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    • 14. 发明授权
    • Soft forming reversible resistivity-switching element for bipolar switching
    • 用于双极开关的软成型可逆电阻率开关元件
    • US08289749B2
    • 2012-10-16
    • US12642191
    • 2009-12-18
    • Xiying ChenAbhijit BandyopadhyayBrian LeRoy ScheuerleinLi Xiao
    • Xiying ChenAbhijit BandyopadhyayBrian LeRoy ScheuerleinLi Xiao
    • G11C11/00
    • G11C13/0007G11C13/0064G11C13/0069G11C2013/0073G11C2013/0083G11C2013/0092G11C2213/32G11C2213/34
    • A method and system for forming reversible resistivity-switching elements is described herein. Forming refers to reducing the resistance of the reversible resistivity-switching element, and is generally understood to refer to reducing the resistance for the first time. Prior to forming the reversible resistivity-switching element it may be in a high-resistance state. A first voltage is applied to “partially form” the reversible resistivity-switching element. The first voltage has a first polarity. Partially forming the reversible resistivity-switching element lowers the resistance of the reversible resistivity-switching element. A second voltage that has the opposite polarity as the first is then applied to the reversible resistivity-switching element. Application of the second voltage may further lower the resistance of the reversible resistivity-switching element. Therefore, the second voltage could be considered as completing the forming of the reversible resistivity-switching element.
    • 本文描述了用于形成可逆电阻率开关元件的方法和系统。 形成是指降低可逆电阻率开关元件的电阻,并且通常被理解为指第一次降低电阻。 在形成可逆电阻率开关元件之前,它可能处于高电阻状态。 施加第一电压以部分地形成可逆电阻率开关元件。 第一电压具有第一极性。 部分形成可逆电阻率开关元件降低可逆电阻率开关元件的电阻。 然后将具有与第一相反极性的第二电压施加到可逆电阻率开关元件。 第二电压的施加可以进一步降低可逆电阻率开关元件的电阻。 因此,可以将第二电压视为完成可逆电阻率开关元件的形成。
    • 15. 发明授权
    • Highly scalable thin film transistor
    • 高度可扩展的薄膜晶体管
    • US07888205B2
    • 2011-02-15
    • US12659480
    • 2010-03-10
    • S. Brad HernerAbhijit Bandyopadhyay
    • S. Brad HernerAbhijit Bandyopadhyay
    • H01L21/336
    • H01L27/11568H01L27/115H01L27/11578
    • Shrinking the dimensions of PMOS or NMOS thin film transistors is limited by dopant diffusion. In these devices an undoped or lightly doped channel region is interposed between heavily doped source and drain regions. When the device is built with very short gate length, source and drain dopants will diffuse into the channel, potentially shorting it and ruining the device. A suite of innovations is described which may be used in various combinations to minimize dopant diffusion during fabrication of a PMOS or NMOS polycrystalline thin film transistor, resulting in a highly scalable thin film transistor. This transistor is particularly suitable for use in a monolithic three dimensional array of stacked device levels.
    • PMOS或NMOS薄膜晶体管的尺寸缩小受掺杂剂扩散的限制。 在这些器件中,未掺杂或轻掺杂的沟道区被插入在重掺杂的源极和漏极区之间。 当器件以非常短的栅极长度构建时,源极和漏极掺杂物将扩散到沟道中,从而潜在地短路并破坏器件。 描述了一组创新,其可以以各种组合使用,以在制造PMOS或NMOS多晶薄膜晶体管期间最小化掺杂剂扩散,导致高度可缩放的薄膜晶体管。 该晶体管特别适用于堆叠器件级的单片三维阵列。
    • 16. 发明申请
    • TRANSISTOR LAYOUT CONFIGURATION FOR TIGHT-PITCHED MEMORY ARRAY LINES
    • 用于紧凑的内存阵列的晶体管布局配置
    • US20060221758A1
    • 2006-10-05
    • US11420787
    • 2006-05-29
    • Christopher PettiRoy ScheuerleinTanmay KumarAbhijit Bandyopadhyay
    • Christopher PettiRoy ScheuerleinTanmay KumarAbhijit Bandyopadhyay
    • G11C8/00
    • G11C8/14G11C5/02G11C5/063G11C8/08H01L27/0207H01L27/0688H01L27/10894H01L27/10897
    • A multi-headed word line driver circuit incorporates bent-gate transistors to reduce the pitch otherwise achievable for interfacing to tightly-pitched array lines. In certain exemplary embodiments, a three-dimensional memory array includes multiple memory blocks and array lines traversing horizontally across at least one memory block. Vertical active area stripes are disposed beneath a first memory block, and a respective plurality of bent-gate electrodes intersects each respective active area stripe to define individual source/drain regions. Every other source/drain region is coupled to a bias node for the active area stripe, and remaining source/drain regions are respectively coupled to a respective array line associated with the first memory block, thereby forming a respective first driver transistor for the respective array line. In certain embodiments, a respective plurality of complementary array line driver circuits is disposed on each side of a connection area between adjacent memory blocks, and each such driver circuit is responsive to a single driver input node.
