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    • 14. 发明申请
    • PATTERN FORMING METHOD
    • 图案形成方法
    • WO2010035908A1
    • 2010-04-01
    • PCT/JP2009/067300
    • 2009-09-29
    • FUJIFILM CorporationKATO, TakayukiTAKAHASHI, HyouIWATO, Kaoru
    • KATO, TakayukiTAKAHASHI, HyouIWATO, Kaoru
    • G03F7/40C08F20/28C08F20/34G03F7/039H01L21/027
    • G03F7/0397C08F220/28G03F7/0046G03F7/2041G03F7/40
    • A pattern forming method, includes: a step of forming a resist film by using a photosensitive composition containing (A) a resin having a repeating unit represented by formula (1) as defined in the specification and being capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; a step of exposing the resist film so as to form an exposed resist film; a post-exposure heating step of heating the exposed resist film; a developing step of developing the resist film after the post-exposure heating step so as to form a developed resist film; and a post-baking step of heating the developed resist film, wherein the post-baking in the post-baking step is performed by setting a heating temperature to a temperature not lower than [a glass transition temperature (Tg) of the resin (A) - 20°C].
    • 图案形成方法包括:通过使用含有(A)具有本说明书中定义的由式(1)表示的重复单元的树脂并且能够增加树脂的溶解度的光敏组合物形成抗蚀剂膜的步骤 (A)通过酸的作用在碱性显影剂中; 曝光抗蚀剂膜以形成曝光的抗蚀剂膜的步骤; 曝光后加热步骤,加热曝光的抗蚀剂膜; 显影步骤,在后曝光加热步骤之后显影抗蚀剂膜以形成显影的抗蚀剂膜; 以及加热显影的抗蚀剂膜的后烘烤步骤,其中后烘烤步骤中的后烘烤通过将加热温度设定为不低于[玻璃化转变温度(Tg)的树脂(A ) - 20℃]。