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11. 发明申请

WO2008082815A3 RESILIENT CONTACT ELEMENT AND METHODS OF FABRICATION 审中-公开
标题翻译：弹性接触元件和制造方法
公开(公告)号：WO2008082815A3
公开(公告)日：2008-08-28
申请号：PCT/US2007085481
申请日：2007-11-25
申请人： FORMFACTOR INC , GRITTERS JOHN K , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J
发明人： GRITTERS JOHN K , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J
IPC分类号： H01R12/00
CPC分类号： H01R31/02 , G01R1/06733 , G01R1/07342 , G01R3/00
摘要： Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central portion of the beam has a continuous sloped profile defining, in a relaxed state, a height measured between the beam and a plane representing an upper surface of a device to be tested that is greater near the second end of the beam than near the first end of the beam.
摘要翻译：本文提供了弹性接触元件的实施例及其制造方法。在一个实施例中，用于探针卡中的弹性接触元件包括光刻成形的弹性梁，其具有第一端和相对的第二端; 以及尖端，所述尖端设置在所述梁的所述第一端附近并且被配置为突破待测试装置的表面的氧化物层以建立与其的可靠电连接; 其中所述梁的至少中心部分具有连续的倾斜轮廓，所述连续的倾斜轮廓在松弛状态下限定在所述梁与代表待测试设备的上表面的平面之间测量的高度，所述平面在所述梁的第二端附近更大比靠近光束的第一端。

12. 发明申请

WO2007008790A3 PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT 审中-公开
标题翻译：探针卡组装与可交换的探头插入
公开(公告)号：WO2007008790A3
公开(公告)日：2007-06-21
申请号：PCT/US2006026723
申请日：2006-07-07
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , REYNOLDS CARL V , KAWAMATA NOBUHIRO , SAEKI TAKAO
发明人： ELDRIDGE BENJAMIN N , REYNOLDS CARL V , KAWAMATA NOBUHIRO , SAEKI TAKAO
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly includes an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly provides an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder is detachable from the probe card assembly.
摘要翻译：探针卡组件包括被构造成保持探针插入件的插入物夹持器，其可以包括设置在特定构造中的探针，用于探测待测试的装置。探针卡组件提供到测试器的电接口，其可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插入件电连接到探针内的电气路径卡组件是测试仪接口的一部分。插入物保持器可从探针卡组件拆卸。

13. 发明申请

WO02084716A2 STACKED SEMICONDUCTOR DEVICE ASSEMBLY WITH MICROELECTRONIC SPRING CONTACTS 审中-公开
标题翻译：堆叠半导体器件组件与微电子弹簧联系
公开(公告)号：WO02084716A2
公开(公告)日：2002-10-24
申请号：PCT/US0211650
申请日：2002-04-11
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： H01L25/065 , H01L25/10 , H01L21/00
CPC分类号： H01L25/0657 , H01L25/105 , H01L2225/06572 , H01L2225/06589 , H01L2225/06593 , H01L2225/1023 , H01L2225/1082 , H01L2225/1094 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A three-dimensional, stacked semiconductor device assembly with microelectronic spring contacts, and components thereof, is disclosed. The assembly comprises a plurality of stacked modules, which are capable of being readily mounted to, and demounted from, one another. Each module of the assembly comprises a semiconductor device, comprising a die, mounted to a stacking substrate. The die and the stacking substrate are optionally capable of being readily mounted to, and demounted from one another. A bottommost module in the assembly is suitable for attaching directly to a substrate or other component, such as a printed circuit board, and a topmost component in the assembly preferably comprises a decoupling and/or termination substrate. Each semiconductor device in the assembly has terminals on a surface thereof, at least selected ones of which are provided with a contact element. Each device preferably comprises one or more stop structures for the microelectronic springs on its terminal surface. Contact elements on the semiconductor device and between adjacent modules preferably comprise microelectronic lithographic-type molded spring contacts.
摘要翻译：公开了一种具有微电子弹簧触点的三维叠层半导体器件组件及其部件。组件包括多个堆叠的模块，其能够容易地彼此安装和拆卸。组件的每个模块包括半导体器件，其包括安装到堆叠衬底的裸片。模具和堆叠衬底可选地能够容易地彼此安装和拆卸。组件中的最底部的模块适合于直接附接到衬底或其它部件，例如印刷电路板，并且组件中的最上面的组件优选地包括去耦和/或终止衬底。组件中的每个半导体器件在其表面上具有端子，其中至少选定的一个具有接触元件。每个装置优选地包括用于其终端表面上的微电子弹簧的一个或多个止动结构。半导体器件和相邻模块之间的接触元件优选地包括微电子光刻型模制弹簧触点。

