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11. 发明专利

JP2014179443A Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2014179443A
公开(公告)日：2014-09-25
申请号：JP2013052117
申请日：2013-03-14
申请人： Denso Corp , 株式会社デンソー , Toyota Motor Corp , トヨタ自動車株式会社
发明人： OKUMURA TOMOMI , KADOGUCHI TAKUYA
IPC分类号： H01L25/07 , H01L23/29 , H01L25/18
CPC分类号： H01L23/3672 , H01L23/051 , H01L23/3107 , H01L23/4334 , H01L23/492 , H01L23/49562 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce deformation more than in the past against pressing forces from both sides in a lining direction in a composition which includes at least one pair of an upper arm and a lower arm.SOLUTION: A semiconductor device comprises relay parts (46, 56) for electrically relaying a second heat sink (44) and a third heat sink (50) via solder (60), in which the solder is arranged in a direction perpendicular to one surfaces (11, 21a) and on connection surfaces (47c, 57c) at bases of the relay parts, which are orthogonal to a through-thickness direction of the relay parts. The relay parts have ribs (48, 58) which project from the bases in the direction perpendicular to the one surfaces, respectively, and a thickness of a part where each rib is provided is not exceeding a thickness of the corresponding heat sink. The ribs are encapsulated by an encapsulation resin body (70) and provided along a whole length and in a lining direction of a first region (71) between the second heat sink and the third heat sink.
摘要翻译：要解决的问题：在包括至少一对上臂和下臂的组合物中，相对于过去的冲击力沿着衬里方向的两侧减小变形。解决方案：半导体器件包括中继部件（ 46，56），用于经由焊料（60）电连接第二散热器（44）和第三散热器（50），其中焊料沿垂直于一个表面（11,21a）的方向和连接表面（47c，57c），与继电器部件的贯通厚度方向正交。继电器部分具有分别从垂直于一个表面的方向从基座突出的肋（48,58），并且每个肋设置的部分的厚度不超过相应的散热器的厚度。所述肋被密封树脂体（70）包封，并且沿第一散热器和第三散热器之间的第一区域（71）的整个长度和沿着衬里方向设置。

12. 发明专利

JP2013012525A Lead frame and power module 有权
标题翻译：引导框架和电源模块
公开(公告)号：JP2013012525A
公开(公告)日：2013-01-17
申请号：JP2011143033
申请日：2011-06-28
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： KADOGUCHI TAKUYA , MIYOSHI TATSUYA , OKUMURA TOMOMI , KAWASHIMA TAKAYOSHI
IPC分类号： H01L23/50 , H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H01L23/49562 , H01L22/34 , H01L23/3114 , H01L23/4334 , H01L23/492 , H01L23/495 , H01L23/4951 , H01L23/4952 , H01L23/49537 , H01L23/49541 , H01L23/49551 , H01L23/49555 , H01L23/49568 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/371 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2224/859 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： PROBLEM TO BE SOLVED: To provide a lead frame and a power module which are high in material yield.SOLUTION: A lead frame comprises: a plurality of first leads extending in one side of an area in which a semiconductor device is disposed in a plan view; a plurality of second leads extending in an opposite side of the one side of the area in which the semiconductor device is disposed in the plan view; a third lead arranged outside of the first lead which is located on edge among the first leads in the plan view; and a wiring part 500 which is connected with the third lead, which is a part of a guide frame 119 for the first leads, the second leads, and the third lead, and also which becomes an electric wiring connected with the third lead after removing the other parts except the part of the guide frame 119.
摘要翻译：要解决的问题：提供高产量的引线框架和功率模块。解决方案：引线框架包括：在平面图中设置半导体器件的区域的一侧中延伸的多个第一引线; 多个第二引线，其在俯视图中设置有半导体器件的区域的一侧的相对侧; 布置在第一引线外侧的第三引线，其位于俯视图中的第一引线之间的边缘上; 以及与作为第一引线，第二引线和第三引线的引导框架119的一部分的第三引线连接的布线部500，并且在去除之后成为与第三引线连接的电布线其他部分除了引导框架119的部分外。版权所有：（C）2013，JPO＆INPIT

