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11. 发明授权

US08710653B2 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent 有权
标题翻译：片上半导体器件包括具有含有胺系固化剂的树脂的底层填充层
公开(公告)号：US08710653B2
公开(公告)日：2014-04-29
申请号：US13397098
申请日：2012-02-15
申请人： Masatoshi Fukuda , Hiroshi Watabe
发明人： Masatoshi Fukuda , Hiroshi Watabe
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L21/563 , H01L23/3135 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1412 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81444 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06568 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.
摘要翻译：一种半导体器件，包括：布线基板，安装在布线基板上的层叠体，填充在层叠体的各半导体芯片之间的间隙中的底部填充层; 以及由在层叠体的外部被覆盖并形成的成型树脂等构成的成型体。底部填充层由含有胺类固化剂的树脂材料的固化物构成，固化物的Tg为65℃以上且100℃以下。

12. 发明申请

US20130134583A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130134583A1
公开(公告)日：2013-05-30
申请号：US13477387
申请日：2012-05-22
申请人： Satoshi TSUKIYAMA , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
发明人： Satoshi TSUKIYAMA , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L24/81 , H01L21/50 , H01L23/3128 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/14151 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81139 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/83104 , H01L2224/83815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
摘要翻译：在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。第一和第二半导体芯片通过第一凸块连接部电连接。止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。接合突起接合到第一和第二半导体芯片。

13. 发明申请

US20060060912A1 Semiconductor memory device and manufacturing method thereof 有权
标题翻译：半导体存储器件及其制造方法
公开(公告)号：US20060060912A1
公开(公告)日：2006-03-23
申请号：US11247328
申请日：2005-10-12
申请人： Masaki Ishidao , Masahiro Kobayashi , Masatoshi Fukuda
发明人： Masaki Ishidao , Masahiro Kobayashi , Masatoshi Fukuda
IPC分类号： H01L29/788
CPC分类号： H01L21/28273 , G11C16/0475 , H01L29/7887
摘要： A polysilicon film and the like are patterned to form n-diffusion layers on a silicon substrate. Subsequently, an outer edge of an Al2O3 film is made retreat to be smaller than that of a gate electrode by performing isotropic etching of the Al2O3 film, using a solution of sulfuric acid with hydrogen peroxide. A silicon oxide film, a silicon nitride film, the polysilicon film and the like are hardly removed although the solution of sulfuric acid with hydrogen peroxide exhibits higher etching rate to the Al2O3 film, enabling almost exclusive etching of the Al2O3 film at a high selectivity ratio. Subsequently, another polysilicon film is formed so as to fill spaces formed after the retreat of the Al2O3 film under the silicon oxide film. Subsequently, a sidewall insulating film is formed by remaining portions of the later polysilicon film in the spaces by performing RIE, oxidation, or the like of the later polysilicon film.
摘要翻译：图案化多晶硅膜等，以在硅衬底上形成n扩散层。随后，通过对Al 2 O 3膜进行各向同性蚀刻，使Al 2 O 3膜的外边缘退回到小于栅电极的外边缘，使用硫酸与过氧化氢的溶液进行反应。尽管硫酸与过氧化氢的溶液表现出较高的蚀刻速率，但是Al 2 O 3 O 3不能除去氧化硅膜，氮化硅膜，多晶硅膜等， SUB>膜，使得能够以高选择比几乎独特地蚀刻Al 2 O 3膜。随后，形成另外的多晶硅膜，以填充氧化硅膜下的Al 2 O 3 N 3膜后退形成的空间。随后，通过进行稍后多晶硅膜的RIE，氧化等，在剩余的多晶硅膜的剩余部分中形成侧壁绝缘膜。

14. 发明授权

US06333212B1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06333212B1
公开(公告)日：2001-12-25
申请号：US09707850
申请日：2000-11-08
申请人： Jun Ohmori , Hiroshi Iwasaki , Takuya Takahashi , Takanori Jin , Masatoshi Fukuda
发明人： Jun Ohmori , Hiroshi Iwasaki , Takuya Takahashi , Takanori Jin , Masatoshi Fukuda
IPC分类号： H01L2144
CPC分类号： H01L23/3121 , H01L23/49531 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/45099 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.
摘要翻译：公开了一种厚度为1mm以下的半导体器件，其包括厚度为0.1mm至0.25mm的框架板主体，设置在框架板主体的第一表面上并具有厚度在0.2mm至0.3mm的范围内，外部连接引线，其一端连接到框架板主体的第一表面的周边部分，其另一端延伸到框架主体的外部电连接半导体芯片的电极和外部连接引线的端部的连接部分的接合线，以及用于覆盖和密封至少包括半导体芯片，接合线和连接部分。

