专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08866949B2 Optical element module and manufacturing method thereof, electronic element module and manufacturing method thereof, and electronic information device 有权
标题翻译：光元件模块及其制造方法，电子元件模块及其制造方法以及电子信息装置
公开(公告)号：US08866949B2
公开(公告)日：2014-10-21
申请号：US12805959
申请日：2010-08-26
申请人： Yuji Yano , Hideyuki Kurimoto
发明人： Yuji Yano , Hideyuki Kurimoto
IPC分类号： G02B13/16 , B32B37/12 , G02B7/02 , G02B13/00 , G02B27/00 , B32B38/00
CPC分类号： B32B37/12 , B32B38/0004 , B32B2310/0831 , B32B2457/00 , B32B2457/08 , G02B7/021 , G02B7/022 , G02B13/0085 , G02B27/0018 , Y10T29/49002 , Y10T29/49826 , Y10T156/1052
摘要： An optical element module according to the present invention is provided, in which: a plurality of optical elements are housed within a light shielding holder; a metal light shielding plate is interposed at least between respective planarized surfaces of a spacer section of an upper optical element and a spacer section of a lower optical element; the light shielding plate includes an opening formed at a position corresponding to an optical surface of the optical element; and the light shielding plate includes a cut section, which is formed by cutting a part of a peripheral edge of the light shielding plate.
摘要翻译：本发明提供一种光学元件模块，其中：多个光学元件容纳在遮光保持器内; 金属遮光板至少插入上光学元件的间隔部分和下光学元件的间隔部分的相应的平坦表面之间; 遮光板包括形成在与光学元件的光学表面对应的位置处的开口; 遮光板包括通过切割遮光板的周缘的一部分而形成的切割部。

12. 发明授权

US08410827B2 Transmitter, interface device, and car mounted communication system 有权
标题翻译：发射机，接口设备和车载通信系统
公开(公告)号：US08410827B2
公开(公告)日：2013-04-02
申请号：US13113235
申请日：2011-05-23
申请人： Yuji Yano
发明人： Yuji Yano
IPC分类号： H03K3/00
CPC分类号： H03K19/00361
摘要： A transmitter includes a capacitor from one end of which a charge voltage is derived; a first constant current source to generate a charge current for the capacitor; a second constant current source to generate a discharge current for the capacitor; a charge/discharge controller to perform charge/discharge control of the capacitor based on a logic level of a transmission input signal and a comparison result between the charge voltage and a reference voltage; an output stage to generate the transmission output signal, wherein a slew rate of which is set in response to the charge voltage, and wherein an amplitude of the transmission output signal is set in response to an output side power source voltage; a reference voltage generator to fluctuate the reference voltage depend on the output side power source voltage; and a constant current controller to fluctuate a current value of the charge current and the discharge current depend on the reference voltage.
摘要翻译：发射机包括从其一端导出充电电压的电容器; 产生电容器的充电电流的第一恒流源; 用于产生电容器的放电电流的第二恒流源; 充电/放电控制器，用于基于发送输入信号的逻辑电平和充电电压与参考电压之间的比较结果来执行电容器的充电/放电控制; 产生发送输出信号的输出级，其中，根据所述充电电压设定其转换速率，并且响应于所述输出侧电源电压而设定所述发送输出信号的振幅; 参考电压发生器使参考电压波动取决于输出侧电源电压; 以及恒定电流控制器，用于使充电电流的当前值波动，并且放电电流取决于参考电压。

