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11. 发明授权

US09704649B2 Method for producing ceramic electronic component 有权
公开(公告)号：US09704649B2
公开(公告)日：2017-07-11
申请号：US13105926
申请日：2011-05-12
申请人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
发明人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
IPC分类号： B05D5/12 , H01G2/10 , H01G4/224 , B05D7/14 , B05D1/38
CPC分类号： H01G2/103 , B05D1/38 , B05D5/12 , B05D7/14 , H01G4/224
摘要： In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

12. 发明授权

US07589951B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US07589951B2
公开(公告)日：2009-09-15
申请号：US12030360
申请日：2008-02-13
申请人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
发明人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/2325 , Y10T29/435
摘要： A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
摘要翻译：制备层叠体，其中在内部电极暴露的端面处，相邻设置的内部电极彼此电隔离，并且沿着沿着所述内部电极的测量沿相邻设置的内部电极之间的距离为约20mum以下绝缘体层的厚度方向，从端面测定时，内部电极的取出深度为1μm以下。在化学镀的步骤中，形成在多个内部电极的端部的电镀沉积物的尺寸增加以彼此连接。

13. 发明授权

US08448313B2 Method for producing ceramic body 有权
标题翻译：陶瓷体生产方法
公开(公告)号：US08448313B2
公开(公告)日：2013-05-28
申请号：US13167751
申请日：2011-06-24
申请人： Tatsuo Kunishi , Junichi Saito , Yoshinori Ueda , Akihiro Motoki
发明人： Tatsuo Kunishi , Junichi Saito , Yoshinori Ueda , Akihiro Motoki
IPC分类号： H01G4/30
CPC分类号： H01G4/105 , H01G4/1209 , H01G4/30 , H01L41/273 , Y10T29/43 , Y10T29/435 , Y10T29/49002
摘要： Provided is a method for producing a ceramic body, which is capable of preventing the ingress of moisture into a void between a conductor and the ceramic body more effectively in the ceramic body including the conductor therein. Ingress of a supercritical fluid containing an oxide sol precursor is achieved into a void between an internal electrode layer and a ceramic laminate. After that, the oxide sol is turned into a gel, and subjected to a heat treatment, thereby filling the void between the internal electrode layer and the ceramic laminate with an oxide.
摘要翻译：提供一种陶瓷体的制造方法，其能够防止在包含导体的陶瓷体中更有效地将水分进入导体和陶瓷体之间的空隙。含有氧化物溶胶前体的超临界流体的入口被实现为内部电极层和陶瓷层压体之间的空隙。之后，将氧化物溶胶变成凝胶，进行热处理，由氧化物填充内部电极层和陶瓷层叠体之间的空隙。

14. 发明授权

US06500327B1 Sn-Bi alloy plating bath and method of plating using the same 失效
标题翻译： Sn-Bi合金电镀浴及其使用方法
公开(公告)号：US06500327B1
公开(公告)日：2002-12-31
申请号：US09497808
申请日：2000-02-03
申请人： Junichi Saitoh , Tatsuo Kunishi , Yukio Hamaji
发明人： Junichi Saitoh , Tatsuo Kunishi , Yukio Hamaji
IPC分类号： C25D360
CPC分类号： C25D3/60
摘要： An Sn—Bi alloy plating bath has a pH about 2.0 to 9.0 and comprises Bi3+ ions, Sn2+ ions, complexing agent (I) and complexing agent (II). Complexing agent (I) can be (a) aliphatic dicarboxylic acids having alkyl groups of 1-3 carbon atoms, (b) aliphatic hydroxymonocarboxylic acids having alkyl groups of 1-3 carbon atoms, (c) aliphatic hydroxypolycarboxylic acids having alkyl groups of 1-4 carbon atoms, (d) monosaccharides, polyhydroxycarboxylic acids produced by partially oxidizing the monosaccharides, and their cyclic ester compounds, and (e) condensed phosphoric acids. Complexing Agent (II) can be (s) ethylenediamineteraacetic acid (EDTA), (t) nitrilotriacetic acid (NTA), and (u) trans-1,2-cyclohexanediaminetetraacetic acid (CyDTA).
摘要翻译： Sn-Bi合金镀液的pH约为2.0〜9.0，含有Bi3 +离子，Sn2 +离子，络合剂（I）和络合剂（II）。络合剂（I）可以是（a）具有1-3个碳原子的烷基的脂肪族二羧酸，（b）具有1-3个碳原子的烷基的脂族羟基单羧酸，（c）具有烷基的脂族羟基多羧酸1 -4个碳原子，（d）单糖，通过部分氧化单糖产生的多羟基羧酸及其环酯化合物，和（e）缩合磷酸。络合剂（II）可以是乙二胺四乙酸（EDTA），（t）次氮基三乙酸（NTA）和（u）反式-1,2-环己烷二胺四乙酸（CyDTA）。

