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11. 发明授权

US08393712B2 Chevron ejection chips for micro-fluid applications 有权
标题翻译：雪佛龙喷射芯片用于微流体应用
公开(公告)号：US08393712B2
公开(公告)日：2013-03-12
申请号：US12822233
申请日：2010-06-24
申请人： Jiandong Fang , Frank Anderson , Richard Corley
发明人： Jiandong Fang , Frank Anderson , Richard Corley
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2/14145 , B41J2/16 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1646 , B41J2002/14419 , B41J2002/14459 , B41J2202/20
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias skewed variously to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。芯片具有沿多个流体通道排列的流体发射元件，各种不同的倾斜状态使得能够无缝地缝合流体喷射。激发元件通电以喷射流体，并且单个的元件根据颜色或流体类型间隔开。重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。可变芯片尺寸和形状（包括人字形）被公开为不同颜色的液体通孔之间的关系。倾斜角度各不相同，具有明显的优点。从较大的晶片制造芯片可以提供更多的实施例，因为晶片的使用增加。

12. 发明授权

US08430484B2 Nozzle covering for ejection chips in micro-fluid applications 有权
标题翻译：用于微流体应用中喷射芯片的喷嘴盖
公开(公告)号：US08430484B2
公开(公告)日：2013-04-30
申请号：US12824358
申请日：2010-06-28
申请人： Jiandong Fang
发明人： Jiandong Fang
IPC分类号： B41J2/05
CPC分类号： B41J2/1404 , B41J2202/19 , B41J2202/20
摘要： A micro-fluid ejection head conveys fluid to firing elements at differing heights in differing layers. The ejection head includes a base substrate. The firing elements are configured on the substrate to eject fluid upon activation. Individual elements are arrayed closer or farther to a common fluid via. A multiple-layer covering on the substrate defines nozzles openings corresponding to each firing element. A lower layer of the covering directs fluid to either the closer or farther elements while a higher layer directs fluid to the other elements. The lower and higher layers define channels to direct the fluid from the fluid via. The higher layer covers the channels in the lower layer, while a topmost layer covers the channels in the higher layer. Also, the topmost layer defines the nozzle openings in large and small opening sizes. Holes in the underlying layers register with the nozzle openings, but are oppositely sized.
摘要翻译：微流体喷射头将流体输送到不同高度的不同高度的发射元件。喷射头包括基底。激发元件配置在基板上以在激活时喷射流体。单独的元件被排列成更接近或更远地与普通的流体通道。衬底上的多层覆盖物限定了与每个击发元件对应的喷嘴开口。覆盖层的下层将流体引导到更靠近或更远的元件，而较高层将流体引导到其它元件。下层和更高层限定了将流体从流体通道引导的通道。较高层覆盖下层中的通道，而最上层覆盖较高层中的通道。此外，最上层限定了大而小的开口尺寸的喷嘴开口。底层中的孔与喷嘴开口对齐，但尺寸相反。

13. 发明授权

US08657411B2 Fluid ejection device and method for fabricating fluid ejection device 有权
标题翻译：流体喷射装置和制造流体喷射装置的方法
公开(公告)号：US08657411B2
公开(公告)日：2014-02-25
申请号：US13160568
申请日：2011-06-15
申请人： Frank Anderson , Jiandong Fang
发明人： Frank Anderson , Jiandong Fang
IPC分类号： B41J2/14 , B41J2/05
CPC分类号： B41J2/162 , B41J2/1433 , B41J2/1606 , B41J2/1632
摘要： Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles. Further, the fluid ejection device includes a flow feature layer. The flow feature layer includes a plurality of flow features. The fluid ejection device further includes an ejection unit. The ejection unit includes a first layer. The first layer includes a plurality of fluid vias. Further, the ejection unit includes a second layer. The second layer includes a plurality of fluid channels. Further, the second layer is attached to the first layer through a first intermediate silicon oxide layer. The ejection unit also includes a third layer. The third layer includes a plurality of ports. The third layer is also attached to the second layer through a second intermediate silicon oxide layer. Further disclosed are an ejection unit for a fluid ejection device and a method for fabricating the fluid ejection device.
摘要翻译：公开了一种包括喷嘴板的流体喷射装置。喷嘴板包括多个喷嘴。此外，流体喷射装置包括流动特征层。流动特征层包括多个流动特征。流体喷射装置还包括喷射单元。喷射单元包括第一层。第一层包括多个流体通孔。此外，喷射单元包括第二层。第二层包括多个流体通道。此外，第二层通过第一中间氧化硅层附着到第一层。喷射单元还包括第三层。第三层包括多个端口。第三层也通过第二中间氧化硅层附着到第二层。还公开了一种用于流体喷射装置的喷射单元和用于制造流体喷射装置的方法。

