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11. 发明申请

US20070215320A1 HEAT SINK WITH COMBINED FINS 失效
标题翻译：加热组合的FINS
公开(公告)号：US20070215320A1
公开(公告)日：2007-09-20
申请号：US11308297
申请日：2006-03-15
申请人： Gen-Ping Deng , Yi-Qiang Wu
发明人： Gen-Ping Deng , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , F28F3/02 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an edge of the body. The main body has a thickness and defines a through hole (141, 142, 143) therein. The fastener comprises a plurality of alternating bars (200) and positioned portions (212). Each positioned portion has a same thickness as the main body and is accommodated in the through hole. Each bar is sandwiched between two adjacent main bodies, for fixing the fins in position and preventing the fin from sliding along a length direction of the fastener. The bar has a width larger than a diameter of the through hole.
摘要翻译：用于从发热装置移除热量的散热器（10）包括通过其延伸穿过的紧固件（20）互连在一起的多个散热片（12）。每个翅片包括主体（14）和从主体的边缘弯曲的凸缘（16）。主体具有厚度并且在其中限定了通孔（141,142,143）。紧固件包括多个交替的杆（200）和定位部分（212）。每个定位部分具有与主体相同的厚度并且容纳在通孔中。每个杆夹在两个相邻的主体之间，用于将翅片固定在适当位置并防止翅片沿紧固件的长度方向滑动。该杆的宽度大于通孔的直径。

12. 发明申请

US20070058343A1 HEAT PIPE TYPE HEAT DISSIPATION DEVICE 审中-公开
标题翻译：热管式散热装置
公开(公告)号：US20070058343A1
公开(公告)日：2007-03-15
申请号：US11308918
申请日：2006-05-25
申请人： Gen-Ping Deng , Yi-Qiang Wu
发明人： Gen-Ping Deng , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe type heat dissipation device for an electronic component comprises a base, a heat dissipation member and two U-shaped heat pipes connecting the heat dissipation member with the base. The heat pipes each have an evaporation section connected to the base and two condensation sections perpendicularly extending from opposite ends of the evaporation section. The heat dissipation member comprises a cylindrical heat transfer wall constructed around and separated from an axis thereof perpendicular to the base, which defines a through opening. A plurality of fins extends in the through opening from an inner face of the heat transfer wall toward the axis so as to define a plurality of air channels between the fins which extend from one open end of the heat transfer wall to the other.
摘要翻译：用于电子部件的热管式散热装置包括基座，散热构件和将散热构件与基座连接的两个U形热管。热管各自具有连接到基座的蒸发部分和从蒸发部分的相对端垂直延伸的两个冷凝部分。散热构件包括圆柱形传热壁，其围绕垂直于基部的轴线分离并且与其垂直地限定通孔。多个翅片在通孔中从传热壁的内表面朝向轴线延伸，以便在从传热壁的一个开口端延伸到另一个的翅片之间限定多个空气通道。

13. 发明申请

US20100053567A1 PROJECTOR HAVING LED LIGHT SOURCES AND HEAT DISSIPATION DEVICE ASSEMBLY THEREIN 审中-公开
标题翻译：具有LED光源的散热器和散热装置组件
公开(公告)号：US20100053567A1
公开(公告)日：2010-03-04
申请号：US12202401
申请日：2008-09-01
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： G03B21/16
CPC分类号： G03B21/26
摘要： A projector includes first, second and third light sources and first, second and third heat dissipation devices attached to and thermally connecting with the light sources for dissipating heat generated thereby. The first heat dissipation device includes a first heat sink located adjacent to a lateral side of the projector from which a lens protrudes, a fin assembly and a bent heat pipe connecting the first heat sink and the fin assembly. The second heat dissipation device includes a base and a plurality of fins located at a rear side of the projector and defining a stepped portion on which the fin assembly of the first heat dissipation device is mounted. The third heat dissipation device includes a base and a plurality of fins and is located adjacent to an opposite lateral side of the projector.
摘要翻译：投影仪包括第一，第二和第三光源以及附接到光源并与光源热连接的第一，第二和第三散热装置，用于散发由此产生的热量。第一散热装置包括：第一散热器，其位于与投影仪的侧面相邻的透镜突出的侧面;翅片组件和连接第一散热器和散热片组件的弯曲热管。第二散热装置包括基座和位于投影仪后侧的多个翅片，并且限定了第一散热装置的翅片组件安装在其上的阶梯部分。第三散热装置包括基座和多个翅片，并且位于与投影仪的相对侧面相邻的位置。

