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11. 发明申请

US20050191699A1 Reactive probe chip, composite substrate and method for fabrication of the same 审中-公开
标题翻译：反应性探针芯片，复合基板及其制造方法
公开(公告)号：US20050191699A1
公开(公告)日：2005-09-01
申请号：US11118357
申请日：2005-05-02
申请人： Hiroshi Nagasawa , Akira Fukunaga , Masayoshi Hirose
发明人： Hiroshi Nagasawa , Akira Fukunaga , Masayoshi Hirose
IPC分类号： C12Q1/68 , C40B40/06 , C40B60/14 , G01N33/543 , G01N33/545 , G01N33/552 , C12M1/34
CPC分类号： G01N33/54346 , B01J2219/00317 , B01J2219/00497 , B01J2219/00527 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00621 , B01J2219/00626 , B01J2219/0063 , B01J2219/00637 , B01J2219/00641 , B01J2219/00644 , B01J2219/00659 , B01J2219/00722 , C40B40/06 , C40B60/14 , G01N33/545 , G01N33/552
摘要： A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed. The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier. A composite substrate characterized in that on at least a section of the surface thereof, a plurality of porous regions are orderly arranged as compartments by non-porous regions, or a plurality of non-porous regions are orderly arranged as compartments by porous regions is also disclosed. The porous solid is preferably porous glass or porous ceramic, the porous glass is preferably split-phase porous glass, and the surface is preferably flattened by a process such as polishing.
摘要翻译：反应探针芯片，其通过将反应性探针载载在诸如颗粒，瓦片状平板的细小载体上，然后将反应性探针负载的载体排列并固定在基材上来制备。诸如颗粒，瓦片状板等的载体细片是多孔的或具有反应性表面，并且基材优选为薄的无机板或薄的有机板。无机基材优选为玻璃载玻片或硅晶片，有机基材优选为聚酯膜或聚乙烯膜。在使用多孔载体片的情况下，多孔载体孔的内表面的反应性应保持在反应性探针负载的载体的阵列或固定过程中。一种复合基板，其特征在于，在其表面的至少一部分上，多个多孔区域通过非多孔区域有序地布置为隔室，或者多个非多孔区域通过多孔区域有序地布置为隔室也是披露多孔固体优选为多孔玻璃或多孔陶瓷，多孔玻璃优选为分相多孔玻璃，优选通过抛光等方法使表面变平。

12. 发明授权

US06743395B2 Composite metallic ultrafine particles and process for producing the same 失效
公开(公告)号：US06743395B2
公开(公告)日：2004-06-01
申请号：US09811581
申请日：2001-03-20
申请人： Akira Fukunaga , Hiroshi Nagasawa , Kaori Kagoshima , Makiko Emoto
发明人： Akira Fukunaga , Hiroshi Nagasawa , Kaori Kagoshima , Makiko Emoto
IPC分类号： C22C3200
CPC分类号： H01L21/67167 , B01J13/0043 , B22F1/0018 , B22F1/0059 , B22F1/0062 , B22F9/24 , B22F2998/00 , B82Y30/00 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/3212 , H01L21/67034 , H01L21/67051 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67219 , H01L21/76877 , H05K3/102 , Y10T428/2998
摘要： The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.

13. 发明授权

US06740242B2 Plating apparatus and method of managing plating liquid composition 失效
标题翻译：电镀液组成的电镀装置和方法
公开(公告)号：US06740242B2
公开(公告)日：2004-05-25
申请号：US09994755
申请日：2001-11-28
申请人： Akira Fukunaga , Hiroshi Nagasawa
发明人： Akira Fukunaga , Hiroshi Nagasawa
IPC分类号： B01D1508
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/12 , G01N30/461 , B01D15/34 , B01D15/327
摘要： A plating apparatus comprises a plating unit having a plating bath for holding a plating liquid therein, and a planting monitoring unit having a liquid chromatography device and an arithmetical unit. The liquid chromatography device serves to separate and quantify an additive in a sample of the planting liquid. The arithmetical unit serves to compare a quantified value of the additive with a given concentration predetermined for the additive and to produce an output signal representing the compare result. The plating apparatus further comprises an additive replenishing unit for adding a solution including the additive from an additive tank to the plating liquid in the planting bath based on the output signal from the arithmetical unit in the plating liquid monitoring unit.
摘要翻译：电镀装置包括具有用于保持电镀液的电镀液的电镀单元，以及具有液相色谱装置和算术单元的种植监视单元。液相色谱装置用于分离和定量种植液样品中的添加剂。算术单元用于将添加剂的量化值与为添加剂预定的给定浓度进行比较，并产生表示比较结果的输出信号。电镀装置还包括添加剂补充单元，其基于来自电镀液监测单元中的算术单元的输出信号，将来自添加剂槽的添加剂的溶液与种植槽中的电镀液相加。