13. 发明专利

JP2010062491A Semiconductor device and composite semiconductor device 有权
标题翻译：半导体器件和复合半导体器件
公开(公告)号：JP2010062491A
公开(公告)日：2010-03-18
申请号：JP2008229418
申请日：2008-09-08
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAMOTO TAKESHI , OKURA YASUTSUGU , OKUMURA TOMOMI
IPC分类号： H01L23/473
CPC分类号： H01L24/33 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the efficiency of cooling in a semiconductor device of double-sided heat dissipation type. SOLUTION: A semiconductor device has a semiconductor element 1, a pair of metal plates 2, 3 which are electrically and thermally joined to each of a surface side and a backside of the semiconductor element 1 and hold the semiconductor element 1 therebetween and a first cooler 9 thermally joined to heat dissipation surfaces 2b, 3b, which are opposite surfaces of the semiconductor element 1 in the pair of metal plates 2, 3. In the semiconductor device, a second cooler 11 is interposed between the pair of metal plates 2, 3. The second cooler 11 is thermally connected to inner surfaces 2a, 3a, which are surfaces in the semiconductor element 1 side in the pair of metal plates 2, 3 and cools the pair of metal plates 2, 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高双面散热型半导体器件的冷却效率。解决方案：半导体器件具有半导体元件1，一对金属板2,3，其电连接并且热连接到半导体元件1的表面侧和后侧，并将半导体元件1保持在其间; 第一冷却器9热连接到散热面2b，3b，它们是一对金属板2,3中的半导体元件1的相对表面。在半导体器件中，第二冷却器11插入在一对金属板第二冷却器11热连接到作为一对金属板2,3中的半导体元件1侧的表面的内表面2a，3a，并冷却该对金属板2,3。版权所有（C）2010，JPO＆INPIT

14. 发明专利

JP2009141053A Lead frame and manufacturing method of semiconductor device 有权
标题翻译：半导体器件的引线框架和制造方法
公开(公告)号：JP2009141053A
公开(公告)日：2009-06-25
申请号：JP2007314628
申请日：2007-12-05
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAMOTO TAKESHI , MASAMITSU KUNIAKI , OKUMURA TOMOMI
IPC分类号： H01L21/60
CPC分类号： H01L24/33 , H01L24/29 , H01L24/32 , H01L2224/32245 , H01L2224/45 , H01L2224/48091 , H01L2224/48247 , H01L2224/49 , H01L2224/49175 , H01L2224/73265 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/45144 , H01L2224/45124 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device using a lead frame, which facilitates detection of abnormality such as deformation of bonding wire when external force is added to the lead frame. SOLUTION: In the manufacturing method of the semiconductor device having a process for preparing the lead frame 200 in which an island part 3 and a lead part 8 are integrally coupled by a coupling part 11 and loading semiconductor elements 1 and 2 on the island part 3 and a process for electrically and mechanically connecting the semiconductor element 1 and the lead part 8 by bonding wire 9, the island part 3 and the coupling part 11 are mechanically connected through dummy wire 10 whose mechanical strength is lower than bonding wire 9. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用引线框架的半导体器件的制造方法，其有助于检测当向引线框架添加外力时接合线的变形等异常现象。解决方案：在具有制备引线框架200的工艺的半导体器件的制造方法中，其中岛部分3和引线部分8通过耦合部分11一体地耦合并且将半导体元件1和2加载到岛部3和通过接合线9电连接机械连接半导体元件1和引线部8的工艺，岛部3和耦合部11通过机械强度低于接合线9的虚拟线10机械连接版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2009130044A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2009130044A
公开(公告)日：2009-06-11
申请号：JP2007301888
申请日：2007-11-21
申请人： Denso Corp , 株式会社デンソー
发明人： OKUMURA TOMOMI , MASAMITSU KUNIAKI
IPC分类号： H01L23/48 , H01L21/56 , H01L25/07 , H01L25/18
CPC分类号： H01L24/33 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which has a semiconductor element sandwiched between a pair of lead frames and sealed with a mold resin, in which the lead frame interval is kept constant without using a jig for keeping the lead frame interval constant or increasing the number of components. SOLUTION: A portion of one lead frame 4 of both lead frames 3 and 4 is formed into a bent portion 4d bent extending toward the other lead frame 3 outside semiconductor elements 1 and 2, and then the semiconductor element 1 and 2 are sandwiched between both lead frames 3 and 4. In this process, both lead frames 3 and 4 are held apart from each other by the bent portion 4d to keep the interval between both lead frames 3 and 4 constant. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种制造半导体器件的方法，该半导体器件具有夹在一对引线框之间的半导体元件并用模制树脂密封，其中引线框间隔保持恒定，而不使用夹具保持引线框间隔不变或增加元件数量。解决方案：两个引线框架3和4的一个引线框架4的一部分形成为弯曲部分4d，弯曲部分4d朝向半导体元件1和2外部的另一个引线框架3延伸，然后半导体元件1和2是夹在两个引线框架3和4之间。在这个过程中，两个引线框架3和4都被弯曲部分4d保持彼此分开，以保持两个引线框架3和4之间的间隔是恒定的。版权所有（C）2009，JPO＆INPIT