14. 发明申请

WO2008070590A3 PROBING APPARATUS WITH GUARDED SIGNAL TRACES 审中-公开
标题翻译：具有保护信号跟踪的探测设备
公开(公告)号：WO2008070590A3
公开(公告)日：2008-11-13
申请号：PCT/US2007086199
申请日：2007-11-30
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , REYNOLDS CARL V , SAEKI TAKAO , URAKAWA YOICHI
发明人： ELDRIDGE BENJAMIN N , REYNOLDS CARL V , SAEKI TAKAO , URAKAWA YOICHI
IPC分类号： G01R31/02
CPC分类号： G01R1/18 , G01R1/07307 , G01R31/2889
摘要： probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.
摘要翻译：探测装置可以包括衬底，导电信号迹线，探针和电磁屏蔽。衬底可以具有与第一表面相对的第一表面和第二表面，并且导电的第一信号迹线可以设置在第一衬底的第一表面上。探针可以附着到第一信号迹线上，并且电磁屏蔽结构可以围绕信号迹线设置。

15. 发明申请

WO2008051773A3 PROBE CARD ASSEMBLY WITH A MECHANICALLY DECOUPLED WIRING SUBSTRATE 审中-公开
标题翻译：具有机械去耦线路基板的探针卡组件
公开(公告)号：WO2008051773A3
公开(公告)日：2008-10-30
申请号：PCT/US2007081706
申请日：2007-10-18
申请人： FORMFACTOR INC , HOBBS ERIC D , SLOCUM ALEXANDER H , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J , POWELL SHAWN
发明人： HOBBS ERIC D , SLOCUM ALEXANDER H , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J , POWELL SHAWN
IPC分类号： G01R31/02
CPC分类号： G01R31/2893
摘要： A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
摘要翻译：探针卡组件可以包括探针头组件和布线衬底。探针头组件可以包括多个探针，所述多个探针被设置为接触设置在测试外壳中的保持器上的电子器件。布线基板可以包括到测试控制器的电接口以及构成电接口和其中一个探头之间的电路径的多个电布线，并且布线基板可以包括布置有电接口的第一部分和布置在第一部分上的第二部分构成探头组件的部分。布线衬底的第二部分可以相对于布线衬底的第一部分移动。

16. 发明申请

WO2005104742A3 A METHOD TO BUILD ROBUST MECHANICAL STRUCTURES ON SUBSTRATE SURFACES 审中-公开
标题翻译：一种在基底表面上建立稳定的机械结构的方法
公开(公告)号：WO2005104742A3
公开(公告)日：2006-10-19
申请号：PCT/US2005014377
申请日：2005-04-26
申请人： FORMFACTOR INC , GRUBE GARY W , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , SOFIELD CHADWICK D
发明人： GRUBE GARY W , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , SOFIELD CHADWICK D
IPC分类号： H01R9/00 , B29C47/00 , B29C65/00 , B32B9/00 , B32B15/04 , B32B37/00 , H01R43/00 , H05K1/00 , H05K7/02 , H05K7/10
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T29/49117 , Y10T29/49147 , Y10T156/10 , Y10T428/12347 , Y10T428/12375 , Y10T428/12535 , Y10T428/12542 , Y10T428/12556 , Y10T428/12569 , Y10T428/31681 , H01L2924/00
摘要： A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.
摘要翻译：提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。然后可以在镀覆的基础上构造诸如弹簧探针的组件。粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