15. 发明授权

US06780456B2 Method of manufacturing electronic part, electronic part and electroless plating method 有权
标题翻译：电子零件，电子零件和化学镀方法的制造方法
公开(公告)号：US06780456B2
公开(公告)日：2004-08-24
申请号：US10315949
申请日：2002-12-11
申请人： Tatsuo Kunishi , Toshi Numata , Junichi Saitoh , Yukio Sakabe
发明人： Tatsuo Kunishi , Toshi Numata , Junichi Saitoh , Yukio Sakabe
IPC分类号： B05D512
CPC分类号： H05K3/244 , C23C18/1607 , C23C18/1651 , C23C18/1669 , C23C18/34 , C23C18/36 , C23C18/44 , C23C18/54
摘要： A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.
摘要翻译：将工件与平均直径为1mm的Ni片混合，并且在含有还原剂的镀浴和Ni盐中显示出对作为还原剂加入的次膦酸钠（NaH 2 PO 2）的氧化反应的催化活性，形成Ni- 通过自动催化无电镀法在Cu，Ag或Ag-Pd制成的电极上的P膜。然后，将工件浸入含有Au盐的镀浴中，通过替代无电镀在Ni-P膜的表面上形成Au膜。该方法能够以低成本仅在期望的部分形成期望的镀膜。

16. 发明授权

US06660071B2 Electroless copper plating bath, electroless copper plating method and electronic part 失效
公开(公告)号：US06660071B2
公开(公告)日：2003-12-09
申请号：US09880335
申请日：2001-06-13
申请人： Yasushi Yoshida , Tatsuo Kunishi
发明人： Yasushi Yoshida , Tatsuo Kunishi
IPC分类号： C23C1840
CPC分类号： C04B41/009 , C04B41/5127 , C04B2111/00844 , C23C18/38 , C23C18/40 , C04B41/4541 , C04B35/00
摘要： An electroless copper plating bath containing a cupric compound, a cupric ion complexing agent, a reducing agent, and a pH adjusting agent is provided, in which a carboxylic acid is added as a reaction accelerator to accelerate the oxidation reaction of the reducing agent. It does not need to use formaldehyde as the reducing agent yet it has a plating reaction velocity which is equivalent to that of a bath in which formaldehyde is contained as the reducing agent.

17. 发明授权

US06358390B1 Method for forming electrode 有权
标题翻译：电极形成方法
公开(公告)号：US06358390B1
公开(公告)日：2002-03-19
申请号：US09670930
申请日：2000-09-28
申请人： Yasushi Yoshida , Tatsuo Kunishi
发明人： Yasushi Yoshida , Tatsuo Kunishi
IPC分类号： C25D554
CPC分类号： C25D5/54 , H05K1/0306 , H05K3/188
摘要： A method for forming an electrode on a surface of an electronic device formed of a ceramic material is disclosed. The method comprises the steps of: adjusting a polarity of a surface charge by immersing the electronic device in a solution containing a cationic or an anionic surfactant; depositing an electroconductive material on the surface of the electronic device by contacting the electronic device with an electroconductive solution containing the electroconductive material having a polarity opposite to the adjusted polarity of the surface charge; and performing electrolytic plating using the electroconductive material deposited on the surface of the electronic device as an underlying metal film.
摘要翻译：公开了一种在由陶瓷材料形成的电子器件的表面上形成电极的方法。该方法包括以下步骤：通过将电子器件浸入含有阳离子或阴离子表面活性剂的溶液中来调节表面电荷的极性; 通过使电子器件与含有与调节的表面电荷极性相反的极性的导电材料的导电溶液接触，在电子器件的表面上沉积导电材料; 并使用沉积在电子器件表面上的导电材料作为下面的金属膜进行电解电镀。

18. 发明授权

US06195248B1 Electronic component having a tin alloy plating film 失效
标题翻译：具有锡合金镀膜的电子部件
公开(公告)号：US06195248B1
公开(公告)日：2001-02-27
申请号：US09206599
申请日：1998-12-07
申请人： Tatsuo Kunishi , Masanori Endo , Yu Tokuda , Yukiko Fujii
发明人： Tatsuo Kunishi , Masanori Endo , Yu Tokuda , Yukiko Fujii
IPC分类号： H01G412
CPC分类号： H01G4/232 , H01C1/142 , H05K3/3442
摘要： An electronic component has a body; a metal film formed on the body; and a tin alloy plating film formed on the metal film. The tin alloy plating film contains Sn and at least one additive metal selected from the group consisting of Bi, Ni, Ag, Zn and Co.
摘要翻译：电子元件有一个主体; 在身体上形成的金属膜; 以及形成在金属膜上的锡合金镀膜。锡合金镀膜含有Sn和选自Bi，Ni，Ag，Zn和Co.中的至少一种添加剂金属。

