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11. 发明申请

US20050183845A1 Remedies to prevent cracking in a liquid system 失效
公开(公告)号：US20050183845A1
公开(公告)日：2005-08-25
申请号：US11111536
申请日：2005-04-20
申请人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas Kenny , James Shook
发明人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas Kenny , James Shook
IPC分类号： F04B17/00 , F28D15/02 , F28F19/00 , H01L23/473 , H05K7/20 , F16B1/00 , F25B39/02 , F28F7/00
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

12. 发明申请

US20050183443A1 Remedies to prevent cracking in a liquid system 有权
公开(公告)号：US20050183443A1
公开(公告)日：2005-08-25
申请号：US11111133
申请日：2005-04-20
申请人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas Kenny , James Shook
发明人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas Kenny , James Shook
IPC分类号： F04B17/00 , F28D15/02 , F28F19/00 , H01L23/473 , H05K7/20 , F25D11/00 , F25B1/00
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

13. 发明授权

US07000684B2 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US07000684B2
公开(公告)日：2006-02-21
申请号：US10680584
申请日：2003-10-06
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

14. 发明申请

US20060042785A1 Pumped fluid cooling system and method 审中-公开
标题翻译：泵送流体冷却系统及方法
公开(公告)号：US20060042785A1
公开(公告)日：2006-03-02
申请号：US10927800
申请日：2004-08-27
申请人： Douglas Werner , Kenneth Goodson , Mark Munch , Girish Upadhya
发明人： Douglas Werner , Kenneth Goodson , Mark Munch , Girish Upadhya
IPC分类号： F28F7/00
CPC分类号： F28F9/0263 , F28F3/12 , F28F2260/02
摘要： The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.
摘要翻译：本发明是一种泵送流体冷却系统和方法。泵送流体冷却系统和方法包括泵送流体系统的电阻的平流，对流和扩散分量的相对量级。泵送流体冷却系统和方法还包括调整工作流体的化学成分，特别是调整组成和粘度，因为每单位流体热容量的敏感度增加。

15. 发明授权

US08157001B2 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US08157001B2
公开(公告)日：2012-04-17
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： G05D23/00 , F28F7/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.
摘要翻译：集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

16. 发明申请

US20070227708A1 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US20070227708A1
公开(公告)日：2007-10-04
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

17. 发明授权

US08464781B2 Cooling systems incorporating heat exchangers and thermoelectric layers 有权
标题翻译：包括热交换器和热电层的冷却系统
公开(公告)号：US08464781B2
公开(公告)日：2013-06-18
申请号：US11582657
申请日：2006-10-17
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20 , F25B21/02
CPC分类号： F04B17/00 , F04B19/006 , F25B21/02 , F25B2321/0252 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/02 , F28F2260/02 , G06F1/20 , G06F2200/201 , G06Q20/20 , H01L23/38 , H01L23/473 , H01L23/4735 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.
摘要翻译：用于冷却热源的系统包括流体热交换器，泵，热电装置和散热器。热电装置包括冷却部和加热部。散热器构造成与热电装置的加热部分的至少一部分热接触。泵与流体热交换器联接并且构造成使流体通过其中。热电装置与冷却系统中的热交换器一起构成。

18. 发明授权

US07077634B2 Remedies to prevent cracking in a liquid system 有权
标题翻译：补救措施以防止液体系统中的开裂
公开(公告)号：US07077634B2
公开(公告)日：2006-07-18
申请号：US11111133
申请日：2005-04-20
申请人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas W. Kenny , James Gill Shook
发明人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas W. Kenny , James Gill Shook
IPC分类号： F04B43/08
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.
摘要翻译：提供使用最小尺寸和体积的外壳，气穴，可压缩物体和柔性物体的液体冷却系统，以防止冻结时水性溶液的膨胀。在这种系统中，管道，泵和热交换器被设计成防止其外壳和腔室的破裂。还描述了防止液体冷却系统中的裂纹的方法。在所有这些情况下，系统必须设计成在水冻结时容忍膨胀。

19. 发明申请

US20060180300A1 Pump and fan control concepts in a cooling system 有权
标题翻译：冷却系统中的泵和风扇控制概念
公开(公告)号：US20060180300A1
公开(公告)日：2006-08-17
申请号：US11400347
申请日：2006-04-06
申请人： Daniel Lenehan , Kenneth Goodson , Thomas Kenny , Mark Munch , Saroj Sahu
发明人： Daniel Lenehan , Kenneth Goodson , Thomas Kenny , Mark Munch , Saroj Sahu
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/34 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates in a concerted manner, while minimizing power consumption, noise, and noise transients. The apparatus further includes at least one heat-generating device, at lease one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans.
摘要翻译：公开了一种用于冷却冷却系统中的发热装置的方法和装置。该装置包括各种传感器，控制方案和热模型，以一致的方式控制泵流量和风扇流量，同时最小化功耗，噪声和噪声瞬变。该装置还包括至少一个热产生装置，至少一个热交换器和至少一个热排出器。该设备还可以包括许多泵和风扇。

20. 发明授权

US07344363B2 Remedies to prevent cracking in a liquid system 有权
公开(公告)号：US07344363B2
公开(公告)日：2008-03-18
申请号：US11111520
申请日：2005-04-20
申请人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas W. Kenny , James Gill Shook
发明人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas W. Kenny , James Gill Shook
IPC分类号： F04C21/00 , E03B7/10 , F01B19/00
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

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