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    • 11. 发明授权
    • Semiconductor microsystem embedded in flexible foil
    • 半导体微系统嵌入在柔性箔中
    • US06479890B1
    • 2002-11-12
    • US09600515
    • 2000-08-31
    • Hoc Khiem TrieuWilfried MokwaLutz Ewe
    • Hoc Khiem TrieuWilfried MokwaLutz Ewe
    • H01L2302
    • H01L25/065H01L23/5387H01L24/24H01L25/0655H01L2224/24137H01L2924/12044H01L2924/14H01L2924/18162H01L2924/00
    • A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.
    • 微系统包括柔性箔,嵌入所述柔性箔中的多个半导体元件以及基本上布置在所述柔性箔上并用于电连接至少两个半导体元件的连接线。 为了制造微系统,电子部件首先集成在设置在晶片上的半导体层中。 随后,蚀刻掉电子部件之间不需要的半导体区域,从而施加柔性箔。 然后将连接线施加到柔性箔,以便互连各个半导体元件。 最后,将半导体从背面蚀刻掉,以便在单个半导体元件仅由柔性箔而不再由半导体衬底机械连接的情况下获得微系统。