15. 发明授权

US5902320A Surgical needle, production method thereof, and needle holder 失效
标题翻译：手术针，其制造方法和针架
公开(公告)号：US5902320A
公开(公告)日：1999-05-11
申请号：US924659
申请日：1997-09-05
申请人： Kanji Matsutani , Masatoshi Fukuda , Katsutoshi Sato , Akira Saito
发明人： Kanji Matsutani , Masatoshi Fukuda , Katsutoshi Sato , Akira Saito
IPC分类号： A61B17/04 , A61B17/06 , A61B18/14
CPC分类号： A61B17/06066 , A61B17/06004 , A61B17/062 , A61B17/0625 , A61B18/1442 , A61B2017/06019 , A61B2017/06028 , A61B2017/06047 , A61B2017/06085
摘要： The present invention provides a surgical needle having a needle tip end and a clamping portion to be clamped by a needle holder for applying a current, whereinthe needle tip end is made from a conductive material which is electrically connected to a conductive material of the clamping portion,an insulating layer is provided over the clamping portion and a tip surrounding portion of the surgical needle, whereas at least the needle tip end is electrically exposed, andwhen the insulating material over the clamping portion is clamped by the needle holder, the conductive material of the clamping portion is electrically connected to the needle holder.
摘要翻译：本发明提供了一种外科用针，其具有针尖端和夹持部分，用于夹持用于施加电流的针保持器，其中针尖端由导电材料制成，导电材料电连接到夹持的导电材料在夹持部分上设置有绝缘层和手术针头的尖端周围部分，而至少针头末端被电暴露，并且当夹持部分上的绝缘材料被针保持器夹紧时，导电夹持部的材料电连接到针保持器。

16. 发明授权

US5022857A Dental burr and dental handpiece 失效
标题翻译：牙科毛刺和牙科手机
公开(公告)号：US5022857A
公开(公告)日：1991-06-11
申请号：US287116
申请日：1988-12-21
申请人： Kanji Matsutani , Masatoshi Fukuda
发明人： Kanji Matsutani , Masatoshi Fukuda
IPC分类号： A61C1/05 , A61C1/14 , A61C3/02
CPC分类号： A61C3/02 , A61C1/055 , A61C1/141
摘要： A dental burr has an axis of rotation and a cooling water passage extending therethrough in coaxial relation to the dental burr. The cooling water passage opens to a front end face of the dental burr, and this opening in the front end of the dental burr is disposed in an area including the axis of rotation of the dental burr. A dental handpiece for rotatably holding a dental burr includes a handgrip portion, a hollow head portion provided at a front end of the handgrip portion, and a cooling water passage. This cooling water passage extends along the handgrip portion,and opens at one end to a rear end of the handgrip portion while the other end thereof is connected to an internal space of the head portion. Part of the internal space serves as a passage for communicating the cooling water passage of the dental handpiece with the cooling water passage of the dental burr held by the dental handpiece.

17. 发明申请

US20160022264A1 Medical Suture Needle 审中-公开
标题翻译：医用缝线针
公开(公告)号：US20160022264A1
公开(公告)日：2016-01-28
申请号：US12810547
申请日：2008-12-24
申请人： Masaaki Matsutani , Shouichi Fukuda , Masatoshi Fukuda , Shinichi Akutsu , Kazuaki Kato , Shinichi Yano
发明人： Masaaki Matsutani , Shouichi Fukuda , Masatoshi Fukuda , Shinichi Akutsu , Kazuaki Kato , Shinichi Yano
IPC分类号： A61B17/06
CPC分类号： A61B17/06004 , A61B17/06066 , A61B2017/06028 , A61B2017/06033
摘要： The problem that a metal wire joined integrally to a hole formed in a proximal end face of a medical suture needle is susceptible to bending damage is reduced.A suture needle A has a blind hole 5 which is formed in a proximal end face 3, inserts the end of a wire 10 thereinto, and joins the wire 10 thereto by caulking, and a counterbore 6 which is formed on the proximal end face 3 side of the blind hole 5 and has a dimension D at least in the proximal end face 3 larger than a dimension d of the blind hole 5 and a depth L smaller than a depth of a caulked portion with respect to the blind hole 5. A suture needle with wire inserts the end of the wire 10 into the blind hole 5 to caulk the outer circumference of the suture needle corresponding to the blind hole 5, thereby integrally joins the wire 10 thereto.
摘要翻译：与形成在医用缝合针的基端面上的孔整体接合的金属丝容易受到弯曲损伤的问题减少。缝合针A具有形成在基端面3上的盲孔5，将线10的端部插入其中，并且通过铆接将线10接合到其上，并且形成在基端面3上的沉孔6 并且具有至少在近端面3中的尺寸D大于盲孔5的尺寸d，并且具有小于相对于盲孔5的铆接部的深度的深度L. 具有线的缝合针将线10的端部插入盲孔5中以堵塞与盲孔5相对应的缝合针的外周，从而将线10一体地连接到其上。

