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11. 发明授权

US5901039A Mounting device for electronic components 失效
标题翻译：电子元件安装装置
公开(公告)号：US5901039A
公开(公告)日：1999-05-04
申请号：US895475
申请日：1997-07-16
申请人： Gerard Dehaine , Yves Stricot
发明人： Gerard Dehaine , Yves Stricot
IPC分类号： F16B5/02 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/4043 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002
摘要： A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.
摘要翻译：一种用于将第一元件安装到第二元件上以夹住其间的电气或电子部件的装置，其中，当所述第一元件安装到所述第二元件上时，所述装置可操作以使所述第一元件对所述元件施加接触力，并且将装置以对第一元件施加安装力的方式耦合到第一元件，该安装力独立于第一元件是否安装在第二元件上。第一元件可以是散热器，第二元件可以是印刷电路板。

12. 发明授权

US09052480B2 Alignment pin and optical communication system 有权
标题翻译：对准针和光通讯系统
公开(公告)号：US09052480B2
公开(公告)日：2015-06-09
申请号：US13881527
申请日：2011-10-25
申请人： Gnitaboure Yabre , Nicolas Hermeline , Yves Stricot , Gert Droesbeke
发明人： Gnitaboure Yabre , Nicolas Hermeline , Yves Stricot , Gert Droesbeke
IPC分类号： G02B6/36 , G02B6/42 , G02B6/30 , G02B6/38
CPC分类号： G02B6/4219 , G02B6/30 , G02B6/3885 , G02B6/4214 , G02B6/423 , G02B6/4249 , G02B6/4292
摘要： An alignment pin for an optical communication system comprises: a first portion (31) extending along a direction in a receiving hole of a printed circuit board, a second portion (32) extending along this direction in a receiving through hole of an optical coupling device, a third portion (33) extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface (35) placed in contact with a parallel complementary surface (36) of the optical coupling device.
摘要翻译：一种用于光通信系统的对准销包括：沿着印刷电路板的接收孔中的方向延伸的第一部分（31），沿着该方向在光耦合装置的接收通孔中延伸的第二部分，在外部光学部件的接收孔中沿该方向延伸的第三部分（33）。销包括与光耦合装置的平行互补表面（36）接触放置的邻接表面（35）。

13. 发明申请

US20140119689A1 Printed Circuit Board Assembly and a Method for Manufacturing the Printed Circuit Board Assembly 有权
标题翻译：印刷电路板组件和制造印刷电路板组件的方法
公开(公告)号：US20140119689A1
公开(公告)日：2014-05-01
申请号：US13991742
申请日：2011-12-07
申请人： Gnitaboure Yabre , Yves Stricot
发明人： Gnitaboure Yabre , Yves Stricot
IPC分类号： G02B6/42 , H05K3/30
CPC分类号： G02B6/4269 , G02B6/4206 , G02B6/4214 , G02B6/428 , H05K1/021 , H05K1/0274 , H05K1/141 , H05K1/183 , H05K3/306 , H05K2201/09845 , H05K2201/10121 , H05K2201/10416 , H05K2201/10674 , Y10T29/49139
摘要： Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.
摘要翻译：印刷电路板组件，其包括具有用于承载至少一个光电子部件的承载面的光学子组件，使得从其发射/发射的光通过光学子组件传输; 印刷电路板，具有用于支撑所述光学子组件的支撑区域; 其中所述印刷电路板支撑区域包括覆盖所述光电子部件的至少一部分的孔，并且其中所述承载面的至少一部分通过倒装芯片接合固定到所述支撑区域的至少一部分。

