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11. 发明申请

US20120225876A1 8-AZABICYCLO[3.2.1]OCTANE-8-CARBOXAMIDE DERIVATIVE 有权
标题翻译： 8-AZABICYCLO [3.2.1]八羧基甲酰胺衍生物
公开(公告)号：US20120225876A1
公开(公告)日：2012-09-06
申请号：US13508905
申请日：2010-11-11
申请人： Yoshihiro Horiuchi , Kiyoto Sawamura , Hiroaki Fujiwara
发明人： Yoshihiro Horiuchi , Kiyoto Sawamura , Hiroaki Fujiwara
IPC分类号： A61K31/439 , C07D413/12 , A61K31/5377 , C07D401/12 , A61K31/497 , A61K31/506 , A61K31/501 , A61P3/10 , A61P3/08 , A61P5/48 , A61P3/06 , A61P9/12 , A61P9/10 , A61P3/04 , A61P27/06 , A61P19/10 , A61P3/00 , A61P9/00 , A61P25/28 , A61P25/24 , A61P25/22 , C07D221/22
CPC分类号： C07D451/06
摘要： Disclosed is a compound represented by formula (1) or a pharmacologically acceptable salt thereof (In the formula, A represents a group that is represented by formula (A-1); R1a and R1b may be the same or different and each independently represents a C1-6 alkyl group which may be substituted by one to three halogen atoms; m and n each independently represents an integer of 0-5; X1 represents a hydroxyl group or an aminocarbonyl group; Z1 represents a single bond or the like; and R2 represents an optionally substituted C1-6 alkyl group, an optionally substituted C6-10 aryl group or the like.)
摘要翻译：公开了由式（1）表示的化合物或其药理学上可接受的盐（式中，A表示由式（A-1）表示的基团; R 1a和R 1b可以相同或不同，各自独立地表示可被一至三个卤素原子取代的C 1-6烷基; m和n各自独立地表示0-5的整数; X1表示羟基或氨基羰基; Z1表示单键等; R2表示表示任选取代的C 1-6烷基，任选取代的C 6-10芳基等）

12. 发明授权

US07873932B2 Method for analyzing component mounting board 失效
标题翻译：元件安装板分析方法
公开(公告)号：US07873932B2
公开(公告)日：2011-01-18
申请号：US11885831
申请日：2006-01-20
申请人： Manabu Kakino , Toru Okazaki , Teppei Iwase , Kazunori Takada , Hiroaki Fujiwara , Tomoaki Kuroishi
发明人： Manabu Kakino , Toru Okazaki , Teppei Iwase , Kazunori Takada , Hiroaki Fujiwara , Tomoaki Kuroishi
IPC分类号： G06F17/50
CPC分类号： G06F17/5018 , G06F2217/40 , G06F2217/80 , H05K1/181 , H05K3/0005
摘要： A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.
摘要翻译：一种用于分析组件安装板的方法，包括用于形成多层布线板的多层基板外壳模型的步骤（A），用于形成由元件划分线划分的多层部件壳模型的步骤（B）多层布线基板的表面的成分，对多层基板外壳模型中的部件的安装位置进行再分割的工序（C），以及通过将基板的中性面粘合而形成分析模型的工序（D）通过束元件和固体元件中的一个，即与元件的安装条件相当的结合元件，其中分析的精度被增强，同时通过在分析模型赋予边界条件的同时进行计算来降低计算成本。

13. 发明授权

US07413791B2 Poly (phenylene ether) resin composition, prepreg, and laminated sheet 有权
标题翻译：聚（苯醚）树脂组合物，预浸料和层压片
公开(公告)号：US07413791B2
公开(公告)日：2008-08-19
申请号：US10718525
申请日：2003-11-24
申请人： Hiroharu Inoue , Eiichiro Saito , Hiroaki Fujiwara
发明人： Hiroharu Inoue , Eiichiro Saito , Hiroaki Fujiwara
IPC分类号： C08L71/12
CPC分类号： C08J5/24 , B32B15/14 , B32B27/04 , C08F283/08 , C08G65/485 , C08G2650/20 , C08J2371/12 , C08L71/126 , C08L2312/00 , H05K1/0326 , Y10T428/24355 , Y10T428/31855 , C08L2666/04
摘要： An object of the invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics.The poly(phenylene ether) resin composition according to the present invention comprises poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) is represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000. [wherein, X is an aryl group; (Y)m is a poly(phenylene ether) moiety; Z is a phenylene group and the like; R1 to R3 each independently is a hydrogen atom, and the like; n is an integer of 1 to 6; and q is an integer of 1 to 4.]
摘要翻译：本发明的目的是提供一种聚（亚苯基醚）树脂组合物，即使在预浸料制造中方便使用低分子量PPE而不牺牲介电特性的情况下，也可以制造耐热性和加工性优异的层压片。根据本发明的聚苯醚树脂组合物包含聚（苯醚）和交联固化剂，其中聚（苯醚）由下式（I）表示，其数均分子量为范围从1000到7000。 [其中，X为芳基; （Y）M是聚（苯醚）部分; Z是亚苯基等; R 1至R 3各自独立地为氢原子等; n为1〜6的整数。 q为1〜4的整数。]