18. 发明申请

US20120119326A1 CAPACITOR AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：电容器和半导体器件
公开(公告)号：US20120119326A1
公开(公告)日：2012-05-17
申请号：US13207728
申请日：2011-08-11
申请人： Tsuyoshi Sugisaki , Masatoshi Fukuda
发明人： Tsuyoshi Sugisaki , Masatoshi Fukuda
IPC分类号： H01L29/92 , H01G4/005
CPC分类号： H01G4/005 , H01G4/01 , H01G11/30 , H01L23/5223 , H01L23/5225 , H01L28/86 , H01L2924/0002 , Y02E60/13 , H01L2924/00
摘要： A capacitor includes first electrode patterns and second electrode patterns disposed alternately on a plane, each of the first electrode patterns having a linear shape and extending in a first direction from a first end to a third end with a first length, each of the second electrodes having a linear shape and extending in said first direction from a second end to a fourth end with a second length shorter than the first length, a first wiring pattern supplying a first voltage to the first electrode patterns by first via-plugs, and a second wiring pattern supplying a second voltage to the second electrode patterns by second via-plugs, wherein the first end of the first electrode pattern extends beyond the second end of the second electrode pattern and the third end of the first electrode pattern extends beyond the fourth end of said the electrode.
摘要翻译：电容器包括交替地设置在平面上的第一电极图案和第二电极图案，每个第一电极图案具有直线形状并且在第一方向上从第一端延伸到具有第一长度的第三端，每个第二电极具有线性形状并且在所述第一方向上从第二端延伸到具有比所述第一长度短的第二长度的第四端;第一布线图案，通过第一通孔插头向所述第一电极图案提供第一电压，第二布线图案布线图案通过第二通孔将第二电压提供给第二电极图案，其中第一电极图案的第一端延伸超过第二电极图案的第二端，并且第一电极图案的第三端延伸超过第四端的电极。

19. 发明申请

US20090326637A1 Stent 有权
标题翻译：支架
公开(公告)号：US20090326637A1
公开(公告)日：2009-12-31
申请号：US12375851
申请日：2007-07-06
申请人： Yasushi Hashimoto , Masaaki Matsutani , Masatoshi Fukuda
发明人： Yasushi Hashimoto , Masaaki Matsutani , Masatoshi Fukuda
IPC分类号： A61F2/06
CPC分类号： A61F2/86 , A61F2/88 , A61F2/89 , A61F2220/0058
摘要： In a stent which joins a plurality of stent components by a strut, even when the repeated bending acts on the stent for a long period, the breaking of the strut can be prevented.In a stent 1 having a joining portion 7 which integrally joins a stent main wire 2 and a strut 4, the stent main wire 2 and the strut 4 are fitted into a restraining pipe 8 in a non-joining portion of the stent main wire 2 and the strut 4 near the end of the joining portion 7. The relative movement of the stent main wire 2 and the strut 4 is restrained. The amount of movement of the strut 4 relative to the stent main wire 2 can be decreased to reduce fatigue.
摘要翻译：在通过支柱连接多个支架部件的支架中，即使当反复弯曲长时间作用在支架上时，也可以防止支柱的断裂。在具有与支架主线2和支柱4一体连接的接合部7的支架1中，支架主线2和支柱4嵌合在支架主线2的非接合部的约束管8中支柱4靠近接合部7的端部。支架主线2和支柱4的相对运动受到限制。可以减小支柱4相对于支架主线2的移动量，以减少疲劳。

20. 发明申请

US20060191974A1 Surgical stapler 有权
标题翻译：手术吻合器
公开(公告)号：US20060191974A1
公开(公告)日：2006-08-31
申请号：US11357814
申请日：2006-02-21
申请人： Kanji Matsutani , Masatoshi Fukuda , Toshiharu Kamei , Takashi Ina
发明人： Kanji Matsutani , Masatoshi Fukuda , Toshiharu Kamei , Takashi Ina
IPC分类号： A61B17/10
CPC分类号： A61B17/0684 , A61B34/76 , A61B2090/0811
摘要： A surgical stapler has a body capable of containing a plurality of staples in an aligned state; a ram provided inside said body, having a central concave portion and pressure armatures on both sides of the concave portion; an anvil that, when the armatures of said ram contact both sides of a crown of a staple, forces the center of the crown into the concave portion of the ram; and a trigger rotatably supported on the body so as to cause relative movement between the ram and the anvil. A moving member strikes another member so as to produce a sound or a sensation of impact after a staple sandwiched between the ram and the anvil is bent by the advance of the anvil into the concave portion of the ram and bending of the staple is completed.
摘要翻译：手术吻合器具有能够容纳处于对准状态的多个钉的主体; 设置在所述主体内的冲头，在所述凹部的两侧具有中心凹部和压力衔铁; 砧座，当所述柱塞的电枢接触订书钉的冠部的两侧时，迫使冠部的中心进入压头的凹部; 以及触发器，其被可旋转地支撑在所述主体上，以便在所述压头和所述砧座之间产生相对运动。移动构件撞击另一构件，以便在夹在砧座和砧座之间的钉子被砧座前进到冲头的凹部中弯曲的钉子之后产生冲击的声音或感觉，并且钉子的弯曲完成。

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