14. 发明申请

US20080260326A1 Optical Coupling Device 审中-公开
标题翻译：光耦合器件
公开(公告)号：US20080260326A1
公开(公告)日：2008-10-23
申请号：US11628173
申请日：2005-06-07
申请人： Gnitabourne Yabre , Bogdan Rosinski , Yves Stricot
发明人： Gnitabourne Yabre , Bogdan Rosinski , Yves Stricot
IPC分类号： G02B6/12
CPC分类号： G02B6/30 , G02B6/2817 , G02B6/3897 , G02B6/4214 , G02B6/43
摘要： The object of the invention is an optical coupling device between at least one waveguide embedded in a printed circuit, for conveying an optical beam (F), and an external waveguide, the circuit including, starting from an exterior surface of the circuit, at least one insulating first layer and at least one internal layer incorporating at least one core of embedded waveguide forming said optical path, the device including a coupling element, positioned in a cut, hollowed out in the circuit and cutting the embedded waveguide, the coupling element being furnished with means of refocusing of the optical beam between the embedded waveguide and the external waveguide and at least one lower positioning surface on a reference surface of the cut in relation to the axis of the embedded waveguide.
摘要翻译：本发明的目的是在嵌入印刷电路中的至少一个波导之间的光耦合装置，用于传送光束（F）和外部波导，该电路至少包括从电路的外表面开始一个绝缘的第一层和至少一个内部层，其包含形成所述光路的至少一个嵌入式波导芯，该装置包括耦合元件，该耦合元件定位在电路中的切割，挖空中并切割嵌入式波导，耦合元件为具有将嵌入式波导和外部波导之间的光束重新聚焦的方式以及相对于嵌入式波导的轴线在切割的参考表面上的至少一个下定位表面。

15. 发明授权

US06767142B2 Optoelectronic emitter-receiver device 失效
标题翻译：光电发射器 - 接收器件
公开(公告)号：US06767142B2
公开(公告)日：2004-07-27
申请号：US10046327
申请日：2001-10-26
申请人： Yves Stricot , Abdelkrim Belhora
发明人： Yves Stricot , Abdelkrim Belhora
IPC分类号： G02B636
CPC分类号： G02B6/4201 , G02B6/3814 , G02B6/4249 , G02B6/4292 , H05K1/189
摘要： An optoelectric device (1) has an emitter and/or receiver (5) on a first element (13) of a printed circuit (2) of this device. Moreover, the device has at least one second printed-circuit element (32) such that the second element is not in alignment with the first element. And consequently, the device provides for the first element and the second element to be applied against separate and secant faces of a heatsink (4) of the device. The function of this heatsink is to evacuate the heat emitted by an optic connection provided on the device. The heatsink also permits supporting and holding the different portions of the printed circuit.
摘要翻译：光电器件（1）在该器件的印刷电路（2）的第一元件（13）上具有发射极和/或接收器（5）。此外，该装置具有至少一个第二印刷电路元件（32），使得第二元件不与第一元件对准。因此，该装置提供第一元件和第二元件施加到装置的散热器（4）的分离的正割面。该散热器的功能是排除设备上提供的光学连接发出的热量。散热器还允许支撑和保持印刷电路的不同部分。

16. 发明授权

US5925925A Three-dimensional integrated circuit package having conductors at different fixed potentials 失效
标题翻译：具有不同固定电位导体的三维集成电路封装
公开(公告)号：US5925925A
公开(公告)日：1999-07-20
申请号：US833060
申请日：1997-04-03
申请人： Gerard Dehaine , Roland Marbot , Michel Moreau , Yves Stricot
发明人： Gerard Dehaine , Roland Marbot , Michel Moreau , Yves Stricot
IPC分类号： H01L23/50 , H01L23/66 , H01L23/552 , H01L23/04 , H01L23/52
CPC分类号： H01L24/48 , H01L23/66 , H01L24/49 , H01L2224/05599 , H01L2224/48091 , H01L2224/48472 , H01L2224/49109 , H01L2224/49175 , H01L2224/4943 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01019 , H01L2924/01033 , H01L2924/01058 , H01L2924/01061 , H01L2924/01078 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/14 , H01L2924/15173 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025
摘要： The invention applies to packages for transmitting signals at very high frequencies. A package (10) for the integrated circuit (11) comprises conductors disposed on at least two levels (N1-N6) and distributed so that two pairs of conductors of two fixed potentials (18d, 18g; 19d, 19g), along with a conductor (18s) for single-pole transmission of a signal, form a three-dimensional structure which is approximately coaxial having a characteristic impedance which is substantially constant and predetermined.
摘要翻译：本发明适用于以非常高的频率传输信号的封装。用于集成电路（11）的封装（10）包括设置在至少两个级（N1-N6）上的导体，并分布成使得两对固定电位的导体（18d，18g，19d，19g）连同一个导体（18s）用于信号的单极传输，形成近似同轴的具有基本恒定和预定的特性阻抗的三维结构。

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