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    • 11. 发明申请
    • IMAGE PICKUP APPARATUS
    • 图像拾取装置
    • US20130222664A1
    • 2013-08-29
    • US13777378
    • 2013-02-26
    • Masafumi TAKAHASHITakashi Ando
    • Masafumi TAKAHASHITakashi Ando
    • H04N5/225
    • H04N5/2328G03B2205/0038H04N5/2254H04N5/23287
    • Provided in an image pickup apparatus are an imaging optical system (12), an image pickup element (22), a fixed member (22) whose position relative to the imaging optical axis OA is fixed, a plurality of movable supporting balls (62), each movably supported with attraction of magnetic force, a movable member (41) in which the image pickup element is provided and which is movably supported by the fixed member with magnetic force through each movable supporting ball (62), a driving mechanism (44, 46, 54, 55, 56, 57) to generate driving force to relatively move the movable member with respect to the fixed member, a display unit (18), a mounting plate to mount the display unit in the casing (11), wherein the mounting plate (70) is provided with a protruding arm portion (74) protruding toward the movable member.
    • 在图像拾取装置中设置有成像光学系统(12),相对于成像光轴OA的位置固定的摄像元件(22),固定部件(22),多个可动支撑球(62) ,每个都可移动地受到磁力的吸引力;可移动构件(41),其中设置有图像拾取元件,并且通过每个可移动支撑球(62)以磁力可动地由固定构件支撑,驱动机构(44) 以产生相对于固定构件相对移动可动构件的驱动力,显示单元(18),将显示单元安装在壳体(11)中的安装板, 其中所述安装板(70)设置有朝向所述可动构件突出的突出臂部(74)。
    • 18. 发明申请
    • Gate-Last Fabrication of Quarter-Gap MGHK FET
    • 最近制造四分之一间隙MGHK FET
    • US20120299123A1
    • 2012-11-29
    • US13570388
    • 2012-08-09
    • Takashi AndoKisik ChoiVijay NarayananTenko YamashitaJunli Wang
    • Takashi AndoKisik ChoiVijay NarayananTenko YamashitaJunli Wang
    • H01L29/78
    • H01L29/517H01L21/28079H01L21/28088H01L29/4958H01L29/4966H01L29/66545
    • A quarter-gap p-type field effect transistor (PFET) formed by gate-last fabrication includes a gate stack formed on a silicon substrate, the gate stack including: a high-k dielectric layer located on the silicon substrate; and a gate metal layer located over the high-k dielectric layer, the gate metal layer including titanium nitride and having a thickness of about 20 angstroms; and a metal contact formed over the gate stack. A quarter-gap n-type field effect transistor (NFET) formed by gate-last fabrication includes a gate stack formed on a silicon substrate, the gate stack including: a high-k dielectric layer located on the silicon substrate; and a first gate metal layer located over the high-k dielectric layer, the first gate metal layer including titanium nitride; and a metal contact formed over the gate stack.
    • 通过栅极最终制造形成的四分之一间隙p型场效应晶体管(PFET)包括形成在硅衬底上的栅极堆叠,所述栅极堆叠包括:位于硅衬底上的高k电介质层; 以及位于高k电介质层上方的栅极金属层,所述栅极金属层包括氮化钛并且具有约20埃的厚度; 以及形成在栅极堆叠上的金属接触。 通过栅极最后制造形成的四分之一间隙n型场效应晶体管(NFET)包括形成在硅衬底上的栅极堆叠,该栅极堆叠包括:位于硅衬底上的高k电介质层; 以及位于所述高k电介质层上方的第一栅极金属层,所述第一栅极金属层包括氮化钛; 以及形成在栅极堆叠上的金属接触。
    • 19. 发明授权
    • Reflow bonding method and method of manufacturing head suspension
    • 回流焊接方法及其制造方法
    • US08317081B2
    • 2012-11-27
    • US12907406
    • 2010-10-19
    • Shogo OgakiTakashi AndoMasaru Inoue
    • Shogo OgakiTakashi AndoMasaru Inoue
    • B23K31/02
    • B23K3/04B23K1/0016G11B5/4833
    • A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.
    • 回流焊接方法通过分别在第一和第二布线构件上限定的第一和第二接合部中的至少一个上的回流焊料容易地将第一和第二布线构件接合在一起。 该方法包括:定位第一和第二布线构件,使得第一和第二接合部分彼此面对,并且夹在它们之间的焊料并且用加热器片的按压面从后面加热和加压第一和第二接合部分中的一个,从而 第一和第二接合部分彼此位于一起并且使得焊料被加热并且回流以将第一和第二配线构件结合在一起。