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11. 发明专利

JP2008110364A Flux for cream solder, and cream solder 审中-公开
标题翻译：用于奶油焊接的焊剂，以及烧结焊料
公开(公告)号：JP2008110364A
公开(公告)日：2008-05-15
申请号：JP2006294007
申请日：2006-10-30
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , MASUDA YOSHINORI , MOMOKI MASAYOSHI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide a flux composition which can improve the cleaning property of a flux or can eliminate a cleaning process by improving a flux base.
SOLUTION: In the flux for cream solder, which flux contains the flux base, a solvent, a thixotropic agent, and an active material, the flux base contains resin (A) having a phenol hydroxyl radical containing a polyhydroxy compound having a total content of 45% or more of a tri-nuclear compound and a tetra-nuclear compound obtained by reacting ortho-phenol (a) having one hydroxyl radical, formaldehyde (b), and phenol (c) having two or more functional groups with each other.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以提高助焊剂清洁性能的焊剂组合物，或者可以通过改善焊剂基来消除清洗过程。解决方案：在助焊剂中，助熔剂包含助熔剂，溶剂，触变剂和活性物质，助熔剂基质含有具有苯酚羟基自由基的树脂（A），其含有多羟基化合物，其具有通过使具有两个以上官能团的具有一个羟基自由基的邻苯酚（a），甲醛（b）和苯酚（c））反应得到的三核化合物和四核化合物的总含量为45％以上，彼此。版权所有（C）2008，JPO＆INPIT

12. 发明专利

JP2014077144A Design method of heat releasing coating material composition 审中-公开
标题翻译：热释放涂层材料组合物的设计方法
公开(公告)号：JP2014077144A
公开(公告)日：2014-05-01
申请号：JP2013254254
申请日：2013-12-09
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社 , Pelnox Ltd , ペルノックス株式会社
发明人： IWAMURA EIJI , KOBAYASHI MICHINORI , MOROZUMI YASUTAKA , TAKAHASHI NAOYA
IPC分类号： C09D201/00 , C09D5/32 , C09D7/12 , C09D123/00 , C09D133/00 , C09D161/20 , C09D161/28 , C09D163/00 , C09D163/02 , C09D167/00 , C09D175/04 , C09K5/08
CPC分类号： C09K5/14 , C08K3/0033 , C08K3/0041 , C08K3/013 , C08K3/014 , C08L33/08 , C09D5/32 , C09D7/1283 , C09D7/69 , C09D133/00 , C09D161/28 , C09D163/00 , C09D167/00 , C09D175/04 , C09D201/00 , Y10T428/31511 , Y10T428/31609 , Y10T428/31663
摘要： PROBLEM TO BE SOLVED: To provide a design method of a heat releasing coating material composition capable of forming a coating film having high heat releasing efficiency in a specific heat energy wave region in which several heat generating products generate heat as the countermeasure, for heat generation to the heat generating products.SOLUTION: There is provided a design method of a heat releasing coating material which is a liquid or pasty heat releasing coating material containing an infrared absorptive binder resin (A), infrared absorptive inorganic particles (B) and an organic solvent and has percentages of (A) component and (B) component based on 100 vol.% of the total of both components, (A) component: 10 to 70 vol.% and (B) component: 90 to 30 vol.%, and satisfies the conditions 1, 2 and 3 for applying to heat generating products.
摘要翻译：要解决的问题：为了提供一种散热涂料组合物的设计方法，该组合物能够在其中产生热量的几个发热产物作为对策的特定热能波段中形成具有高放热效率的涂膜，用于发热提供了一种散热涂层材料的设计方法，其是含有红外吸收性粘合剂树脂（A），红外线吸收性无机颗粒（B）和有机物（B）的液体或糊状散热涂料溶剂，并且具有（A）成分和（B）成分的百分比，基于两种成分的总量的100体积％，（A）成分：10〜70体积％，（B）成分：90〜30体积％，并且满足用于施加到发热产品的条件1,2和3。