13. 发明申请

US20130039134A1 SEMICONDUCTOR DEVICE INCLUDING MEMORY CAPABLE OF REDUCING POWER CONSUMPTION 有权
标题翻译：半导体器件，包括可减少功耗的存储器
公开(公告)号：US20130039134A1
公开(公告)日：2013-02-14
申请号：US13566779
申请日：2012-08-03
申请人： Hisashi Iwamoto , Yuji Yano , Kazunari Inoue
发明人： Hisashi Iwamoto , Yuji Yano , Kazunari Inoue
IPC分类号： G11C7/22
CPC分类号： G11C7/1069 , G11C7/1006 , G11C7/1096 , G11C7/222
摘要： A semiconductor device includes a plurality of memory arrays and a plurality of memory array control circuits. Each of the plurality of memory array control circuits includes a read/write control circuit for controlling a read/write operation for the memory array, and a selection circuit for selecting and activating the memory array based on a clock signal and an output signal from the read/write control circuit.
摘要翻译：半导体器件包括多个存储器阵列和多个存储器阵列控制电路。多个存储器阵列控制电路中的每一个包括用于控制存储器阵列的读/写操作的读/写控制电路，以及用于基于时钟信号和来自该存储器阵列控制电路的输出信号选择和激活存储器阵列的选择电路读/写控制电路。

14. 发明授权

US07276437B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07276437B2
公开(公告)日：2007-10-02
申请号：US11028861
申请日：2005-01-05
申请人： Yuji Yano , Atsuya Narai
发明人： Yuji Yano , Atsuya Narai
IPC分类号： H01L21/44
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0657 , H01L25/50 , H01L2224/05553 , H01L2224/05644 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/48599 , H01L2224/49052 , H01L2224/4911 , H01L2224/4942 , H01L2224/49425 , H01L2224/49429 , H01L2224/4945 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85191 , H01L2224/85203 , H01L2224/85951 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/15311 , H01L2924/30105 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/4554
摘要： In a manufacturing method of a semiconductor device, a substrate and a plurality of semiconductor chips stacked on the substrate are connected to each other by a ball bonding method adopting a reverse method. Specifically, after first bonding on a bonding pad on the substrate, a gold wire is led to a bonding pad of a semiconductor chip of the bottom layer, and by second bonding, a wire for connecting the substrate and the semiconductor chip of the bottom layer is formed. Similarly, other semiconductor chips are also connected to the substrate from the layer on the bottom. As a result, it is possible to reduce the package size, to provide a sufficient clearance between wires, and to reduce restrictions on combinations of semiconductor chips to be stacked.
摘要翻译：在半导体器件的制造方法中，通过采用逆方法的球焊方法，将堆叠在基板上的基板和多个半导体芯片彼此连接。具体地说，在基板上的接合焊盘上首次接合之后，将金线导入底层的半导体芯片的接合焊盘，通过第二接合，将基板与底层的半导体芯片连接形成了。类似地，其它半导体芯片也从底部的层连接到基板。结果，可以减小封装尺寸，以提供电线之间的足够的间隙，并且减少对要堆叠的半导体芯片的组合的限制。

15. 发明申请

US20060151206A1 Semiconductor device and manufacturing method therefor 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060151206A1
公开(公告)日：2006-07-13
申请号：US11324635
申请日：2006-01-04
申请人： Tomoyo Maruyama , Yuji Yano
发明人： Tomoyo Maruyama , Yuji Yano
IPC分类号： H05K1/16
CPC分类号： H01L24/97 , H01L23/49833 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/15311 , H01L2924/15331 , H05K1/144 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device of the present invention includes a semiconductor elements on a circuit board of the semiconductor device, interposing an adhesive material between the semiconductor element and the circuit board. Further, a connection use circuit board including an external terminal connecting portion is mounted on an upper surface of the semiconductor element, interposing an adhesive material between the connection use circuit board and the semiconductor element, and a lower surface of the connection use circuit board and the upper surface of the circuit board are connected with each other via an electrically conductive terminal. A space between the circuit board and the connection use circuit board is sealed with sealing resin. With this configuration, it is possible to realize a small and thin semiconductor device which allows for (i) less restricted arrangement of an external connection terminal, which connects the semiconductor device with a semiconductor device or an electronic component laminated on an upper stage, and (ii) an improvement in a packaging density, and which is excellent in a heat radiation characteristic.
摘要翻译：本发明的半导体器件包括在半导体器件的电路板上的半导体元件，在半导体元件和电路板之间插入粘接材料。此外，包括外部端子连接部分的连接用电路板安装在半导体元件的上表面上，在连接用电路板和半导体元件之间插入粘合剂材料，连接用电路板的下表面和电路板的上表面通过导电端子相互连接。电路板和连接用电路板之间的空间用密封树脂密封。利用这种结构，可以实现一种小而薄的半导体器件，其允许（i）将半导体器件与半导体器件或层叠在上层上的电子部件连接的外部连接端子的布置较少，以及（ii）包装密度的改善，并且具有优异的散热特性。

