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11. 发明申请

US20120049212A1 LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING SUBSTRATE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：具有高效热释放基板的LED芯片封装结构及其制造方法
公开(公告)号：US20120049212A1
公开(公告)日：2012-03-01
申请号：US13292376
申请日：2011-11-09
申请人： BILY WANG , SHIH-YU WU , WEN-KUEI WU
发明人： BILY WANG , SHIH-YU WU , WEN-KUEI WU
IPC分类号： H01L33/64
CPC分类号： F21K9/00 , F21Y2103/10 , F21Y2115/10 , G02B6/0068 , G02B6/0073 , G02B6/0085 , H01L25/0753 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H05K3/202 , H01L2924/00014 , H01L2924/00
摘要： An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips.
摘要翻译：具有高效散热基板的LED芯片封装结构包括基板单元，粘合体，多个LED芯片，封装体和框架层。基板单元具有正基板，负极基板和彼此分离并设置在正极和负极基板之间的多个桥接基板。将粘合体填充在正极和负极和桥接基板之间，以将正极基板，负极基板和桥接基板连接并固定在一起。 LED芯片设置在基板单元上并电连接在正极基板和负极基板之间。封装体分别覆盖LED芯片。框架层分别设置在包装体周围，以在包装体上形成多个光投射表面，并且光投射表面对应于LED芯片。

12. 发明申请

US20120009699A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFICIENCY AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于增加发光效率的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20120009699A1
公开(公告)日：2012-01-12
申请号：US13238101
申请日：2011-09-21
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/52
CPC分类号： H01L33/38 , H01L33/508 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.
摘要翻译：用于提高发光效率的晶片级LED封装结构包括：发光单元，绝缘单元，两个第一导电单元和两个第二导电单元。发光单元具有形成在正导电层和负导电层之间的发光体，正导电层，负极导电层和反射绝缘层。发光体具有底部材料层和顶部材料层。绝缘单元形成在底部材料层的顶表面的外部区域周围，并形成在反射绝缘层的顶表面上。一个第一导电单元形成在正导电层和绝缘单元的一部分上，另一个第一导电单元形成在负导电层和绝缘单元的一部分上。两个第二导电单元分别形成在两个第一导电单元上。

13. 发明申请

US20110147774A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于增加发光效率和散热效果的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20110147774A1
公开(公告)日：2011-06-23
申请号：US12759077
申请日：2010-04-13
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/30 , H01L33/60 , H01L33/48 , H01L33/64 , H01L21/78
CPC分类号： H01L33/46 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，反射单元，第一导电单元和第二导电单元。发光单元具有基板主体，设置在基板主体上的发光体，形成在发光体上的正极和负极导电层，以及形成在发光体中的发光区域。反射单元具有形成在正导电层和负导电层之间的反射层和用于覆盖发光体的外侧的基板主体。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电结构和形成在第一负导电层上的第二负导电结构。

14. 发明申请

US20110003434A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于实现无缝连接电路的半导体芯片封装结构，不使用线形焊接工艺及其制造方法
公开(公告)号：US20110003434A1
公开(公告)日：2011-01-06
申请号：US12877351
申请日：2010-09-08
申请人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
IPC分类号： H01L21/50
CPC分类号： H01L33/62 , H01L21/6835 , H01L23/3121 , H01L24/19 , H01L24/96 , H01L24/97 , H01L33/486 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/48091 , H01L2224/48247 , H01L2924/01027 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove and an outer receiving groove formed around the central receiving groove. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现面朝上电连接的半导体芯片封装结构包括封装单元，半导体芯片，基板单元，第一绝缘单元，第一导电单元，第二导电单元和第二导电单元绝缘单位封装单元具有中心接收槽和围绕中央接收槽形成的外部接收槽。半导体芯片具有多个导电焊盘。第一绝缘单元具有形成在导电焊盘之间的第一绝缘层。第一导电单元具有多个第一导电层。第二导电单元具有形成在第一导电层上的多个第二导电层。第二绝缘单元形成在第一导电层之间和第二导电层之间。

15. 发明申请

US20110003409A1 LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有嵌入式ESD功能的LED芯片封装结构及其制造方法
公开(公告)号：US20110003409A1
公开(公告)日：2011-01-06
申请号：US12876408
申请日：2010-09-07
申请人： BILY WANG , PING-CHOU YANG , JIA-WEN CHEN
发明人： BILY WANG , PING-CHOU YANG , JIA-WEN CHEN
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48247 , Y10T29/41 , H01L2924/00014
摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
摘要翻译： LED芯片封装结构包括导电单元，第一封装单元，ESD单元，第二封装单元，发光单元和第二封装单元。导电单元具有彼此相邻的两个导电销，它们彼此之间形成凹形空间。第一封装单元包围每个导电引脚的一部分，以便形成与凹入空间连通并且暴露每个导电引脚的端侧的接收空间。 ESD单元被容纳在凹形空间中并电连接在两个导电销之间。第二包装单元被容纳在凹形空间中以覆盖ESD单元。发光单元被容纳在接收空间中并且电连接在两个导电引脚之间。第三包装单元被容纳在接收空间中以覆盖发光单元。