13. 发明专利

JP2009013346A Polyamic acid fine particle or polyimide fine particle, and method for producing polyamic acid fine particle and polyimide fine particle 有权
标题翻译：聚酰亚胺微粒或聚酰亚胺微粒及其生产聚酰亚胺微粒和聚酰亚胺微粒的方法
公开(公告)号：JP2009013346A
公开(公告)日：2009-01-22
申请号：JP2007178766
申请日：2007-07-06
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： TOGASHI HARUHISA , IWAMURA EIJI
IPC分类号： C08J3/12 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a globular composite polyimide fine particle and polyamic acid fine particle having a flat and smooth surface, and to provide a method for producing the same. SOLUTION: The polyamic acid fine particle or polyimide fine particle has, on an outer layer of a core fine particle (D), at least two layers of a polyamic acid layer and/or a polyimide layer, and has a flat and smooth surface the surface roughness of which is COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供具有平坦光滑表面的球状复合聚酰亚胺微粒和聚酰胺酸微粒，并提供其制造方法。解决方案：聚酰胺酸微粒或聚酰亚胺微粒在芯细颗粒（D）的外层上具有至少两层聚酰胺酸层和/或聚酰亚胺层，并且具有平坦和光滑的表面粗糙度<20nm。两个设置在芯细颗粒（D）的外层上的聚酰胺酸层和/或聚酰亚胺层的厚度优选为0.1-400μm。版权所有（C）2009，JPO＆INPIT

14. 发明专利

JP2008110380A Flux for cream solder, and cream solder 审中-公开
标题翻译：用于奶油焊接的焊剂，以及烧结焊料
公开(公告)号：JP2008110380A
公开(公告)日：2008-05-15
申请号：JP2006295221
申请日：2006-10-31
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , MASUDA YOSHINORI , MOMOKI MASAYOSHI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide flux composition and cream solder, by which flux composition and cream solder, the release property in screen printing can be remarkably improved, and further the generation of voids in a solder joint portion can be suppressed.
SOLUTION: The flux for the cream solder, which flux contains 0.05 to 10 vol.% of at least one of spheroidal polymer fine particles to be selected from the group consisting of polyimide fine particles, polyurea fine particles, benzoguanimine fine particles, acrylic cross linking fine particles, and styrenic crosslinking fine particles, and the cream solder, which contains solder particles and the flux for the cream solder, are used.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供助焊剂组合物和膏状焊料，通过其可以显着提高焊剂组合物和膏状焊料的丝网印刷中的剥离性能，并且可以抑制焊接部分中的空隙的产生。＆lt; P＆gt;解决方案：该焊膏的焊剂含有0.05〜10体积％的选自聚酰亚胺微粒，聚脲微粒，苯并胍亚胺微粒的球状聚合物微粒中的至少一种，丙烯酸交联微粒和苯乙烯交联微粒，以及包含焊料颗粒的膏状焊剂和用于膏状焊剂的焊剂。版权所有（C）2008，JPO＆INPIT

15. 发明专利

JP2008110363A Flux for cream solder, and cream solder composition 审中-公开
标题翻译：油炸机焊剂和烧结焊料组合物
公开(公告)号：JP2008110363A
公开(公告)日：2008-05-15
申请号：JP2006294006
申请日：2006-10-30
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , MASUDA YOSHINORI , MOMOKI MASAYOSHI
IPC分类号： B23K35/363 , B23K1/00 , B23K35/22 , B23K35/26 , B23K101/42 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux composition which can improve the cleaning property of a flux or can eliminate a cleaning process by improving a flux base.
SOLUTION: In the flux for cream solder, which flux contains the flux base, a solvent, a thixotropic agent, and an active material, the flux base contains a ketone resin (A). The ketone resin (A) can be obtained by reacting formaldehyde with at least one of cyclohexane, acetophenone, methyl ethyl ketone, and methylcyclohexanone.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以提高助焊剂清洁性能的焊剂组合物，或者可以通过改善焊剂基来消除清洗过程。解决方案：助熔剂含有酮树脂（A），在助焊剂中含有助熔剂，溶剂，触变剂和活性物质的助焊剂。酮树脂（A）可以通过使甲醛与环己烷，苯乙酮，甲基乙基酮和甲基环己酮中的至少一种反应而得到。版权所有（C）2008，JPO＆INPIT

16. 发明专利

CA2781956C SOLDER PASTE 未知
公开(公告)号：CA2781956C
公开(公告)日：2014-02-11
申请号：CA2781956
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

17. 发明专利

CA2781958A1 FLUX FOR SOLDER PASTE AND SOLDER PASTE 未知
公开(公告)号：CA2781958A1
公开(公告)日：2011-06-16
申请号：CA2781958
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

18. 发明专利

CA2781958C FLUX FOR SOLDER PASTE AND SOLDER PASTE 未知
公开(公告)号：CA2781958C
公开(公告)日：2015-04-07
申请号：CA2781958
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

19. 发明专利

CA2781956A1 SOLDER PASTE 未知
公开(公告)号：CA2781956A1
公开(公告)日：2011-06-16
申请号：CA2781956
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

20. 发明公开

EP2524763A4 SOLDER PASTE 有权转让
标题翻译：锡膏
公开(公告)号：EP2524763A4
公开(公告)日：2016-10-05
申请号：EP10835925
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI COMPANY LTD , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

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