16. 发明专利

JP2015057807A 半導体装置有权
标题翻译：半导体器件
公开(公告)号：JP2015057807A
公开(公告)日：2015-03-26
申请号：JP2013191255
申请日：2013-09-16
申请人：株式会社デンソー , Denso Corp , トヨタ自動車株式会社 , Toyota Motor Corp
发明人： OKUMURA TOMOMI , KADOGUCHI TAKUYA
IPC分类号： H01L25/07 , H01L23/29 , H01L25/18
CPC分类号： H01L23/3672 , H01L23/051 , H01L23/3107 , H01L23/3114 , H01L23/4334 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/07 , H01L25/18 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要：【課題】スイッチング素子の並び方向において小型化しつつサージ電圧を低減でき、且つ、封止樹脂体の絶縁性能が低下しても短絡が生じにくい半導体装置を提供する。【解決手段】第1スイッチング素子(20)と第2スイッチング素子(30)の並び方向において、第2ヒートシンク(52)と第3ヒートシンク(54)が継手部(58)により電気的に接続されている。また、第2電源端子(42)は、並び方向において、第1電源端子(40)と出力端子(44)の間であって、第2ヒートシンクと第3ヒートシンクとの間の領域に配置されている。そして、封止樹脂体(66)内において、第1電源端子と同電位とされる第1電位部と出力端子と同電位とされる第3電位部との最短距離、及び、第2電源端子と同電位とされる第2電位部と第3電位部との最短距離の少なくとも一方が、第1電位部と第2電位部との最短距離よりも短くされている。【選択図】図5
摘要翻译：要解决的问题：提供一种半导体器件，其可以在实现开关元件的排列方向上的小型化的同时降低浪涌电压，并且即使在密封树脂体的绝缘性能下降的情况下也难以发生短路。：半导体器件包括：第一散热器（52）和第三散热器（54），所述第二散热器（52）和第三散热器（54）在第一开关元件（20）的排列方向上通过接合部分（58）彼此电连接，开关元件（30）; 并且第二电源端子（42）被布置在排列方向上的第一电源端子（40）和输出端子（44）之间以及第二散热器（52）和第三散热器（54）之间的区域中）。在封装树脂体（66）中，具有与第一电源端子的电位相同的第一电位部分和与输出电位相同的第三电位部分之间的最小长度中的至少一个并且使具有与第二电源端子的电位相同的第二电位部分和第三电位部分之间的最小长度比第一电位部分和第二电位部分之间的最小距离短。