16. 发明申请

US20050148175A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050148175A1
公开(公告)日：2005-07-07
申请号：US11028861
申请日：2005-01-05
申请人： Yuji Yano , Atsuya Narai
发明人： Yuji Yano , Atsuya Narai
IPC分类号： H01L25/18 , H01L21/60 , H01L25/00 , H01L25/04 , H01L25/065 , H01L25/07 , H01L23/495 , H01L21/44 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0657 , H01L25/50 , H01L2224/05553 , H01L2224/05644 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/48599 , H01L2224/49052 , H01L2224/4911 , H01L2224/4942 , H01L2224/49425 , H01L2224/49429 , H01L2224/4945 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85191 , H01L2224/85203 , H01L2224/85951 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/15311 , H01L2924/30105 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/4554
摘要： In a manufacturing method of a semiconductor device, a substrate and a plurality of semiconductor chips stacked on the substrate are connected to each other by a ball bonding method adopting a reverse method. Specifically, after first bonding on a bonding pad on the substrate, a gold wire is led to a bonding pad of a semiconductor chip of the bottom layer, and by second bonding, a wire for connecting the substrate and the semiconductor chip of the bottom layer is formed. Similarly, other semiconductor chips are also connected to the substrate from the layer on the bottom. As a result, it is possible to reduce the package size, to provide a sufficient clearance between wires, and to reduce restrictions on combinations of semiconductor chips to be stacked.
摘要翻译：在半导体器件的制造方法中，通过采用逆方法的球焊方法，将堆叠在基板上的基板和多个半导体芯片彼此连接。具体地说，在基板上的接合焊盘上首次接合之后，将金线导入底层的半导体芯片的接合焊盘，通过第二接合，将基板与底层的半导体芯片连接形成了。类似地，其它半导体芯片也从底部的层连接到基板。结果，可以减小封装尺寸，以提供电线之间的足够的间隙，并且减少对要堆叠的半导体芯片的组合的限制。

17. 发明授权

US08625360B2 Semiconductor storage device operative to search for data 有权
标题翻译：用于搜索数据的半导体存储设备
公开(公告)号：US08625360B2
公开(公告)日：2014-01-07
申请号：US13165457
申请日：2011-06-21
申请人： Hisashi Iwamoto , Yuji Yano , Koji Yamamoto
发明人： Hisashi Iwamoto , Yuji Yano , Koji Yamamoto
IPC分类号： G11C7/10
CPC分类号： G11C15/04
摘要： To provide a semiconductor storage device capable of performing a search of the next data while performing a search of certain data. A first comparator compares data output to a bit line from a memory cell with first search data by activating a word line. A second comparator compares data output to a bit line from the memory cell with second search data by activating a word line. Data output to a bit line by the activation of one word line is input to both the first comparator and second comparator.
摘要翻译：提供能够在执行某些数据的搜索的同时对下一个数据进行搜索的半导体存储装置。第一比较器通过激活字线将来自存储器单元的数据输出与第一搜索数据进行比较。第二比较器通过激活字线将来自存储器单元的数据输出与第二搜索数据进行比较。通过一个字线的激活将数据输出到位线被输入到第一比较器和第二比较器。