14. 发明授权

US06962252B2 Curved belt support apparatus 失效
标题翻译：弯曲带支撑装置
公开(公告)号：US06962252B2
公开(公告)日：2005-11-08
申请号：US10399159
申请日：2001-06-11
申请人： Hiroaki Fujiwara , Walter Niklaus Polt
发明人： Hiroaki Fujiwara , Walter Niklaus Polt
IPC分类号： B65G15/00 , B65G15/02 , B65G15/62 , B65G21/16 , B65G39/16 , B65G15/60
CPC分类号： B65G15/62 , B65G15/00 , B65G15/02 , B65G2201/06
摘要： The invention provides a curved belt support apparatus (300) that prevents a curved belt (200) from moving inward by supporting a thick part (220) of the curved belt that thickens in both vertical directions at the outer edge of the belt. An upper roller (370) is brought in contact with the upper inside surface (221) of the thick part (220), a lower guide roller (380) is brought in contact with the lower guide roller (380) is brought in contact with the lower inside surface (222) of the thick part (200), and the upper and lower guide rollers are elastically supported such that they can move up and down. When operated, the upper guide roller (370) and the lower guide roller (380) are moved diagonally upward and downward, respectively, in the direction of the radial inner edge of the curved belt so that the thick part (220) of the belt is released from the upper and lower guide rollers.
摘要翻译：本发明提供了一种弯曲带支撑装置（300），其通过支撑在带的外边缘处沿两个垂直方向变稠的弯曲带的厚部（220）来防止弯曲带（200）向内移动。上辊370与厚部220的上侧内表面221接触，下导辊380与下导辊380接触，厚部（200）的下内表面（222），上下导辊以弹性方式支撑，使得它们能够上下移动。当操作时，上引导辊（370）和下引导辊（380）沿弯曲带的径向内边缘的方向分别向上和向下移动，使得带的厚部（220）从上下引导辊释放。

15. 发明授权

US06665854B2 Method and apparatus of checking mount quality of circuit board 失效
标题翻译：检查电路板安装质量的方法和装置
公开(公告)号：US06665854B2
公开(公告)日：2003-12-16
申请号：US09995635
申请日：2001-11-29
申请人： Hiroaki Fujiwara , Masaki Okamoto , Keiji Hanada , Masashi Yokomori
发明人： Hiroaki Fujiwara , Masaki Okamoto , Keiji Hanada , Masashi Yokomori
IPC分类号： G06F1750
CPC分类号： H05K13/08
摘要： A component/board retriever 2 retrieves component/board data from CAD data supplied to a CAD data input unit 1. A circuit board information storage 3 stores various board information and outputs board information based on board design data. A component information storage 4 stores various component information and outputs component information based on component design data. A mount scheme (process) requirement storage 6 stores requirements for mounting processes. A mounting device requirements storage 7 stores requirements for mounting devices. A design analyzer 8 analyzes whether the designed circuit board is achievable or not under requirements supplied by an applied mount requirement input unit 5 and outputs the analysis results through a check result output unit 9 to a designer. Thus, changes in the mounting process requirement and/or the mounting device requirement can be easily reflected on a design check. Therefore, the number of quality checks onto the actual prototype can be reduced, and the circuit board that satisfies the target quality can be designed in the early stage of designing.
摘要翻译：组件/板检索器2从提供给CAD数据输入单元1的CAD数据中检索组件/板数据。电路板信息存储器3存储各种板信息，并基于板设计数据输出板信息。组件信息存储器4存储各种组件信息，并且基于组件设计数据输出组件信息。安装方案（过程）要求存储6存储安装过程的要求。安装设备要求存储7存储安装设备的要求。设计分析器8分析所设计的电路板是否可以由应用的安装要求输入单元5提供的要求实现，并且通过检查结果输出单元9将分析结果输出给设计者。因此，可以在设计检查中容易地反映安装过程要求和/或安装装置要求的变化。因此，可以减少对实际原型的质量检查数量，可以在设计初期设计满足目标质量的电路板。