17. 发明专利

JP2014154779A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014154779A
公开(公告)日：2014-08-25
申请号：JP2013024867
申请日：2013-02-12
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： KADOGUCHI TAKUYA , OKUMURA TOMOMI
IPC分类号： H01L21/56 , H01L23/28
CPC分类号： H01L2224/37 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3754 , H01L2224/40 , H01L2224/40245 , H01L2224/45144 , H01L2224/45147 , H01L2224/49171 , H01L2224/83801 , H01L2224/84801 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing generations of void.SOLUTION: A semiconductor device comprises: a plurality of semiconductor elements arranged in a first direction on a plane; a sealing resin 50 for sealing a plurality of semiconductor elements; a plurality of terminals electrically connected to the plurality of semiconductor elements and having parts protruding in the direction perpendicular to the first direction from a predetermined plane of the sealing resin 50 when viewed from a direction vertical to the plane; and recessed parts arranged at locations opposite to one of the plurality of semiconductor elements respectively when viewed from a direction vertical to the plane and between terminals protruding from the predetermined plane and having a shape recessed from the predetermined plane to one of the semiconductor elements side. The recessed part is a resin injection port when a resin that be the sealing resin 50, is injected.
摘要翻译：要解决的问题：提供一种能够抑制空洞代数的半导体器件。解决方案：一种半导体器件包括：沿平面上的第一方向布置的多个半导体元件; 用于密封多个半导体元件的密封树脂50; 多个端子电连接到所述多个半导体元件，并且当从垂直于所述平面的方向观察时，具有从所述密封树脂50的预定平面沿垂直于所述第一方向的方向突出的部分; 以及当从垂直于该平面的方向观察并且在从该预定平面突出并具有从该预定平面凹陷到该半导体元件侧之一的端子之间时，分别布置在与多个半导体元件中的一个相对的位置处的凹部。当注入作为密封树脂50的树脂时，凹部是树脂注入口。

18. 发明专利

JP2013084706A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2013084706A
公开(公告)日：2013-05-09
申请号：JP2011222645
申请日：2011-10-07
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： IWASAKI SHINGO , KADOGUCHI TAKUYA , KAWASHIMA TAKAYOSHI , OKUMURA TOMOMI
IPC分类号： H01L23/29
CPC分类号： H01L24/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents unnecessary spreading of a joining part with a member having a simple structure.SOLUTION: A semiconductor device has: a semiconductor element; a first heat radiation plate which is joined to one surface of the semiconductor element through a first joining part; a metal plate which is joined to the other surface of the semiconductor element through a second joining part; and a second heat radiation plate joined to a surface of the metal plate, which is the opposite side of the semiconductor element, through a third joining part. An area of the metal plate surface on the second heat radiation plate side is larger than an area of the metal plate surface on the semiconductor element side.
摘要翻译：要解决的问题：提供一种半导体器件，其防止与具有简单结构的部件的接合部分的不必要的扩展。解决方案：半导体器件具有：半导体元件; 第一散热板，其通过第一接合部接合到所述半导体元件的一个表面; 金属板，其通过第二接合部接合到所述半导体元件的另一个表面; 以及通过第三接合部与金属板的与半导体元件的相对侧的表面接合的第二散热板。第二散热板侧的金属板表面的面积大于半导体元件侧的金属板表面的面积。版权所有（C）2013，JPO＆INPIT

