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    • 12. 发明授权
    • Power saving semsing circuits for dynamic random access memory
    • 动态随机存取存储器的省电语音电路
    • US5280452A
    • 1994-01-18
    • US729120
    • 1991-07-12
    • Sang H. DhongLewis M. Terman
    • Sang H. DhongLewis M. Terman
    • G11C11/409G11C11/4091G11C7/00G11C11/40
    • G11C11/4091
    • A sensing circuit for a dynamic random access memory structure is disclosed having first and second bit lines, one of the bit lines being a reference bit line which is held at a precharge voltage when a sense amplifier in the sensing circuit is latched, the sense amplifier includes first and second nodes and first, second, third and fourth transistor devices, the first and second transistor devices form an N-device cross-coupled pair and the third and fourth transistor devices form a P-device cross-coupled pair. The first node is connected to the first bit line and to the second and fourth transistor devices, and the second node is connected to the first and third transistor devices. A first isolation transistor device is connected to the first bit line and a second isolation transistor device is connected to the second bit line. A first clock signal line is connected to the first isolation transistor device and a second clock signal line is connected to the second isolation transistor device. A first equalization transistor device is connected to the first bit line and a second equalization transistor device is connected to the second bit line, a voltage signal line having a voltage value V.sub.EQ thereon is connected to the first and second equalization transistor devices, and a third clock signal line is connected to the first equalization device. A fourth clock signal line is connected to the second equalization transistor device, a fifth clock signal line is connected to the first and second N devices, a sixth clock signal line is connected to the third and fourth P devices. The first, second, third, fourth and fifth and sixth clock signal lines have clock signals thereon which occur during a time sequence for precharging the first and second nodes to a precharge voltage value V.sub.EQ.
    • 公开了一种用于动态随机存取存储器结构的感测电路,其具有第一和第二位线,位线之一是当感测电路中的读出放大器被锁存时保持在预充电电压的参考位线,读出放大器 包括第一和第二节点以及第一,第二,第三和第四晶体管器件,第一和第二晶体管器件形成N器件交叉耦合对,并且第三和第四晶体管器件形成P器件交叉耦合对。 第一节点连接到第一位线和第二和第四晶体管器件,第二节点连接到第一和第三晶体管器件。 第一隔离晶体管器件连接到第一位线,第二隔离晶体管器件连接到第二位线。 第一时钟信号线连接到第一隔离晶体管器件,第二时钟信号线连接到第二隔离晶体管器件。 第一均衡晶体管器件连接到第一位线,第二均衡晶体管器件连接到第二位线,其上具有电压值VEQ的电压信号线连接到第一和第二均衡晶体管器件,第三均衡晶体管器件 时钟信号线连接到第一均衡装置。 第四时钟信号线连接到第二均衡晶体管器件,第五时钟信号线连接到第一和第二N器件,第六时钟信号线连接到第三和第四P器件。 第一,第二,第三,第四和第五和第六时钟信号线在其上具有时钟信号,其在用于将第一和第二节点预充电到预充电电压值VEQ的时间序列期间发生。
    • 13. 发明授权
    • Dynamic ram cell with MOS trench capacitor in CMOS
    • 具有MOS沟槽电容器的动态RAM单元
    • US4688063A
    • 1987-08-18
    • US920916
    • 1986-10-21
    • Nicky C. LuTak H. NingLewis M. Terman
    • Nicky C. LuTak H. NingLewis M. Terman
    • H01L27/108H01L29/94H01L29/78
    • H01L27/10832H01L29/945
    • This invention relates generally to Dynamic Random Access Memory (DRAM) cells and more particularly relates to a DRAM cell wherein the storage capacitor of the cell is disposed in a trench formed in a semiconductor substrate. Still more particularly, it relates to a DRAM cell wherein at least a portion of the substrate is heavily doped and forms the counterelectrode of the storage capacitor while a heavily doped polycrystalline plug disposed in the trench capacitor forms the other electrode of the storage capacitor. The DRAM cell includes a field effect access transistor disposed in a well which is opposite in conductivity type to that of the substrate. The well itself is formed in a lightly doped portion of the substrate and may be n or p-type conductivity with the other portions of the cell having conductivity types appropriate for devices fabricated in the CMOS environment. The trench capacitor extends from the surface of the well through the well and lightly doped substrate portion into the heavily doped portion of the substrate. The electrode disposed in the trench is directly connected to the source/drain of the access transistor.
    • 本发明一般涉及动态随机存取存储器(DRAM)单元,更具体地说,涉及一种DRAM单元,其中单元的存储电容器设置在形成于半导体衬底中的沟槽中。 更具体地说,本发明涉及一种DRAM单元,其中基板的至少一部分被重掺杂并形成存储电容器的反电极,而设置在沟槽电容器中的重掺杂多晶硅形成存储电容器的另一个电极。 DRAM单元包括放置在与衬底的导电类型相反的阱中的场效应存取晶体管。 阱本身形成在衬底的轻掺杂部分中,并且可以是n型或p型导电性,其中电池的其它部分具有适合于在CMOS环境中制造的器件的导电类型。 沟槽电容器从阱的表面延伸穿过阱和轻掺杂衬底部分到衬底的重掺杂部分。 设置在沟槽中的电极直接连接到存取晶体管的源极/漏极。