号： H01L21/31053 , B24B37/044 , C09G1/02
摘要： A composition for use in polishing a wafer is disclosed. The composition includes an aqueous solution of initial components substantially free of loose abrasive particles and having a pH in the range of about 2 to 7, the aqueous solution including at least one polyelectrolyte and a surfactant. In certain embodiments, the wafer polishing composition can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive Chemical Mechanical Polishing (CMP) process. Also disclosed is a CMP method and a process for polishing a wafer using the polishing composition.
摘要翻译：公开了一种用于抛光晶片的组合物。所述组合物包含初始组分的水溶液，其基本上不含松散的磨料颗粒，并且pH在约2-7范围内，所述水溶液包含至少一种聚电解质和表面活性剂。在某些实施方案中，可以调整晶片抛光组合物以控制使用固定磨料化学机械抛光（CMP）工艺修改半导体晶片的切割速率和选择性。还公开了CMP方法和使用抛光组合物研磨晶片的方法。

20. 发明授权

US07449124B2 Method of polishing a wafer 有权
标题翻译：抛光晶圆的方法
公开(公告)号：US07449124B2
公开(公告)日：2008-11-11
申请号：US11361873
申请日：2006-02-24
申请人： Richard J. Webb , John C. Clark , Christopher J. Rueb , John J. Gagliardi
发明人： Richard J. Webb , John C. Clark , Christopher J. Rueb , John J. Gagliardi
IPC分类号： C23F1/00 , H01L21/302
CPC分类号： C09G1/02 , B24B1/00 , B24B7/228 , B24D11/00 , H01L21/31053
摘要： A method for polishing a wafer comprising an aqueous solution having a pH in the range of 6 to 8, wherein the aqueous solution comprises at least one compound selected from the group consisting of a polymethacrylic acid, a polysulfonic acid, and combinations thereof, and wherein the compound is present in the range of 1.5 to 4 percent by weight of the aqueous solution. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
摘要翻译：一种用于抛光晶片的方法，所述方法包括pH在6至8范围内的水溶液，其中所述水溶液包含至少一种选自聚甲基丙烯酸，聚磺酸及其组合的化合物，并且其中该化合物以水溶液的1.5至4重量％的范围存在。可以调整晶片抛光溶液以控制使用固定的研磨CMP工艺来修改半导体晶片的切割速率和选择性。

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