19. 发明专利

JP2013062483A Structure and molding method of power module and metal mold for molding power module 有权
标题翻译：用于模制电源模块的电源模块和金属模具的结构和模制方法
公开(公告)号：JP2013062483A
公开(公告)日：2013-04-04
申请号：JP2012130772
申请日：2012-06-08
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： KADOGUCHI TAKUYA , SUZUKI SACHIKAZU , MIYOSHI TATSUYA , KAWASHIMA TAKAYOSHI , OKUMURA TOMOMI
IPC分类号： H01L23/34 , H01L23/40 , H01L25/07 , H01L25/18
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/051 , H01L23/3107 , H01L25/071 , H01L2224/33 , H01L2924/0002 , H01L2924/181 , Y10T29/49002 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a structure and a molding method of a power module and a metal mold for molding the power module which achieve sizing control of the power module where a mold resin fills a space between two cooling members sandwiching a semiconductor element.SOLUTION: A power module 10 includes: a semiconductor element 12; cooling blocks 26a, 26b which are disposed sandwiching the semiconductor element 12; a frame member 16 supporting the semiconductor element 12 between the two cooling blocks 26a, 26b; and a mold resin 32 filling a space between the two cooling blocks 26a, 26b. In the power module 10, a spring member 20, which elastically deforms between the two cooling blocks 26a, 26b, is provided at the frame member 16.
摘要翻译：要解决的问题：提供一种用于模制功率模块的功率模块和金属模具的结构和模制方法，所述功率模块实现功率模块的尺寸控制，其中模制树脂填充两个冷却构件之间的间隔半导体元件。电源模块10包括：半导体元件12; 设置成夹着半导体元件12的冷却块26a，26b; 在两个冷却块26a，26b之间支撑半导体元件12的框架构件16; 以及填充两个冷却块26a，26b之间的空间的模制树脂32。在功率模块10中，在框架部件16上设置有弹性变形的两个冷却块26a，26b之间的弹簧部件20.（C）2013，JPO＆INPIT

20. 发明专利

JP2012235081A Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2012235081A
公开(公告)日：2012-11-29
申请号：JP2011281695
申请日：2011-12-22
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： KADOGUCHI TAKUYA , IWASAKI SHINGO , KAWASHIMA TAKAYOSHI , NISHIHATA MASAYOSHI , OKUMURA TOMOMI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L24/30 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/34 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/06181 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73221 , H01L2224/73265 , H01L2224/83 , H01L2224/83205 , H01L2224/83801 , H01L2224/84205 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which require no process of flipping upside down when arranging the semiconductor element and are capable of reducing inspection time.SOLUTION: A semiconductor device comprises: a first thick plate part 31 composed of a conductor and electrically connected with an electrode 11 on an undersurface side of a first semiconductor element; a second thick plate part 32 composed of a conductor and connected with an electrode 21 on an undersurface side of a second semiconductor element arranged in parallel with the first semiconductor element; a third thick plate part 41 composed of a conductor and connected with an electrode 12 on a top face side of the first semiconductor element; a fourth thick plate part 42 composed of a conductor and electrically connected with an electrode 22 on a top face side of the second semiconductor element; first thin plate parts 33, 34 provided at the second thick plate part and each composed of a conductor and thinner than the second thick plate part; and second thin plate parts 43, 44 provided at the third thick plate part and each composed of a conductor and thinner than the third thick plate part. The first thin plate parts and the second thin plate parts are fastened and electrically connected to each other.
摘要翻译：要解决的问题：提供一种半导体器件及其制造方法，其在布置半导体元件时不需要颠倒翻转的处理，并且能够减少检查时间。解决方案：半导体器件包括：由导体构成的第一厚板部分31，并与第一半导体元件的下表面侧的电极11电连接; 由导体构成的第二厚板部32，与第一半导体元件平行布置的第二半导体元件的下表面侧的电极21连接; 第三厚板部41，由导体构成，与第一半导体元件的顶面侧的电极12连接; 第四厚板部42，由导体构成，与第二半导体元件的顶面侧的电极22电连接; 第一薄板部分33,34，设置在第二厚板部分，每个由导体构成，并且比第二厚板部分薄; 以及设置在第三厚板部分并且各自由导体构成并且比第三厚板部分薄的第二薄板部分43,44。第一薄板部分和第二薄板部分彼此紧固并电连接。版权所有（C）2013，JPO＆INPIT

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