16. 发明授权

US08895552B2 Cyclic amide derivative 有权
标题翻译：环状酰胺衍生物
公开(公告)号：US08895552B2
公开(公告)日：2014-11-25
申请号：US13819881
申请日：2011-09-02
申请人： Yoshihiro Horiuchi , Hiroaki Fujiwara , Hitoshi Suda , Izumi Sasaki , Mitsutaka Iwata , Kiyoto Sawamura
发明人： Yoshihiro Horiuchi , Hiroaki Fujiwara , Hitoshi Suda , Izumi Sasaki , Mitsutaka Iwata , Kiyoto Sawamura
IPC分类号： A61K31/535 , C07D277/00
CPC分类号： C07D409/06 , C07C233/74 , C07C235/84 , C07C255/57 , C07C2603/74 , C07D207/32 , C07D207/335 , C07D207/34 , C07D213/50 , C07D213/61 , C07D213/82 , C07D231/12 , C07D233/64 , C07D263/32 , C07D277/20 , C07D277/28 , C07D277/30 , C07D277/56 , C07D295/10 , C07D295/155 , C07D305/08 , C07D307/20 , C07D307/78 , C07D307/81 , C07D309/12 , C07D317/48 , C07D319/18 , C07D333/20 , C07D333/38 , C07D333/58 , C07D409/14
摘要： Provided is a compound represented by formula (1) or a pharmacologically acceptable salt thereof. (In the formula, A is C6-10 arylene, etc.; R1a, R1b and R1c each independently is a hydrogen atom, a halogen atom, a C1-4 alkyl group, a C1-4 alkoxy group, etc.; R2 is an optionally substituted C6-10 aryl group, an optionally substituted 5- to 12-membered monocyclic or polycyclic heteroaryl group, an optionally substituted C7-16 aralkyl group, etc.; m is 0, etc.; n is an integer of 0 to 2.)
摘要翻译：提供由式（1）表示的化合物或其药理学上可接受的盐。（式中，A为C6-10亚芳基等; R1a，R1b和R1c各自独立地为氢原子，卤素原子，C1-4烷基，C1-4烷氧基等; R2为任选取代的C 6-10芳基，任选取代的5至12元单环或多环杂芳基，任选取代的C7-16芳烷基等; m为0等; n为0至 2.）

17. 发明申请

US20130217692A1 CYCLIC AMIDE DERIVATIVE 有权
标题翻译：循环酰胺衍生物
公开(公告)号：US20130217692A1
公开(公告)日：2013-08-22
申请号：US13819881
申请日：2011-09-02
申请人： Yoshihiro Horiuchi , Hiroaki Fujiwara , Hitoshi Suda , Izumi Sasaki , Mitsutaka Iwata , Kiyoto Sawamura
发明人： Yoshihiro Horiuchi , Hiroaki Fujiwara , Hitoshi Suda , Izumi Sasaki , Mitsutaka Iwata , Kiyoto Sawamura
IPC分类号： C07D409/06 , C07D295/155 , C07D277/56 , C07D213/50 , C07C233/74 , C07D333/38
CPC分类号： C07D409/06 , C07C233/74 , C07C235/84 , C07C255/57 , C07C2603/74 , C07D207/32 , C07D207/335 , C07D207/34 , C07D213/50 , C07D213/61 , C07D213/82 , C07D231/12 , C07D233/64 , C07D263/32 , C07D277/20 , C07D277/28 , C07D277/30 , C07D277/56 , C07D295/10 , C07D295/155 , C07D305/08 , C07D307/20 , C07D307/78 , C07D307/81 , C07D309/12 , C07D317/48 , C07D319/18 , C07D333/20 , C07D333/38 , C07D333/58 , C07D409/14
摘要： Provided is a compound represented by formula (1) or a pharmacologically acceptable salt thereof. (In the formula, A is C6-10 arylene, etc.; R1a, R1b and R1c each independently is a hydrogen atom, a halogen atom, a C1-4 alkyl group, a C1-4 alkoxy group, etc.; R2 is an optionally substituted C6-10 aryl group, an optionally substituted 5- to 12-membered monocyclic or polycyclic heteroaryl group, an optionally substituted C7-16 aralkyl group, etc.; m is 0, etc.; n is an integer of 0 to 2.)
摘要翻译：提供由式（1）表示的化合物或其药理学上可接受的盐。（式中，A为C6-10亚芳基等; R1a，R1b和R1c各自独立地为氢原子，卤素原子，C1-4烷基，C1-4烷氧基等; R2为任选取代的C 6-10芳基，任选取代的5至12元单环或多环杂芳基，任选取代的C7-16芳烷基等; m为0等; n为0至 2.）