14. 发明申请

US20050003556A1 Probe Beads for affirnity reaction and detection system 审中-公开
标题翻译：探针珠用于感染反应和检测系统
公开(公告)号：US20050003556A1
公开(公告)日：2005-01-06
申请号：US10493017
申请日：2002-10-31
申请人： Hiroshi Nagasawa , Masayoshi Hirose , Akira Fukunaga
发明人： Hiroshi Nagasawa , Masayoshi Hirose , Akira Fukunaga
IPC分类号： G01N33/53 , C12M1/00 , C12N15/09 , C12Q1/68 , G01N33/552 , G01N33/566 , G01N33/543
CPC分类号： C12Q1/6834 , C12Q2563/149
摘要： The present invention discloses affinity reaction probe beads having a structure comprising probe molecules immobilized on porous bead carriers provided with one or more individual identification signals among individual identification signals including optical signals such as digital signals using optical graphics, for example, bar codes or dot matrix bar codes, and color signals based on color information; and radio or electronic signals which issue individual information, such as IC tags, or tuning circuits or oscillation circuits for radio waves or electricity, a method for producing the affinity reaction probe beads, and an analyte detection system using the affinity reaction probe beads. By using the affinity reaction probe beads, the invention provides a reaction detection system which can be utilized for various physiological function diagnoses such as a diagnosis of single-nucleotide polymorphism (SNPs).
摘要翻译：本发明公开了具有包含固定在多孔珠载体上的探针分子的结构的亲和反应探针珠，所述探针分子在包括诸如使用光学图形的数字信号的光信号（例如条形码或点阵）的各个识别信号之间提供一个或多个个体识别信号条形码和基于颜色信息的彩色信号; 发出诸如IC标签的个人信息的无线电或电子信号，或用于无线电波或电的调谐电路或振荡电路，生成亲和反应探针珠的方法和使用亲和反应探针珠的分析物检测系统。通过使用亲和反应探针珠，本发明提供了可用于各种生理功能诊断如单核苷酸多态性（SNP）诊断的反应检测系统。

15. 发明申请

US20100105154A1 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：US20100105154A1
公开(公告)日：2010-04-29
申请号：US12685820
申请日：2010-01-12
申请人： XINMING WANG , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
发明人： XINMING WANG , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
IPC分类号： H01L21/66 , H01L21/46
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译：基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。

16. 发明授权

US07498261B2 Method and apparatus for forming metal film 有权
标题翻译：用于形成金属膜的方法和装置
公开(公告)号：US07498261B2
公开(公告)日：2009-03-03
申请号：US11219777
申请日：2005-09-07
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1669 , C23C18/32 , H01L21/76846 , H01L21/76849 , H01L21/76874
摘要： A metal film-forming method of the present invention can form a metal film having different film qualities in the thickness direction, in a continuous manner using a single processing solution. The metal film-forming method including: providing a substrate having embedded interconnects formed in interconnect recesses provided in a surface of the substrate; and forming a metal film, having different film qualities in the thickness direction, on surfaces of the interconnects in a continuous manner by changing the flow state of a processing solution relative to the surface of the substrate while keeping the surface of the substrate in contact with the processing solution.
摘要翻译：本发明的金属成膜方法可以使用单一的处理液以连续的方式形成厚度方向的膜质量不同的金属膜。所述金属成膜方法包括：提供具有形成在所述基板的表面中的互连凹槽中的嵌入式互连的基板; 并且通过在保持基板的表面与基板的表面接触的同时改变处理液相对于基板的表面的流动状态，以连续的方式在相互连接的表面上形成在厚度方向上具有不同膜质量的金属膜处理方案。

17. 发明授权

US07407821B2 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US07407821B2
公开(公告)日：2008-08-05
申请号：US10874245
申请日：2004-06-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
IPC分类号： H01L21/66
CPC分类号： H01L21/76849 , C23C18/1608 , C23C18/1675 , C23C18/1692 , C23C18/1879 , H01L21/288 , H01L21/76864 , H01L21/76874 , H01L22/12 , H01L22/20 , H01L2223/54466
摘要： There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement.
摘要翻译：提供了可以根据需要测量和监测在基板上形成的膜的厚度和/或性能的基板处理方法和装置，并且可以快速地校正工艺条件的偏差，因此可以稳定地提供恒定品质的产品。一种基板处理方法，用于处理具有金属和绝缘材料的基板，所述基板以其金属的暴露表面作为基准面的方式选择性地或优先地改变的金属的膜厚度包括测量处理期间和/或紧随其后的金属的膜厚度和/或膜性质的变化，以及基于该测量结果的监测处理和调整处理条件。