14. 发明授权

US08322404B2 Heat dissipation device for at least two electronic devices with two sets of fins 失效
标题翻译：用于至少两个具有两组翅片的电子设备的散热装置
公开(公告)号：US08322404B2
公开(公告)日：2012-12-04
申请号：US12391170
申请日：2009-02-23
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20 , H05K7/00 , H01L23/34
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.
摘要翻译：一种用于从电子设备和电子部件移除热量的散热装置，包括与电子设备接触的基板，安装在基板上的第一散热片组和第二散热片组。第一翅片组包括垂直布置在基板上的多个第一翅片。第二翅片组包括附接到第一翅片组的横向侧并垂直于第一翅片和底板的多个第二翅片。风扇安装在第一散热片组的顶部上，第二散热片设置成覆盖它们。由风扇产生的空气流过第一和第二翅片组，以冷却安装在散热装置正交相邻侧面上的电子部件。

15. 发明授权

US07990699B2 Heat dissipation device for memory module 有权
标题翻译：内存模块散热装置
公开(公告)号：US07990699B2
公开(公告)日：2011-08-02
申请号：US12537265
申请日：2009-08-07
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/20
摘要： A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.
摘要翻译：构造成消耗存储器模块的热量的散热装置包括通过枢轴枢转地组装在一起的两个翅片组件，适于布置在存储器模块的两个相对侧表面处的两个散热器和两个热管。两个热管中的每一个包括形成在其两个相对端的蒸发部和冷凝部。热管的冷凝部分分别安装在翅片组件上，热管的蒸发部分分别热连接到散热器上，由此，存储器模块的热量通过散热器的热管传递到散热片组件进行散热。

16. 发明授权

US08109323B2 Heat dissipation device having a clip 失效
标题翻译：具有夹子的散热装置
公开(公告)号：US08109323B2
公开(公告)日：2012-02-07
申请号：US12409502
申请日：2009-03-24
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
摘要翻译：从印刷电路板上的发热电子装置中除去热的散热装置包括底座，安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。每个翅片在其中限定了一个封闭的通孔。翅片的孔协同地限定通道。夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件，其接合将基座和翅片安装到发热电子设备上的锁定梁。

17. 发明授权

US07896597B2 Fastener 失效
标题翻译：紧固件
公开(公告)号：US07896597B2
公开(公告)日：2011-03-01
申请号：US12238420
申请日：2008-09-25
申请人： Feng Hu , Gen-Ping Deng , Chun-Chi Chen
发明人： Feng Hu , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F16B39/22
CPC分类号： F16B35/041 , F16B5/0275 , H01L23/4006 , H01L2924/0002 , Y10T403/335 , H01L2924/00
摘要： A fastener for fastening a heat sink to a printed circuit board via a back plate comprises a head and a shaft extending from the head. The shaft comprises a first and second engaging portions and a connecting portion therebetween. The first and second engaging portions have outer threads on exteriors thereof. Two cutouts are defined in the connecting portion. The back plate defines four thread holes machined with inner threads for engaging with the outer threads. In use of the fastener, an elastic force is produced to the fastener due to a deformation of the two cutouts during the threading. The elastic force helps the outer threads to have a secure engagement with the inner threads whereby the fastener can firmly engage with the back plate even when the fastener is subject to vibration or shock.
摘要翻译：用于通过背板将散热器固定到印刷电路板的紧固件包括头部和从头部延伸的轴。轴包括第一和第二接合部分和它们之间的连接部分。第一和第二接合部分在其外部具有外螺纹。在连接部分中限定了两个切口。后板限定了用内螺纹加工的四个螺纹孔，用于与外螺纹接合。在紧固件的使用中，由于在穿线期间两个切口的变形，对紧固件产生弹性力。弹性力有助于外螺纹与内螺纹的牢固接合，由此即使紧固件受到振动或冲击，紧固件也可以与背板牢固地接合。