18. 发明授权

US08547470B2 Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device 有权
标题翻译：光学元件，光学元件晶片，光学元件晶片模块，光学元件模块，光学元件模块的制造方法，电子元件晶片模块，电子元件模块的制造方法，电子元件模块和电子信息装置
公开(公告)号：US08547470B2
公开(公告)日：2013-10-01
申请号：US12586624
申请日：2009-09-23
申请人： Yuji Yano , Kenji Hirano
发明人： Yuji Yano , Kenji Hirano
IPC分类号： H04N5/225
CPC分类号： B29D11/00432 , G02B3/0056 , G02B3/0068 , G02B13/003 , G02B13/0085 , H01L27/14625 , H01L27/14685 , H01L31/02325 , Y10T83/0405 , Y10T156/1062
摘要： An optical element according to the present invention includes: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein a bottom portion for positioning an adhesive is provided on a further outer circumference side of the spacer section with a tapered portion interposed therebetween.
摘要翻译：根据本发明的光学元件包括：在其中心部分处的光学表面; 以及在所述光学表面的外周侧具有预定厚度的间隔部分，其中用于定位粘合剂的底部设置在所述间隔部分的另一外周侧上，其间插入有锥形部分。

19. 发明授权

US07938748B2 Power transmission device and method of producing the same 有权
标题翻译：动力传动装置及其制造方法
公开(公告)号：US07938748B2
公开(公告)日：2011-05-10
申请号：US12509588
申请日：2009-07-27
申请人： Kiyoji Minegishi , Yuji Yano
发明人： Kiyoji Minegishi , Yuji Yano
IPC分类号： F16H23/00
CPC分类号： F16H1/32 , F03D7/0204 , F05B2260/30 , F16H2001/325 , Y02E10/722 , Y02E10/723 , Y10T29/49826
摘要： The power transmission device has an internally meshing planetary gear mechanism that has an input shaft, an eccentric body provided on the input shaft, an externally toothed gear eccentrically oscillating via the eccentric body, and an internally toothed gear with which the externally toothed gear internally meshes. The externally toothed gear is assembled to the internally toothed gear in an interference fit.
摘要翻译：动力传递装置具有内啮合的行星齿轮机构，其具有输入轴，设置在输入轴上的偏心体，经由偏心体偏心摆动的外齿齿轮和外齿齿轮内啮合的内齿齿轮。外齿轮以过盈配合组装到内齿齿轮上。

20. 发明申请

US20110050978A1 Optical element module and manufacturing method thereof, electronic element module and manufacturing method thereof, and electronic information device 有权
标题翻译：光元件模块及其制造方法，电子元件模块及其制造方法以及电子信息装置
公开(公告)号：US20110050978A1
公开(公告)日：2011-03-03
申请号：US12805959
申请日：2010-08-26
申请人： Yuji Yano , Hideyuki Kurimoto
发明人： Yuji Yano , Hideyuki Kurimoto
IPC分类号： G02B13/16 , G02B5/00 , B23P11/00 , H05K13/00 , B32B38/04
CPC分类号： B32B37/12 , B32B38/0004 , B32B2310/0831 , B32B2457/00 , B32B2457/08 , G02B7/021 , G02B7/022 , G02B13/0085 , G02B27/0018 , Y10T29/49002 , Y10T29/49826 , Y10T156/1052
摘要： An optical element module according to the present invention is provided, in which: a plurality of optical elements are housed within a light shielding holder; a metal light shielding plate is interposed at least between respective planarized surfaces of a spacer section of an upper optical element and a spacer section of a lower optical element; the light shielding plate includes an opening formed at a position corresponding to an optical surface of the optical element; and the light shielding plate includes a cut section, which is formed by cutting a part of a peripheral edge of the light shielding plate.
摘要翻译：本发明提供一种光学元件模块，其中：多个光学元件容纳在遮光保持器内; 金属遮光板至少插入上光学元件的间隔部分和下光学元件的间隔部分的相应的平坦表面之间; 遮光板包括形成在与光学元件的光学表面对应的位置处的开口; 遮光板包括通过切割遮光板的周缘的一部分而形成的切割部。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式