14. 发明申请

US20120293584A1 FLUID EJECTION DEVICES AND METHODS FOR FABRICATING FLUID EJECTION DEVICES 有权
标题翻译：流体喷射装置和用于制造流体喷射装置的方法
公开(公告)号：US20120293584A1
公开(公告)日：2012-11-22
申请号：US13112278
申请日：2011-05-20
申请人： Jiandong Fang , Xiaoming Wu
发明人： Jiandong Fang , Xiaoming Wu
IPC分类号： B41J2/135 , B05D3/10 , C23F1/02
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature to layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
摘要翻译：公开了一种用于喷墨打印机的流体喷射装置，其包括具有构造在基板的底部内的至少一个流体流动通道的基板。通过蚀刻底部部分来配置至少一个流体流动通道的每个流体流动通道。衬底还包括配置在衬底的顶部部分内的多个流体流动通孔。通过蚀刻顶部部分来配置多个流体流动通孔的每个流体流通道。每个流体流动通道进一步构造成通过各向同性蚀刻的空腔与相应的流体流动通道流体连通，每个流体流动通道配置在每个流体流动下方并流体耦合到相应的流体流动通道。流体喷射装置还包括到层的流动特征和喷嘴板。进一步公开了制造流体喷射装置的方法。

15. 发明申请

US20120274707A1 EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES 审中-公开
标题翻译：用于喷墨打印机的喷射装置和用于制造喷射装置的方法
公开(公告)号：US20120274707A1
公开(公告)日：2012-11-01
申请号：US13097594
申请日：2011-04-29
申请人： Xiaorong Cai , Jiandong Fang , Xiaoming Wu , Elaine Yeap Money , Eunki Hong , Yimin Guan , Burton Joyner, II , Sean Terrance Weaver , David Graham , Zach Reitmeier
发明人： Xiaorong Cai , Jiandong Fang , Xiaoming Wu , Elaine Yeap Money , Eunki Hong , Yimin Guan , Burton Joyner, II , Sean Terrance Weaver , David Graham , Zach Reitmeier
IPC分类号： B41J2/14 , B23P17/00
CPC分类号： B41J2/1628 , B41J2/14032 , B41J2/1603 , B41J2/1606 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/164 , Y10T29/49401
摘要： Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.
摘要翻译：公开了一种喷墨打印机的喷射装置，其包括具有基板和至少一个流体喷射元件的喷射芯片。喷射装置还包括配置在喷射芯片上的流体结构。流体结构包括由有机材料构成并包括多个喷嘴的喷嘴板。流体结构还包括配置在喷射芯片和喷嘴板之间的流动特征层。流动特征层由有机材料组成并且包括多个流动特征。此外，流体结构包括封装喷嘴板的衬垫层。衬垫层还至少部分地封装多个流动特征的每个流动特征。衬层由无机材料构成。进一步公开了一种制造喷射装置的方法。

16. 发明授权

US09079409B2 Fluid ejection devices 有权
标题翻译：流体喷射装置
公开(公告)号：US09079409B2
公开(公告)日：2015-07-14
申请号：US13172904
申请日：2011-06-30
申请人： Jiandong Fang , Paul Graf , Andrew McNees
发明人： Jiandong Fang , Paul Graf , Andrew McNees
IPC分类号： B41J2/145 , B41J2/175 , B41J2/14
CPC分类号： B41J2/1433 , B41J2/1404 , B41J2/145 , B41J2/175
摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate. The substrate includes at least one trench and a plurality of fluid flow vias configured in at least three parallel rows arranged over each trench of the at least one trench. Each row of the at least three parallel rows includes a set of fluid flow vias from the plurality of fluid flow vias arranged in one of a uniform manner and a non-uniform manner such that each fluid flow via of the set of fluid flow vias is configured in a spaced-apart relation with an adjacent fluid flow via. The each fluid flow via is configured in a diagonal relationship relative to a neighboring fluid flow via of an adjacent row of the at least three parallel rows. The fluid ejection device also includes a flow feature layer and a nozzle plate.
摘要翻译：公开了一种包括基板的用于喷墨打印机的流体喷射装置。衬底包括至少一个沟槽和多个流体流动通孔，其配置在至少三个平行的行中，排列在至少一个沟槽的每个沟槽上。所述至少三个平行排中的每一行包括从所述多个流体流动通孔中的一组流体流动通孔以均匀方式和不均匀的方式之一布置，使得所述一组流体流动通孔的每个流体流动通道为与相邻的流体流动通道以间隔开的关系构造。每个流体流动通道相对于至少三个平行行的相邻行的相邻流体流动通道以对角关系构造。流体喷射装置还包括流动特征层和喷嘴板。