17. 发明申请

WO03040734A2 METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 审中-公开
标题翻译：用于补偿探针卡的热诱导运动的方法和系统
公开(公告)号：WO03040734A2
公开(公告)日：2003-05-15
申请号：PCT/US0235022
申请日：2002-11-01
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRUBE GARY W , MATSUBAYASHI KEN S , LARDER RICHARD A , SHINDE MAKARAND S , MATHIEU GAETAN L , MARTENS ROD
发明人： ELDRIDGE BENJAMIN N , GRUBE GARY W , MATSUBAYASHI KEN S , LARDER RICHARD A , SHINDE MAKARAND S , MATHIEU GAETAN L , MARTENS ROD
IPC分类号： G01R1/067 , G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R31/2891 , G01R1/07342 , G01R31/2886
摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
摘要翻译：本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。公开了一种包含双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

18. 发明申请

WO0171779A2 METHOD AND APPARATUS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR 审中-公开
标题翻译：用于平面化半导体接触器的方法和装置
公开(公告)号：WO0171779A2
公开(公告)日：2001-09-27
申请号：PCT/US0108746
申请日：2001-03-16
申请人： FORMFACTOR INC , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
发明人： MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66 , H01L21/00
CPC分类号： G01R1/07307
摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.
摘要翻译：用于探针卡组件的平面化器。平面化器包括从探针卡组件中的衬底延伸的第一控制构件。第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

19. 发明申请

WO2012128907A3 NON-LINEAR VERTICAL LEAF SPRING 审中-公开
标题翻译：非线性垂直叶片弹簧
公开(公告)号：WO2012128907A3
公开(公告)日：2012-11-08
申请号：PCT/US2012027216
申请日：2012-03-01
申请人： FORMFACTOR INC , BREINLINGER KEITH J , ARMSTRONG MICHAEL J , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , HOBBS ERIC D
发明人： BREINLINGER KEITH J , ARMSTRONG MICHAEL J , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , HOBBS ERIC D
IPC分类号： G01R1/067 , G01R31/26 , G01R31/28
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , H01R13/2407 , H01R43/16 , Y10T29/49204
摘要： An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.
摘要翻译：导电接触元件可以包括第一基座和第二基座，在基座之间具有细长的间隔开的叶片。每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端部可以联接到第二基部。在第一端和第二端之间的叶片的本体可以充分地伸长以响应通过所述接触元件基本平行于第一轴线和第二轴线的力，同时通过首先轴向压缩，同时所述力小于屈曲力，并且然后在所述力大于屈曲力的情况下弯曲。

20. 发明申请

WO2011112409A3 WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS 审中-公开
标题翻译：带有自定义层的布线基板
公开(公告)号：WO2011112409A3
公开(公告)日：2012-01-19
申请号：PCT/US2011026960
申请日：2011-03-03
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , MATHIEU GAETAN L
发明人： ELDRIDGE BENJAMIN N , MATHIEU GAETAN L
IPC分类号： H05K3/46 , H05K3/40
CPC分类号： H05K3/4664 , H05K3/1241 , H05K3/4015 , H05K3/4046 , H05K3/4647 , H05K2203/049 , Y10T29/49155 , Y10T29/49165
摘要： Customization layers can provide customized electrical connections from electrical contacts of a wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers to be in a different pattern than the contacts at the surface of the wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements.
摘要翻译：定制层可以提供从布线基板的电触点到定制层的外表面处的电触点的定制电连接，这可以允许定制层的外表面处的触点与不同于图布线基板的表面。定制层可以包括电绝缘材料，通过绝缘材料的导电通孔结构，导电迹线，电连接两个迹线的导电跳线，而不接触设置在两个迹线之间的迹线和/或其它这样的元件。

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