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    • 11. 发明申请
    • PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM
    • 平行单基板加工系统
    • US20120306137A1
    • 2012-12-06
    • US13488343
    • 2012-06-04
    • Arthur KeiglerFreeman FisherDaniel L. GoodmanJonathan Haynes
    • Arthur KeiglerFreeman FisherDaniel L. GoodmanJonathan Haynes
    • B23Q1/25
    • H01L21/67757H01L21/67028H01L21/67034H01L21/67051H01L21/67057H01L21/67173H01L21/6776H01L21/67781H01L21/68H01L21/68707
    • A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section.
    • 一种用于流体处理衬底表面的系统,其布置在具有工艺部分的流体中,所述工艺部分具有框架,所述框架具有多个处理元件,以处理所述衬底表面而不接触所述衬底表面。 一种衬底保持器组件,其具有保持器框架和多个衬底保持器,每个衬底保持器联接到保持器框架并且构造成用于保持衬底,使得每个衬底保持器保持不同的衬底以作为与衬底保持器组件 往返于过程部分。 衬底保持器组件和每个衬底保持器可移除地联接到处理部分框架,并且衬底保持器组件的衬底保持器相对于保持器框架可移动并且可相对于工艺段的预定特征可重复地对准并且独立地 保持框架相对于处理部分的定位。
    • 13. 发明申请
    • EDGE BEVEL REMOVAL APPARATUS AND METHOD
    • 边缘去除装置和方法
    • US20130048610A1
    • 2013-02-28
    • US13595785
    • 2012-08-27
    • Daniel GOODMANArthur KeiglerTerry McElroyGary Boulet
    • Daniel GOODMANArthur KeiglerTerry McElroyGary Boulet
    • B44C1/22
    • B44C1/22H01L21/02087H01L21/6708H01L21/6719Y10S134/902
    • A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.
    • 描述了用于用蚀刻剂从衬底的周边边缘蚀刻材料的衬底边缘斜面蚀刻模块。 衬底边缘斜面蚀刻模块包括具有用于衬底的支撑件的可旋转衬底保持器,以及表面张力蚀刻施加器,当表面张力蚀刻施加器位于靠近衬底边缘时,该表面张力蚀刻施加器包括与靠近衬底的边缘的衬底表面相对的润湿蚀刻表面 衬底的边缘。 表面张力蚀刻施加器还包括蚀刻剂分配部分,靠近润湿的蚀刻表面,其在润湿的蚀刻表面和基底表面之间的区域中分配蚀刻剂,并湿润至少一部分润湿的蚀刻表面和基底表面。 润湿的蚀刻表面和基底表面之间的间距被选择以使用表面张力保持蚀刻剂,并在其间形成弯液面。
    • 14. 发明申请
    • SEED LAYER DEPOSITION IN MICROSCALE FEATURES
    • 微粒特征中的种子层沉积
    • US20110240481A1
    • 2011-10-06
    • US12755198
    • 2010-04-06
    • Arthur KeiglerJohannes ChiuZhenqiu LiuDaniel Goodman
    • Arthur KeiglerJohannes ChiuZhenqiu LiuDaniel Goodman
    • C25D5/02C25D17/00
    • C25D7/123C25D17/001H01L21/2885H01L21/76873H01L21/76898H01L2221/1089
    • A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.
    • 一种用于涂覆微孔孔特征的内表面的方法和系统,其制造成工件的基本平坦的表面。 该方法包括提供具有阻挡金属涂层的工件,所述阻挡金属涂层沿着工件的平坦表面和微孔特征的内表面基本上连续且均匀,其中所述阻挡金属涂层通过基本上表面反应限制的工艺 。 工件在工件的平坦表面上设置有锚固到阻挡金属涂层的厚金属层并且设置成为位于整个和跨过工件的微尺度特征提供基本均匀的导电能力的涂层。 在工件周边处的导电涂层上提供电接触路径。 将工件浸入化学浴中,使所述化学浴与微孔特征的内表面完全接触,所述化学浴含有适合于电沉积的金属离子。 在工件的周边施加电势,使金属离子在工件的所有表面上电沉积,包括微孔孔特征的内表面到一个步骤中的预定的涂层。
    • 18. 发明授权
    • Edge bevel removal apparatus and method
    • 边缘斜角去除装置及方法
    • US08858755B2
    • 2014-10-14
    • US13595785
    • 2012-08-27
    • Daniel GoodmanArthur KeiglerTerry McElroyGary Boulet
    • Daniel GoodmanArthur KeiglerTerry McElroyGary Boulet
    • B44C1/22H01L21/67H01L21/02
    • B44C1/22H01L21/02087H01L21/6708H01L21/6719Y10S134/902
    • A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.
    • 描述了用于用蚀刻剂从衬底的周边边缘蚀刻材料的衬底边缘斜面蚀刻模块。 衬底边缘斜面蚀刻模块包括具有用于衬底的支撑件的可旋转衬底保持器,以及表面张力蚀刻施加器,当表面张力蚀刻施加器位于靠近衬底边缘时,该表面张力蚀刻施加器包括与靠近衬底的边缘的衬底表面相对的润湿蚀刻表面 衬底的边缘。 表面张力蚀刻施加器还包括蚀刻剂分配部分,靠近润湿的蚀刻表面,其在润湿的蚀刻表面和基底表面之间的区域中分配蚀刻剂,并湿润至少一部分润湿的蚀刻表面和基底表面。 润湿的蚀刻表面和基底表面之间的间距被选择以使用表面张力保持蚀刻剂,并在其间形成弯液面。
    • 20. 发明授权
    • Substrate processing pallet with cooling
    • 基板加工托盘带冷却
    • US09147588B2
    • 2015-09-29
    • US11716538
    • 2007-03-09
    • Daniel GoodmanArthur KeiglerStephen GolovatoDavid Felsenthal
    • Daniel GoodmanArthur KeiglerStephen GolovatoDavid Felsenthal
    • H01L21/00B05C11/00H01L21/67H01L21/677H01L21/683
    • H01L21/67103H01L21/67109H01L21/67703H01L21/6831
    • A substrate processing pallet can cool a substrate. A substrate processing pallet can include a base member; an interface pad attachable to the base member, the interface pad having substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate; and a surface of the base member having features for aligning a substrate on the interface pad. A substrate processing pallet can also include a base member; an interface pad attachable to the base member; an electrostatic chuck for gripping the substrate during processing; an energy storage system for storing energy to sustain the electrostatic chuck at sufficient charge to sustain grip the substrate during processing; and a conduit for transporting gas to a backside of the substrate to facilitate cooling of the substrate.
    • 基板处理托盘可以冷却基板。 基板处理托盘可以包括基部构件; 接口垫,其可附接到所述基底构件,所述界面垫具有与所述基底构件基本上相同的热膨胀系数并且适于促进所述衬底的冷却; 并且所述基底构件的表面具有用于使所述界面垫上的衬底对准的特征。 基板处理托盘还可以包括基部构件; 可附接到基座构件的接口垫; 用于在加工期间夹持基板的静电卡盘; 能量存储系统,用于存储能量以在足够的电荷下维持静电卡盘,以在加工期间保持夹持基板; 以及用于将气体输送到衬底的背面以便于冷却衬底的导管。