18. 发明申请

US20070289604A1 Substrate Processing Apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20070289604A1
公开(公告)日：2007-12-20
申请号：US11587974
申请日：2005-04-27
申请人： Yukio Fukunaga , Akira Susaki , Junji Kunisawa , Hiroyuki Ueyama , Shohei Shima , Akira Fukunaga , Hideki Tateishi , Junko Mine
发明人： Yukio Fukunaga , Akira Susaki , Junji Kunisawa , Hiroyuki Ueyama , Shohei Shima , Akira Fukunaga , Hideki Tateishi , Junko Mine
IPC分类号： C23G1/02 , B08B3/00 , G05D23/00 , G05D99/00
CPC分类号： H01L21/76838 , H01L21/02063 , H01L21/02068 , H01L21/67253
摘要： To provide an apparatus and a method capable of supplying a gas containing an evaporated reducing organic compound while strictly controlling the flow rate thereof to process a surface of a metal on a substrate without causing any deterioration of various types of films forming a semiconductor element with a simple apparatus configuration. The apparatus includes a process chamber 10 for keeping a substrate W therein, the process chamber 10 being gastight, an evacuation control system 20 for controlling the pressure in the process chamber 10, and a process gas supply system 30 for supplying a process gas containing a reducing organic compound to the process chamber 10. The process gas supply system 30 has an evaporator 32 keeping liquid material of the reducing organic compound therein and having an evaporating liquid surface S, a process gas pipe 18 for directing the process gas containing the reducing organic compound evaporated in the evaporator 32 into the process chamber 10, and a throttle element 40 disposed in the process gas pipe 18 for controlling the flow rate of the process gas to be supplied to the process chamber 10 by adjusting the opening of the throttle element 40. The opening of the throttle element 40 is so set that the pressure variation in the evaporator 32 can be maintained within a prescribed range.
摘要翻译：提供一种能够提供含有蒸发还原性有机化合物的气体的装置和方法，同时严格控制其流速来处理基板上的金属表面，而不会导致形成半导体元件的各种类型的膜的劣化简单的设备配置。该装置包括用于将基板W保持在其中的处理室10，气密的处理室10，用于控制处理室10中的压力的抽空控制系统20以及用于提供含有将有机化合物还原成处理室10。工艺气体供给系统30具有：蒸发器32，其中还原有机化合物的液体材料保持在其中并具有蒸发的液体表面S;一个工艺气体管道18，用于将含有在蒸发器32中蒸发的还原性有机化合物的工艺气体引导到过程设置在处理气体管道18中的节流元件40，用于通过调节节流元件40的开口来控制供给处理室10的处理气体的流量。节流元件40的开度被设定为使得蒸发器32中的压力变化可以保持在规定范围内。

19. 发明申请

US20070254558A1 Polishing Apparatus and Polishing Method 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20070254558A1
公开(公告)日：2007-11-01
申请号：US11661141
申请日：2005-08-26
申请人： Masako Kodera , Yoshihiro Mochizuki , Akira Fukuda , Akira Kodera , Hirokuni Hiyama , Manabu Tsujimura , Kazuto Hirokawa , Akira Fukunaga
发明人： Masako Kodera , Yoshihiro Mochizuki , Akira Fukuda , Akira Kodera , Hirokuni Hiyama , Manabu Tsujimura , Kazuto Hirokawa , Akira Fukunaga
IPC分类号： B24B37/04 , H01L21/00
CPC分类号： H01L21/6708 , B24B37/005 , B24B37/042 , B24B37/046 , B24B49/006 , B24B57/02
摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).
摘要翻译：抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。

20. 发明授权

US07055535B2 Holding unit, processing apparatus and holding method of substrates 失效
标题翻译：保持单元，加工设备和基板的保持方法
公开(公告)号：US07055535B2
公开(公告)日：2006-06-06
申请号：US10629678
申请日：2003-07-30
申请人： Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
发明人： Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
IPC分类号： B08B3/08 , B25B11/00 , H01L21/306
CPC分类号： H01L21/6838 , Y10S134/902 , Y10T279/11
摘要： A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.
摘要翻译：保持单元保持基板以使得能够处理基板的表面。该单元具有与基板的表面的周边部分接触并吸附基板的真空吸附构件。处理装置稳定地保持晶片，并且允许晶片的边缘，斜面部分和/或背面被处理。

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