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    • 11. 发明申请
    • METAL FILL REGION OF A SEMICONDUCTOR CHIP
    • 金属填充区半导体芯片
    • US20080079158A1
    • 2008-04-03
    • US11538118
    • 2006-10-03
    • Steven J. BaumgartnerChun-Tao LiSalvatore N. StorinoMankit Wong
    • Steven J. BaumgartnerChun-Tao LiSalvatore N. StorinoMankit Wong
    • H01L23/52
    • H01L23/5222H01L2924/0002H01L2924/00
    • Disclosed is a metal fill region of a semiconductor chip including a plurality of layer sets of the semiconductor chip, each set including a first metal fill layer, a second metal fill layer, and an insulation layer included disposed in planes parallel to each other, a plurality of metal fill pieces disposed in each of the metal fill layers, a metal fill piece axis of each of the pieces, wherein each of the axes perpendicularly intersects the planes of said metal fill layers and the insulation layer from any point of reference, and a metal fill pattern configured to position the pieces so that the axis of each piece in the first metal fill layer is linearly displaced of the axis of each piece in the second metal fill layer in at least one direction orthogonal to each of the metal fill axes.
    • 公开了一种半导体芯片的金属填充区域,其包括半导体芯片的多个层组,每组包括设置在彼此平行的平面中的第一金属填充层,第二金属填充层和绝缘层, 设置在每个金属填充层中的多个金属填充片,每个片的金属填充片轴线,其中每个轴与任何参考点垂直地相交于所述金属填充层的平面和绝缘层,以及 金属填充图案,被配置为定位所述片,使得所述第一金属填充层中的每个片的轴线在与所述金属填充轴中的每一个垂直的至少一个方向上在所述第二金属填充层中的每个片的轴线线性位移 。
    • 14. 发明申请
    • TRAVERSING GRAPHICAL LAYERS USING A SCROLLING MECHANISM IN A PHYSICAL DESIGN ENVIRONMENT
    • 在物理设计环境中使用滚动机构处理图形层
    • US20080266246A1
    • 2008-10-30
    • US11739911
    • 2007-04-25
    • Karl L. LadinChun-Tao LiSalvatore N. Storino
    • Karl L. LadinChun-Tao LiSalvatore N. Storino
    • G06F3/048G06F15/00G09G5/08
    • G06F3/0485
    • Z-axis display navigation in the design automation process of physical design, development and manufacturing of integrated circuits includes pre-selecting, using a computer mouse connected to a computer workstation processor, viewable graphical layout layers desired by a design layout debugging operator to view during an integrated circuit (IC) design debugging process. After selecting the desired viewable graphic layout layers, the layout operator uses the mouse to traverse the pre-selected viewable graphical layout layers displayed, by changing the input scrolling pattern of the mouse to scroll forward, backward, diagonally and from side to side in a plurality of directions, where a curser on the layout screen will correspondingly move in the plurality of directions in the pre-selected viewable graphical layout layers on the layout screen corresponding to the movement of the mouse by the operator.
    • Z轴显示导航在设计自动化过程中的物理设计,开发和制造集成电路包括预先选择,使用连接到计算机工作站处理器的计算机鼠标,通过设计布局调试操作员所需的可见图形布局层来查看 集成电路(IC)设计调试过程。 在选择所需的可见图形布局图层之后,布局运算符通过改变鼠标的输入滚动模式来滚动向前,向后,向对角和从一侧到另一侧,使用鼠标遍历预先选择的可视图形布局图层。 多个方向,其中布局屏幕上的卷曲器将相应地在布局屏幕上的预选择的可视图形布局层中的多个方向上移动,对应于操作者对鼠标的移动。
    • 20. 发明授权
    • Metal fill region of a semiconductor chip
    • 半导体芯片的金属填充区域
    • US07489039B2
    • 2009-02-10
    • US11538118
    • 2006-10-03
    • Steven J. BaumgartnerChun-Tao LiSalvatore N. StorinoMankit Wong
    • Steven J. BaumgartnerChun-Tao LiSalvatore N. StorinoMankit Wong
    • H01L23/48H01L23/52
    • H01L23/5222H01L2924/0002H01L2924/00
    • Disclosed is a metal fill region of a semiconductor chip including a plurality of layer sets of the semiconductor chip, each set including a first metal fill layer, a second metal fill layer, and an insulation layer included disposed in planes parallel to each other, a plurality of metal fill pieces disposed in each of the metal fill layers, a metal fill piece axis of each of the pieces, wherein each of the axes perpendicularly intersects the planes of said metal fill layers and the insulation layer from any point of reference, and a metal fill pattern configured to position the pieces so that the axis of each piece in the first metal fill layer is linearly displaced of the axis of each piece in the second metal fill layer in at least one direction orthogonal to each of the metal fill axes.
    • 公开了一种半导体芯片的金属填充区域,其包括半导体芯片的多个层组,每组包括设置在彼此平行的平面中的第一金属填充层,第二金属填充层和绝缘层, 设置在每个金属填充层中的多个金属填充片,每个片的金属填充片轴线,其中每个轴与任何参考点垂直地相交于所述金属填充层的平面和绝缘层,以及 金属填充图案,被配置为定位所述片,使得所述第一金属填充层中的每个片的轴线在与所述金属填充轴中的每一个垂直的至少一个方向上在所述第二金属填充层中的每个片的轴线线性位移 。