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    • 12. 发明授权
    • Memory cell
    • 存储单元
    • US06998672B2
    • 2006-02-14
    • US10779557
    • 2004-02-06
    • Franz HofmannJosef Willer
    • Franz HofmannJosef Willer
    • H01L29/788
    • H01L29/7923
    • A memory cell having a source region, a drain region, a source-end control gate, a drain-end control gate, an injection gate arranged between the source-end control gate and the drain-end control gate, a source-end storage element arranged in the source-end control gate, and a drain-end storage element arranged in the drain-end control gate. To program the memory cell, a low electrical voltage is applied to the injection gate, and a high electrical voltage is applied to the control gates.
    • 具有源极区域,漏极区域,源极端子控制栅极,漏极端子控制栅极,配置在源极端子控制栅极和漏极端子控制栅极之间的注入栅极的存储单元,源极端子存储器 排列在源极端控制栅极中的漏极端存储元件,以及布置在漏极端控制栅极中的漏极端存储元件。 为了对存储单元进行编程,将低电压施加到注入栅极,并且高电压被施加到控制栅极。
    • 13. 发明授权
    • Integrated circuit configuration and method for manufacturing it
    • 集成电路配置及其制造方法
    • US06576948B2
    • 2003-06-10
    • US09873231
    • 2001-06-04
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • H01L27108
    • H01L27/108
    • An integrated circuit contains a planar first transistor and a diode. The diode is connected between a first source/drain region of the first transistor and a gate electrode of the first transistor such that a charge is impeded from discharging from the gate electrode to the first source/drain region. A diode layer that is part of the diode is disposed on a portion of the first source/drain region. A conductive structure that is an additional part of the diode is disposed above a portion of the gate electrode and is disposed on the diode layer. The diode can be configured as a tunnel diode. The diode layer can be produced by thermal oxidation. Only one mask is required for producing the diode. A capacitor can be disposed above the diode. The first capacitor electrode of the capacitor is connected to the conductive structure.
    • 集成电路包含平面第一晶体管和二极管。 二极管连接在第一晶体管的第一源极/漏极区域和第一晶体管的栅电极之间,使得电荷被阻止从栅电极放电到第一源极/漏极区域。 作为二极管的一部分的二极管层设置在第一源极/漏极区域的一部分上。 作为二极管的附加部分的导电结构设置在栅电极的一部分上方并且设置在二极管层上。 二极管可以配置为隧道二极管。 二极管层可以通过热氧化生产。 制造二极管只需要一个掩模。 电容器可以设置在二极管的上方。 电容器的第一电容器电极连接到导电结构。
    • 17. 发明授权
    • Electrically programmable memory cell configuration and method for fabricating it
    • 电可编程存储单元配置及其制造方法
    • US06639269B1
    • 2003-10-28
    • US09648952
    • 2000-08-25
    • Franz HofmannJosef Willer
    • Franz HofmannJosef Willer
    • H01L218247
    • H01L27/11526H01L27/11546H01L29/42336H01L29/66825H01L29/7883
    • A memory cell contains a planar transistor whose channel region is disposed at a bottom of a depression in a substrate. A floating gate electrode of the transistor adjoins the bottom of the depression, the bottom being provided with a first dielectric disposed on sidewalls of the depression. Since the floating gate electrode has a larger area than the channel region, a capacitance formed by a control gate electrode applied on the floating gate electrode and the floating gate electrode is greater than a capacitance formed by the floating gate electrode and the channel region. Two source/drain regions of the transistor likewise adjoin the sidewalls of the depression. An insulation, which is thicker than the first dielectric, isolates the floating gate electrode from the source/drain regions, so that the source/drain regions do not contribute to the coupling ratio.
    • 存储单元包含平面晶体管,其沟道区设置在衬底中的凹陷的底部。 晶体管的浮置栅电极邻接凹陷的底部,底部设置有设置在凹陷的侧壁上的第一电介质。 由于浮栅电极具有比沟道区更大的面积,所以由施加在浮置栅电极和浮置栅电极上的控制栅电极形成的电容大于由浮栅电极和沟道区形成的电容。 晶体管的两个源极/漏极区同样邻接凹陷的侧壁。 比第一电介质厚的绝缘体将浮置栅极与源极/漏极区隔离,使得源极/漏极区域对耦合比没有贡献。
    • 20. 发明授权
    • Method for fabricating a memory cell
    • 用于制造存储单元的方法
    • US06399433B2
    • 2002-06-04
    • US09773218
    • 2001-01-31
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • H01L218242
    • H01L27/10852H01L27/10817H01L28/55
    • A method for producing a storage cell includes forming a polycrystalline silicon layer on a semiconductor body having at least one selection transistor disposed in a first plane. An interspace is formed between two adjacent structures of the layer and one of the adjacent structures of the layer is placed on a surface of a first silicon plug. A cell plate electrode is formed in the interspace and a trench is formed in the layer. The trench reaches as far as the first plug surface and is filled with an insulating layer. The-layer is removed. A storage capacitor having a high-epsilon or ferroelectric dielectric and a storage node electrode is formed. The capacitor is disposed in a second plane in and above the body. The insulating layer is replaced with silicon to form a second silicon plug directly connected to the first plug. The second plug is electrically connected to the storage node electrode, and the first plane is electrically connected to the second plane through the first and second plugs.
    • 一种存储单元的制造方法包括在半导体本体上形成多晶硅层,该多晶硅层具有设置在第一平面中的至少一个选择晶体管。 在层的两个相邻结构之间形成间隙,并且该层的相邻结构之一被放置在第一硅插头的表面上。 在该间隙中形成单元板电极,并在该层中形成沟槽。 沟槽达到第一插头表面的最远处,并且填充有绝缘层。 该层被删除。 形成具有高ε或铁电介质的存储电容器和存储节点电极。 电容器设置在身体内和上方的第二平面内。 绝缘层被硅替代以形成直接连接到第一插头的第二硅插头。 第二插头电连接到存储节点电极,第一平面通过第一和第二插头电连接到第二平面。