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    • 14. 发明授权
    • Low-profile RF connector assembly
    • 低调RF连接器组件
    • US06533610B1
    • 2003-03-18
    • US10036052
    • 2001-12-24
    • Hsin Kuo DaiDavid Tso-Chin Ko
    • Hsin Kuo DaiDavid Tso-Chin Ko
    • H01R905
    • H01R24/50H01R2103/00
    • An RF connector assembly comprises a receptacle (10), a complementary plug (20), and a printed circuit board (PCB) (30). The receptacle includes a substrate (12), an outer contact (14), a central contact (16), and three solder pads (18, 19) disposed on the substrate. A through hole (36) is defined in a middle of the PCB. The outer and central contacts are accommodated in the through hole. The solder pads are soldered to a bottom face of the PCB. The plug is electrically connected with the receptacle within the through hole. Thus an overall profile of the RF connector assembly above a top face of the PCB is reduced in height.
    • RF连接器组件包括插座(10),互补插头(20)和印刷电路板(PCB)(30)。 插座包括衬底(12),外触点(14),中心触点(16)和设置在衬底上的三个焊盘(18,19)。 通孔(36)被限定在PCB的中间。 外部和中部触点容纳在通孔中。 焊盘焊接到PCB的底面。 插头与通孔内的插座电连接。 因此,在PCB的顶面之上的RF连接器组件的整体轮廓的高度减小。
    • 16. 发明授权
    • Method of making dual band microstrip antenna
    • 制造双频微带天线的方法
    • US06735849B2
    • 2004-05-18
    • US10033264
    • 2001-12-26
    • Yung Chang ChengHsin Kuo Dai
    • Yung Chang ChengHsin Kuo Dai
    • H01P1100
    • H01Q5/40H01Q9/0414H01Q9/0421Y10T29/49016Y10T29/49128Y10T29/49144
    • A dual band microstrip antenna (1) made by a method of the present invention includes a dielectric substrate (11), a ground plane layer (10) attached to a bottom surface (111) of the substrate, a first and second conductive patches (21, 22) separately elevated above and parallel to a top surface (110) of the substrate, a first and second conductive posts (23, 24) electrically connecting the first and second conductive patches respectively with the ground plane layer and a first and second coaxial feeder cables (25, 26). A method for making the dual band microstrip antenna includes adjusting the height of the first and second conductive posts to achieve a good performance of the dual band microstrip antenna.
    • 通过本发明的方法制造的双频带微带天线(1)包括电介质基片(11),附着在基底的底表面(111)上的接地平面层(10),第一和第二导电片( 21,22),其分别升高到所述基板的顶表面(110)上方并平行于所述第一和第二导电柱(23,24),所述第一和第二导电柱(23,24)将所述第一和第二导电片分别与所述接地平面层电连接, 同轴馈线电缆(25,26)。 制造双频带微带天线的方法包括调整第一和第二导电柱的高度以实现双频带微带天线的良好性能。