18. 发明授权

US08240185B2 Method for manufacturing cover of electronic device and cover obtained thereby 失效
标题翻译：制造电子装置盖的方法和由此得到的盖
公开(公告)号：US08240185B2
公开(公告)日：2012-08-14
申请号：US12495685
申请日：2009-06-30
申请人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
发明人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： B21D41/00 , B23D23/00
CPC分类号： B21D19/08 , Y10T29/49828
摘要： A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.
摘要翻译：一种用于制造电子设备的盖的方法，包括提供金属绿色部件的步骤，所述金属生片包括顶板，底板和互连顶板和底板侧的连接板; 提供型材成型插入件和下模具，所述型材成形插入件形成成形表面，所述下模具限定用于接收所述生坯件的端部的空腔; 将型材成型插入件放入绿色件中，成型模制插入件的成形表面朝着绿色件的端部定向; 将生坯件的端部插入下模具的腔体中并冲压下模具，使得在成型件的端部处的顶板和底板沿着型材成型件的成形表面彼此朝向彼此弯曲。

19. 发明授权

US07914152B2 Portable projector using an LED and related heat dissipation system 失效
标题翻译：便携式投影机采用LED和相关散热系统
公开(公告)号：US07914152B2
公开(公告)日：2011-03-29
申请号：US12024955
申请日：2008-02-01
申请人： Xu Li , Gen-Ping Deng , Chun-Chi Chen
发明人： Xu Li , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： G03B21/16
CPC分类号： G03B21/16 , G03B21/20 , G03B21/2033
摘要： A portable projector with a heat dissipation system, includes a housing and two LED light sources located in the housing. Each of the LED light sources includes a circuit aboard, an LED device mounted on the circuit aboard and a heat pipe. The heat pipe has an evaporating section thermally contacting the circuit board, and a condensing section. A fin set thermally contacts with the condensing section of the heat pipe for dissipating heat therefrom. The fin set of one LED light source is located behind the evaporating section of the heat pipe of the other light source and closely adjacent to a wall of the housing.
摘要翻译：具有散热系统的便携式投影仪包括壳体和位于壳体中的两个LED光源。每个LED光源包括一个电路，一个安装在电路上的LED装置和一个热管。热管具有与电路板热接触的蒸发部分和冷凝部分。翅片组与热管的冷凝部分热接触以从其中散热。一个LED光源的翅片组位于另一光源的热管的蒸发部分的后面，并且紧邻壳体的壁。

20. 发明授权

US07952878B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07952878B2
公开(公告)日：2011-05-31
申请号：US12577736
申请日：2009-10-13
申请人： Zhi-Sheng Lian , Gen-Ping Deng
发明人： Zhi-Sheng Lian , Gen-Ping Deng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.
摘要翻译：一种散热装置，用于散发由安装在印刷电路板上的发热元件产生的热量，包括一个吸热板，其底部附着在发热元件上，两个散热片，两个热管，分别连接吸热板板和两个散热片，两个离心风扇和两个夹子。每个离心式风扇位于相应散热器的侧面。每个夹子包括与吸热板铆接的接合部分和从接合部分的两端延伸并锁定在印刷电路板上的两个锁定部分，从而将吸热板固定在发热部件上。

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