18. 发明授权

US08450032B2 Electrophotographic photoreceptor, electrophotographic photoreceptor cartridge, and image-forming apparatus 有权
公开(公告)号：US08450032B2
公开(公告)日：2013-05-28
申请号：US12666651
申请日：2008-06-27
申请人： Kumiko Fujiwara , Teruyuki Mitsumori , Hiroaki Fujiwara
发明人： Kumiko Fujiwara , Teruyuki Mitsumori , Hiroaki Fujiwara
IPC分类号： G03G5/00
摘要： The invention provides an electrophotographic photoreceptor for use in an image-forming apparatus comprising a charging unit which charges an electrophotographic photoreceptor, an exposure unit which exposes the charged electrophotographic photoreceptor to light to form an electrostatic latent image on the electrophotographic photoreceptor, and a developing unit which develops the electrostatic latent image, wherein the electrophotographic photoreceptor comprises a conductive substrate and a photosensitive layer and the photosensitive layer contains a compound represented by the following formula (1).

19. 发明授权

US08272126B2 Method of producing circuit board 有权
标题翻译：电路板生产方法
公开(公告)号：US08272126B2
公开(公告)日：2012-09-25
申请号：US12431950
申请日：2009-04-29
申请人： Shingo Yoshioka , Hiroaki Fujiwara
发明人： Shingo Yoshioka , Hiroaki Fujiwara
IPC分类号： H05K3/02
CPC分类号： H05K3/184 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/15173 , H01L2924/15311 , H05K1/0206 , H05K1/023 , H05K1/0269 , H05K1/0284 , H05K1/11 , H05K1/162 , H05K3/0014 , H05K3/0032 , H05K3/107 , H05K3/381 , H05K3/4069 , H05K3/4647 , H05K3/4661 , H05K2201/09381 , H05K2201/096 , H05K2201/09736 , H05K2201/2072 , H05K2203/0108 , H05K2203/0565 , H05K2203/161 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00014 , H01L2924/00
摘要： An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film.
摘要翻译：本发明的一个方面的目的是提供一种电路板的制造方法，其能够高精度地保存电路剖面，并且通过加法处理给出具有所需深度的电路以准备精细电路。在本发明的一个方面中，制造多层电路板的方法包括：在绝缘性基板的表面上形成可溶胀树脂膜的成膜工序;形成电路槽的电路槽形成工序，其深度等于或大于可溶胀树脂膜的外表面上的可溶胀树脂膜的厚度，在电路槽的表面和可溶胀树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤，使用特定液体使溶胀性树脂膜溶胀，然后将所述溶胀树脂膜与所述绝缘性基板表面分离的膜分离工序，以及仅在所述镀催化剂或所述镀层的区域形成无电镀膜的电镀处理工序在可溶胀树脂膜分离之后，由电镀催化剂前体形成的催化剂保持未分离。

20. 发明申请

US20120206891A1 CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD 有权
标题翻译：电路板和具有安装在电路板上的组件的半导体器件
公开(公告)号：US20120206891A1
公开(公告)日：2012-08-16
申请号：US13504281
申请日：2010-10-28
申请人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
发明人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
IPC分类号： H05K7/06 , H05K1/02
CPC分类号： H05K1/111 , H01L21/4846 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/82385 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K3/107 , H05K3/184 , H05K3/38 , H05K2201/0373 , H05K2201/0391 , H05K2201/09736 , H05K2201/2072 , H05K2203/0307 , H05K2203/0565 , Y02P70/611 , Y10T29/49155 , H01L2924/00
摘要： A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.
摘要翻译：根据本发明的电路板H10是电路板H10，其中包括布线部分H6a和焊盘部分H6b的电路H6设置在绝缘基板H1的表面中。电路H6被配置为使得导体H5嵌入在形成在绝缘性基板H1的表面上的电路凹部H3中，并且导体H5的表面粗糙度在布线部H6a和焊盘部H6b中不同电路H6。在这种情况下，优选的是，焊盘部H6b中的导体H5的表面粗糙度大于布线部H6a中的导体H5的表面粗糙度。

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