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    • 11. 发明申请
    • CMOS-BASED PLANAR TYPE SILICON AVALANCHE PHOTO DIODE USING SILICON EPITAXIAL LAYER AND METHOD OF MANUFACTURING THE SAME
    • 使用硅外延层的基于CMOS的平面型硅氧化物照相二极管及其制造方法
    • US20090146238A1
    • 2009-06-11
    • US12195166
    • 2008-08-20
    • Yong Sun YoonKun Sik ParkJong Moon ParkBo Woo KimJin Yeong Kang
    • Yong Sun YoonKun Sik ParkJong Moon ParkBo Woo KimJin Yeong Kang
    • H01L31/103H01L31/18
    • H01L31/107
    • A complementary metal-oxide semiconductor (CMOS)-based planar type avalanche photo diode (APD) using a silicon epitaxial layer and a method of manufacturing the APD, the photo diode including: a substrate; a well layer of a first conductivity type formed in the substrate; an avalanche embedded junction formed in the well layer of the first conductivity type by low energy ion implantation; the silicon epitaxial layer formed in the avalanche embedded junction; a doping area of a second conductivity type opposite to the first conductive type, formed from a portion of a surface of the well layer of the first conductivity type in the avalanche embedded junction and forming a p-n junction; positive and negative electrodes formed on the doping area of the second conductivity type and the well layer of the first conductivity type separated from the doping area of the second conductivity type, respectively; and an oxide layer formed on an overall surface excluding a window where the positive and negative electrodes are formed.
    • 使用硅外延层的基于互补金属氧化物半导体(CMOS)的平面型雪崩光电二极管(APD)和制造该APD的方法,所述光电二极管包括:衬底; 在衬底中形成的第一导电类型的阱层; 通过低能离子注入形成在第一导电类型的阱层中的雪崩嵌入结; 形成在雪崩嵌入结的硅外延层; 由所述第一导电类型的阱层的表面的一部分形成在所述雪崩嵌入结中并形成p-n结的与所述第一导电类型相反的第二导电类型的掺杂区域; 分别形成在第二导电类型的掺杂区域上的正极和负极以及从第二导电类型的掺杂区域分离的第一导电类型的阱层; 以及形成在除了形成正极和负极的窗口之外的整个表面上的氧化物层。