17. 发明授权

US08430482B2 Singulating ejection chips for micro-fluid applications 有权
标题翻译：用于微流体应用的单独排出芯片
公开(公告)号：US08430482B2
公开(公告)日：2013-04-30
申请号：US12893124
申请日：2010-09-29
申请人： Jiandong Fang , Carl Edmond Sullivan , Richard E. Corley
发明人： Jiandong Fang , Carl Edmond Sullivan , Richard E. Corley
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1601 , B41J2/1607 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1635
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged to seamlessly stitch together fluid ejections from adjacent chips. Each chip aligns with other chips at peripheral regions having edge tolerances closer than elsewhere along the periphery. The tolerances result from both etching and dicing during chip singulation. Etching occurs at the areas of alignment. Dicing occurs elsewhere. Etching techniques include deep reactive ion etching or wet etching. It cuts a planar periphery through an entire thickness of the wafer. The etching may also occur simultaneously with etching a fluid via. Dicing techniques include blade, laser or ion beam. It cuts an entire remainder of the periphery connecting the portions already etched to free single chips from the wafer. Edge tolerances, planar shapes, dicing lines, etch patterns, and wafer layout provide still further embodiments.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。芯片具有布置成将来自相邻芯片的流体喷射无缝缝合的流体点火元件。每个芯片与周边区域的其他芯片对准，其边缘容限比其他地方沿边缘更近。在芯片单片化期间由于蚀刻和切割都产生公差。蚀刻发生在对准区域。切片发生在其他地方。蚀刻技术包括深反应离子蚀刻或湿蚀刻。它通过晶片的整个厚度切割平面周边。蚀刻也可以在蚀刻流体通孔的同时进行。切割技术包括刀片，激光或离子束。它切割周边的整个剩余部分，连接已经被蚀刻的部分以从晶片释放单个芯片。边缘公差，平面形状，切割线，蚀刻图案和晶片布局提供了另外的实施例。

18. 发明授权

US08414108B2 Ejection chip for micro-fluid applications 有权
标题翻译：用于微流体应用的喷射芯片
公开(公告)号：US08414108B2
公开(公告)日：2013-04-09
申请号：US12916796
申请日：2010-11-01
申请人： Jiandong Fang
发明人： Jiandong Fang
IPC分类号： B41J2/135
CPC分类号： B41J2/14145
摘要： Disclosed is an ejection chip for an inkjet printhead that includes at least one fluid via configured on the ejection chip for supplying fluid to one or more ejecting elements of the ejection chip. Each fluid via of the at least one fluid via includes a plurality of end-to-end coupled segments. Each segment of the plurality of end-to-end coupled segments is aligned at a skew angle with a consecutive segment. Further, the ejection chip includes a plurality of nozzles configured along a length of the each segment of the plurality of end-to-end coupled segments with a first nozzle spatial density. The configuration of the plurality of nozzles facilitates in achieving a predetermined print resolution with the first nozzle spatial density.
摘要翻译：公开了一种用于喷墨打印头的喷射芯片，其包括配置在喷射芯片上的至少一个流体通道，用于将流体供应到喷射芯片的一个或多个喷射元件。至少一个流体通路的每个流体通路包括多个端对端耦合段。多个端对端耦合段中的每个段与连续的段以一斜角对准。此外，喷射芯片包括沿着多个端对端耦合段的每个段的长度配置的多个喷嘴，其具有第一喷嘴空间密度。多个喷嘴的配置有助于以第一喷嘴空间密度实现预定的打印分辨率。

19. 发明授权

US08888242B2 Fluid ejection devices and methods for fabricating fluid ejection devices 有权
标题翻译：流体喷射装置和用于制造流体喷射装置的方法
公开(公告)号：US08888242B2
公开(公告)日：2014-11-18
申请号：US13112278
申请日：2011-05-20
申请人： Jiandong Fang , Xiaoming Wu
发明人： Jiandong Fang , Xiaoming Wu
IPC分类号： B41J2/135
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
摘要翻译：公开了一种用于喷墨打印机的流体喷射装置，其包括具有构造在基板的底部内的至少一个流体流动通道的基板。通过蚀刻底部部分来配置至少一个流体流动通道的每个流体流动通道。衬底还包括配置在衬底的顶部部分内的多个流体流动通孔。通过蚀刻顶部部分来配置多个流体流动通孔的每个流体流通道。每个流体流动通道进一步构造成通过各向同性蚀刻的空腔与相应的流体流动通道流体连通，每个流体流动通道配置在每个流体流动下方并流体耦合到相应的流体流动通道。流体喷射装置还包括流动特征层和喷嘴板。进一步公开了制造流体喷射装置的方法。

20. 发明授权

US08616680B2 Partitioned array ejection chips for micro-fluid applications 失效
标题翻译：用于微流体应用的分区阵列喷射芯片
公开(公告)号：US08616680B2
公开(公告)日：2013-12-31
申请号：US12847233
申请日：2010-07-30
申请人： Jiandong Fang , Paul William Graf
发明人： Jiandong Fang , Paul William Graf
IPC分类号： B41J2/155 , B41J2/14
CPC分类号： B41J2/155
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged adjacently along corresponding ones of fluid vias skewed variously or not to enable seamless stitching of printed images from the adjacent firing elements. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Bond pads and overlying encapsulation materials are still other features as are metallization lines for distributing power to ones of firing elements. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。这些碎屑具有流体发射元件，其相应地沿相应的流体通道排列，不同地倾斜或不能使来自相邻击发元件的打印图像的无缝缝合。激发元件通电以喷射流体，并且单个的元件根据颜色或流体类型间隔开。重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。可变芯片尺寸和形状（包括人字形）被公开为不同颜色的液体通孔之间的关系。倾斜角度各不相同，具有明显的优点。接合焊盘和上覆封装材料仍然是其他特征，例如用于将功率分配给发射元件的金属线。从较大的晶片制造芯片可以提供更多的实施例，因为晶片的使用增加。

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