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11. 发明专利

JPS59215497A Plating method of fiber bundle 失效
标题翻译：纤维布的敷设方法
公开(公告)号：JPS59215497A
公开(公告)日：1984-12-05
申请号：JP8823083
申请日：1983-05-19
申请人： Hitachi Cable Ltd
发明人： YOSHIDA HIROMICHI , KAYANE KOUICHI , SUZUMURA TAKASHI , YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU , ISHIKAWA TETSUO , SATO HIDEAKI
IPC分类号： C25D7/00 , C25D7/06 , D06M11/00 , D06M11/83 , D06M11/84 , D06M101/00 , D06M101/16 , D06M101/30 , D06M101/34 , D06M101/40
摘要： PURPOSE: To subject uniformly a fiber bundle to plating by providing flow regulating walls at the top and bottom in a parallel flow passage for a plating soln. in addition to the flow regulating walls provided on both sides of the fiber bundle and delineating the parallel flow.
CONSTITUTION: A fiber bundle 1 is immersed in the plating soln. 2 in a plating cell 3 and is transferred to an arrow direction. A pair of nozzles 4 on the feed side thereof generate the plating soln. flow in parallel with the transfer direction of the bundle 1, thereby forming a parallel flow passage. The bundle 1 is held open and is plated in this state. Flow regulating walls 5 on both sides of the bundle 1 positioned to face each other in parallel via the fiber bundle interposed in the central position between both walls and flow regulating walls 7 above and below the bundle 1 are provided over the adequate region from the position near said nozzle 4. The bundle 1 is thus held stably open and is uniformly plated.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：通过在电镀溶液的平行流路中的顶部和底部设置流量调节壁，均匀地对纤维束进行电镀。除了设置在纤维束的两侧上的流动调节壁以及描绘平行流动之外。构成：将纤维束1浸渍在电镀溶液中。 2，并且转移到箭头方向。在其进料侧的一对喷嘴4产生电镀溶液。与束1的传送方向平行地流动，从而形成平行流路。束1保持打开，并在该状态下进行电镀。在捆1的两侧上的流动调节壁5通过插入在两个壁之间的中心位置处的纤维束并且在束1的上方和下方的流动调节壁7之间平行地定位，设置在从该位置的适当区域在所述喷嘴4附近。因此束1被稳定地保持打开并且被均匀地镀覆。

12. 发明专利

JPS59149041A Lead frame for semiconductor 失效
标题翻译：半导体引线框架
公开(公告)号：JPS59149041A
公开(公告)日：1984-08-25
申请号：JP2341783
申请日：1983-02-15
申请人： Hitachi Cable Ltd
发明人： YOSHIOKA OSAMU , YAMAGISHI RIYOUZOU , BANDOU YOSHINORI
IPC分类号： H01L21/52 , H01L23/48 , H01L23/495
CPC分类号： H01L23/49562 , H01L2224/32245 , H01L2224/45 , H01L2224/45124 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2924/01013 , H01L2924/01028 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE:To contrive the improvement of the thermal fatigue property as well as the stabilization of the wettability by a method wherein metals of more than one kind among metals selected from a group consisting of Sb, In, Cd, Zn, Ag, Bi and Cu are made to contain in a tin- or a tin and lead-plating used as a wax material by which a semiconductor element is connected to a lead frame for semiconductor. CONSTITUTION:A glossy nickel-plated layer 4 has been provided on the surface of a substrate 1 and an electroplated layer 5 of a lead-tin-antimony ternary alloy has been provided partially on the above, namely, on a semiconductor element arranged part 2. A semiconductor element 6 is placed on the layer 5 and the element 6 and the layer 5 are bonded together with wax according to a heating pressure welding method in the nitrogen atmosphere and furthermore, the semiconductor element 6 and an inner lead part 3 are connected together by an extremely fine Al wire 7 and, after that, is sealed with a synthetic resin 9.
摘要翻译：目的：通过一种方法来改善热疲劳性能和润湿性的稳定性，其中选自Sb，In，Cd，Zn，Ag，Bi和Cu中的一种以上的金属中的金属被制成容纳在用作蜡材料的锡或锡和铅镀层中，半导体元件通过该材料连接到用于半导体的引线框架。构成：在基板1的表面上设置有光泽的镀镍层4，并且部分地设置有铅 - 锡 - 锑三元合金的电镀层5，即在半导体元件布置部分2 半导体元件6被放置在层5上，元件6和层5在氮气气氛中根据加热压力焊接方式用蜡粘合在一起，此外，半导体元件6和内引线部3被连接通过非常细的Al线7一起，之后用合成树脂9密封。

13. 发明专利

JPS5914658A Lead frame for semiconductor 失效
标题翻译：半导体引线框架
公开(公告)号：JPS5914658A
公开(公告)日：1984-01-25
申请号：JP12473382
申请日：1982-07-16
申请人： Hitachi Cable Ltd
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU , SOTSUDA SEIJI , NAGAYAMA SADAO
IPC分类号： H01L23/48 , H01L23/495
CPC分类号： H01L24/32 , H01L23/49582 , H01L24/97 , H01L2224/32245 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/4847 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE:To obtain a lead frame of high reliability without noble metal by only plating gloss Ni on a substrate of Fe or Cu, and forming a solder plating layer on the position to be bonded with a semiconductor element. CONSTITUTION:The connecting strength of aluminum wirings 7 on a substrate 1 of Fe or Cu depends largely upon the surface state of an Ni-plating 4 on the substrate 1, stable connection cannot be obtained in case of glossless Ni plating on rough surface, but more stable in connection when the surface is more smooth. Accordingly, smooth Ni plating layer 4 which is more smooth than semigloss is formed. Further, pure Pb or Pb solder plating layer is used as a lower layer, pure Sn or Sn solder plating layer is superposed, and a semiconductor element is brazed at 5. According to this solder plating layer, the thermal stress after brazing can be absorbed by the lower layer, discoloration can be prevented by the upper layer, and ageing deterioration in moistening property can be prevented. According to this configuration, a lead frame having high reliability can be obtained without using a noble metal.
摘要翻译：目的：通过在Fe或Cu的基板上仅镀覆电镀Ni，并且在与半导体元件接合的位置上形成焊料镀层，以获得高贵的金属引线框架。构成：在Fe或Cu的基板1上的铝布线7的连接强度很大程度上取决于基板1上的镀镍4的表面状态，在粗糙表面上无光泽的镀镍的情况下不能获得稳定的连接，但是当表面更光滑时，连接更稳定。因此，形成比半光泽更光滑的平滑的Ni镀层4。此外，使用纯Pb或Pb焊料镀层作为下层，将纯Sn或Sn焊料镀层重叠，并将半导体元件钎焊在5上。根据该焊料镀层，可以吸收钎焊后的热应力通过下层，可以通过上层防止变色，并且可以防止润湿性的老化劣化。根据该结构，能够得到高可靠性的引线框架，而不使用贵金属。

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