16. 发明申请

US20090206465A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于实现电连接的半导体芯片封装结构，不使用线形焊接工艺及其制造方法
公开(公告)号：US20090206465A1
公开(公告)日：2009-08-20
申请号：US12243180
申请日：2008-10-01
申请人： BILY WANG , HUNG-CHOU YANG , JENG-RU CHANG
发明人： BILY WANG , HUNG-CHOU YANG , JENG-RU CHANG
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L24/19 , H01L24/48 , H01L24/96 , H01L24/97 , H01L33/62 , H01L2221/68359 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2224/19 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip package structure for achieving electrical connection without using a wire-bonding process includes: a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip receives in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed among the conductive pads in order to insulate the conductive pads from each other. The first conductive layers are formed on the first insulative layer, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed among the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现电连接的半导体芯片封装结构包括：封装单元，半导体芯片，第一绝缘层，第一导电层，第二绝缘层和第二导电层。包装单元具有接收槽。半导体芯片容纳在接收槽中并且具有设置在其顶表面上的多个导电焊盘。在导电焊盘之间形成第一绝缘层，以使导电焊盘彼此绝缘。第一导电层形成在第一绝缘层上，并且每个第一导电层的一侧电连接到相应的导电焊盘。为了使第一导电层彼此绝缘，在第一导电层之间形成第二绝缘层。第二导电层分别形成在第一导电层的另一相对侧上。

17. 发明申请

US20120106171A1 LED PACKAGE STRUCTURE 审中-公开
标题翻译： LED封装结构
公开(公告)号：US20120106171A1
公开(公告)日：2012-05-03
申请号：US13176799
申请日：2011-07-06
申请人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
IPC分类号： F21V15/00
CPC分类号： H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure includes a conductive substrate unit, a first insulative unit, a second insulative unit, a light-emitting unit and a package unit. The conductive substrate unit includes at least two conductive bases and at least one gap is formed between the two conductive bases. The first insulative unit includes at least one first insulative layer filled in the gap to join the two conductive bases. The second insulative unit includes at least one second insulative layer disposed on the conductive substrate unit and a plurality of openings passing through the second insulative layer for exposing one part of the top surface of each conductive base. The light-emitting unit includes at least one light-emitting element passing one of the openings and electrically connected between the two conductive bases. The package unit includes a package resin body disposed on the second insulative unit to cover the light-emitting element.
摘要翻译： LED封装结构包括导电基板单元，第一绝缘单元，第二绝缘单元，发光单元和封装单元。导电基板单元包括至少两个导电基底，并且在两个导电基底之间形成至少一个间隙。第一绝缘单元包括填充在间隙中以连接两个导电基底的至少一个第一绝缘层。第二绝缘单元包括设置在导电基板单元上的至少一个第二绝缘层和穿过第二绝缘层的多个开口，用于暴露每个导电基底的顶表面的一部分。发光单元包括通过其中一个开口并电连接在两个导电基底之间的至少一个发光元件。封装单元包括设置在第二绝缘单元上以覆盖发光元件的封装树脂体。

18. 发明申请

US20120096710A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20120096710A1
公开(公告)日：2012-04-26
申请号：US13338410
申请日：2011-12-28
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K3/02
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

19. 发明申请

US20120003765A1 LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKING THE SAME 有权
标题翻译： LED芯片包装结构及其制作方法
公开(公告)号：US20120003765A1
公开(公告)日：2012-01-05
申请号：US13232391
申请日：2011-09-14
申请人： BILY WANG , SHIH-YU WU , CHAO-YUAN HUANG , PING-CHOU YANG , CHENG-YEN CHIANG
发明人： BILY WANG , SHIH-YU WU , CHAO-YUAN HUANG , PING-CHOU YANG , CHENG-YEN CHIANG
IPC分类号： H01L33/52
CPC分类号： H01L33/52 , H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
摘要翻译：使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。包装体具有接收空间。两个导电基板被接收在接收空间中。发光元件被容纳在接收空间中并与两个导电基板电连接。包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

20. 发明申请

US20120001203A1 LED CHIP PACKAGE STRUCTURE 审中-公开
标题翻译： LED芯片包装结构
公开(公告)号：US20120001203A1
公开(公告)日：2012-01-05
申请号：US13235585
申请日：2011-09-19
申请人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
发明人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
IPC分类号： H01L27/15 , H01L33/50
CPC分类号： G02B6/0073 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A LED chip package structure includes a substrate unit, a light-emitting unit, and a package unit. The substrate unit includes a strip substrate body. The light-emitting unit includes a plurality of LED chips disposed on the strip substrate body and electrically connected to the strip substrate body. The package unit includes a strip package colloid body disposed on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.
摘要翻译： LED芯片封装结构包括基板单元，发光单元和封装单元。基板单元包括带状基板主体。发光单元包括设置在带状基板主体上并电连接到带状基板主体的多个LED芯片。包装单元包括：带状包装胶体，其设置在带状基材主体上以覆盖LED芯片，其中带状包装胶体具有暴露的顶表面和连接在暴露的顶表面和带状基片主体之间的暴露的外围表面，并且带状包装胶体具有从其暴露的顶表面向上突出并对应于LED芯片的至少一个露出的透镜部分。因此，由LED芯片产生的光束通过条带封装胶体，在带状封装胶体上形成带状发光区域。

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