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    • 11. 发明申请
    • SPLIT POLY-SiGe/POLY-Si ALLOY GATE STACK
    • 分散多晶硅/多晶硅合金栅极堆叠
    • US20080200021A1
    • 2008-08-21
    • US12104570
    • 2008-04-17
    • Kevin K. ChanJia ChenShih-Fen HuangEdward J. Nowak
    • Kevin K. ChanJia ChenShih-Fen HuangEdward J. Nowak
    • H01L21/3205
    • H01L21/2807H01L21/28052H01L21/28061H01L21/823835H01L21/823842H01L29/4916H01L29/4925H01L29/665
    • A multi-layered gate electrode stack structure of a field effect transistor device is formed on a silicon nano crystal seed layer on the gate dielectric. The small grain size of the silicon nano crystal layer allows for deposition of a uniform and continuous layer of poly-SiGe with a [Ge] of up to at least 70% using in situ rapid thermal chemical vapor deposition (RTCVD). An in-situ purge of the deposition chamber in a oxygen ambient at rapidly reduced temperatures results in a thin SiO2 or SixGeyOz interfacial layer of 3 to 4A thick. The thin SiO2 or SixGeyOz interfacial layer is sufficiently thin and discontinuous to offer little resistance to gate current flow yet has sufficient [O] to effectively block upward Ge diffusion during heat treatment to thereby allow silicidation of the subsequently deposited layer of cobalt. The gate electrode stack structure is used for both nFETs and pFETs.
    • 在栅极电介质上的硅纳米晶种子层上形成场效应晶体管器件的多层栅电极堆叠结构。 硅纳米晶体层的小晶粒尺寸允许使用原位快速热化学气相沉积(RTCVD)沉积高达至少70%的[Ge]的均匀且连续的多晶硅层。 在快速降低的温度下在氧气环境中原位吹扫沉积室导致薄的SiO 2或Si x O x O O 3至4A厚的界面层。 薄的SiO 2或Si x Si 2 O 3界面层足够薄且不连续以提供很小的电阻 到栅极电流仍具有足够的[O]以在热处理期间有效地阻挡Ge扩散,从而允许后续沉积的钴的硅化物。 栅电极堆叠结构用于nFET和pFET两者。
    • 15. 发明授权
    • Dual gate material process for CMOS technologies
    • 用于CMOS技术的双栅极材料工艺
    • US06828181B2
    • 2004-12-07
    • US10249800
    • 2003-05-08
    • Jia ChenAndreas E. Grassmann
    • Jia ChenAndreas E. Grassmann
    • H01L218238
    • H01L21/823842
    • A method and structure for a method of manufacturing a device having different types of transistors, wherein gates of the different types of transistors in the device comprise different materials. The method comprises depositing a silicon layer on a gate dielectric layer, depositing a first-type gate material on the silicon layer, removing the first-type gate material from areas where a second-type gate is to be formed, depositing a second-type gate material on the silicon layer in areas where the first-type gate material was removed, and simultaneously patterning the first-type gate material and the second-type gate material into first-type and second-type gates, and anneal and transform the two types of gate materials.
    • 用于制造具有不同类型晶体管的器件的方法的方法和结构,其中器件中不同类型的晶体管的栅极包括不同的材料。 该方法包括在栅极电介质层上沉积硅层,在硅层上沉积第一种类型的栅极材料,从要形成第二类型栅极的区域去除第一种类型的栅极材料; 在去除了第一种类型的栅极材料的区域中的硅层上的栅极材料,同时将第一种栅极材料和第二种栅极材料构图成第一类型和第二种栅极,并且对两种栅极材料进行退火和变换 门材料种类。