19. 发明授权

US5367431A Thin power supply unit 失效
标题翻译：薄电源单元
公开(公告)号：US5367431A
公开(公告)日：1994-11-22
申请号：US964785
申请日：1992-10-22
申请人： Tatsuo Kunishi , Kouichi Watanabe , Masanori Endo , Masato Higuchi
发明人： Tatsuo Kunishi , Kouichi Watanabe , Masanori Endo , Masato Higuchi
IPC分类号： H01G9/00 , H01G9/08 , H01G11/00 , H01G11/10 , H01G11/66 , H01G11/74 , H01G11/78 , H01M2/10 , H01M2/20 , H01M2/30 , H01M6/16 , H01M6/46 , H01M10/05 , H01G1/035
CPC分类号： H01G9/155 , H01G9/08 , H01M2/1066 , H01M2/204 , H01M6/46 , Y02E60/13
摘要： A plurality of flat power supply elements, each having a flat case for serving as an element terminal and an electrode plate arranged in the case in a close contact manner through an insulating layer for serving as another element terminal. An opening formed in the case for partially exposing the electrode plate. The flat power supply elements are bonded onto a flexible circuit board by an insulating bonding layer. A first external connection terminal which is provided on the circuit board is connected to the electrode plate of one power supply element through a first conductive member. A connecting conductor which is also provided on the circuit board is electrically connected to the case of this one power supply element through a second conductive member and connected to the electrode plate of another power supply element through a third conductive member. A second external connection terminal which is provided on the circuit board is electrically connected to the case of this another power supply element through a fourth conductive member. Thus, a plurality of flat power supply elements having excellent sealing structures are combined with each other to provide an integrated thin power supply unit with no increase in thickness.
摘要翻译：多个扁平电源元件，每个扁平电源元件具有用作元件端子的平坦壳体和以紧密接触方式布置在壳体中的绝缘层用作另一元件端子的电极板。在用于部分暴露电极板的情况下形成的开口。扁平电源元件通过绝缘接合层接合到柔性电路板上。设置在电路板上的第一外部连接端子通过第一导电构件连接到一个电源元件的电极板。还设置在电路板上的连接导体通过第二导电构件与该一个电源元件的壳体电连接，并且通过第三导电构件连接到另一个电源元件的电极板。设置在电路板上的第二外部连接端子通过第四导电部件与该另一个电源元件的壳体电连接。因此，具有优异的密封结构的多个扁平电源元件彼此组合以提供不增加厚度的集成薄电源单元。

20. 发明授权

US5279623A Method of fabricating flat type electrochemical device 失效
标题翻译：扁平型电化学装置的制造方法
公开(公告)号：US5279623A
公开(公告)日：1994-01-18
申请号：US919854
申请日：1992-07-27
申请人： Kouichi Watanabe , Kunio Nishida , Tatsuo Kunishi , Masanori Endo , Shunjiro Imagawa
发明人： Kouichi Watanabe , Kunio Nishida , Tatsuo Kunishi , Masanori Endo , Shunjiro Imagawa
IPC分类号： H01G2/10 , H01G4/224 , H01G9/00 , H01G11/78 , H01G11/84 , H01L21/50 , H01M2/02 , H01M6/12 , H01L21/52
CPC分类号： H01G9/155 , H01L21/50 , H01M2/0207 , H01M6/12 , Y02E60/13 , Y10T29/413 , Y10T29/417 , Y10T29/435
摘要： A method of fabricating a flat type electrochemical device, which is constructed by placing in a case comprising first and second case half bodies a separator and first and second functional substances for an electrochemical device so arranged as to interpose the separator. Peripheral portions of the first and second case half bodies are overlapped with each other, the peripheral portions are welded by a welding process during the application of pressure whereby the peripheral portions are joined with substantially no gaps. The portions welded by the welding process with pressure are then further welded using a laser beam welding.
摘要翻译：一种制造扁平型电化学装置的方法，其通过将包括第一和第二壳体半体的壳体设置为分隔件和用于电化学装置的第一和第二功能物质来构造，其布置成插入隔板。第一和第二壳半体的外围部分彼此重叠，在施加压力期间通过焊接工艺焊接周边部分，由此周边部分基本上没有间隙连接。然后通过焊接过程与压力焊接的部分然后使用激光束焊接进一步焊接。

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