    • 多头字线驱动电路包括弯栅晶体管,以减少为了与紧密排列的阵列线连接而实现的间距。 在某些示例性实施例中,三维存储器阵列包括穿过至少一个存储器块水平横越的多个存储器块和阵列线。 垂直有源区条纹设置在第一存储块下方,并且相应的多个弯曲栅电极与每个相应的有源区条纹相交以限定各个源/漏区。 每个其它源极/漏极区域耦合到用于有源区域条纹的偏置节点,并且剩余的源极/漏极区域分别耦合到与第一存储器模块相关联的相应阵列线,从而形成用于相应阵列的相应的第一驱动器晶体管 线。 在某些实施例中,相应的多个互补阵列线驱动器电路设置在相邻存储块之间的连接区域的每一侧上,并且每个这样的驱动器电路响应于单个驱动器输入节点。
    • 17. 发明授权
    • Carbon/tunneling-barrier/carbon diode
    • 碳/隧道势垒/碳二极管
    • US08624293B2
    • 2014-01-07
    • US12639840
    • 2009-12-16
    • Abhijit BandyopadhyayFranz KreuplAndrei MihneaLi Xiao
    • Abhijit BandyopadhyayFranz KreuplAndrei MihneaLi Xiao
    • H01L29/66
    • H01L45/00H01L27/2418H01L27/2463H01L29/16H01L29/88
    • A carbon/tunneling-barrier/carbon diode and method for forming the same are disclosed. The carbon/tunneling-barrier/carbon may be used as a steering element in a memory array. Each memory cell in the memory array may include a reversible resistivity-switching element and a carbon/tunneling-barrier/carbon diode as the steering element. The tunneling-barrier may include a semiconductor or an insulator. Thus, the diode may be a carbon/semiconductor/carbon diode. The semiconductor in the diode may be intrinsic or doped. The semiconductor may be depleted when the diode is under equilibrium conditions. For example, the semiconductor may be lightly doped such that the depletion region extends from one end of the semiconductor region to the other end. The diode may be a carbon/insulator/carbon diode.
    • 公开了一种碳/隧道势垒/碳二极管及其形成方法。 碳/隧道势垒/碳可以用作存储器阵列中的转向元件。 存储器阵列中的每个存储单元可以包括可逆电阻率开关元件和作为转向元件的碳/隧道势垒/碳二极管。 隧道势垒可以包括半导体或绝缘体。 因此,二极管可以是碳/半导体/碳二极管。 二极管中的半导体可以是固有的或掺杂的。 当二极管处于平衡条件下时,半导体可能耗尽。 例如,半导体可以被轻掺杂,使得耗尽区从半导体区的一端延伸到另一端。 二极管可以是碳/绝缘体/碳二极管。
    • 20. 发明授权
    • Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
    • 非易失性存储单元通过增加多晶半导体材料的顺序来操作
    • US08243509B2
    • 2012-08-14
    • US13074509
    • 2011-03-29
    • S. Brad HernerAbhijit Bandyopadhyay
    • S. Brad HernerAbhijit Bandyopadhyay
    • G11C11/36G11C11/34G11C11/00
    • G11C11/36G11C5/02G11C11/39G11C17/06G11C17/16H01L27/1021
    • A nonvolatile memory cell is described, the memory cell comprising a semiconductor diode. The semiconductor material making up the diode is formed with significant defect density, and allows very low current flow at a typical read voltage. Application of a programming voltage permanently changes the nature of the semiconductor material, resulting in an improved diode. The programmed diode allows much higher current flow, in some embodiments one, two or three orders of magnitude higher, at the same read voltage. The difference in current allows a programmed memory cell to be distinguished from an unprogrammed memory cell. Fabrication techniques to generate an advantageous unprogrammed defect density are described. The memory cell of the present invention can be formed in a monolithic three dimensional memory array, having multiple stacked memory levels formed above a single substrate.
    • 描述非易失性存储单元,存储单元包括半导体二极管。 构成二极管的半导体材料形成有明显的缺陷密度,并且在典型的读取电压下允许非常低的电流流动。 编程电压的应用永久地改变了半导体材料的性质,导致改进的二极管。 在相同的读取电压下,编程的二极管允许更高的电流流动,在一些实施例中高一个,两个或三个数量级。 电流差异允许将编程的存储器单元与未编程的存储器单元进行区分。 描述了产生有利的未编程缺陷密度的制造技术。 本发明的存储单元可以形成为在单个衬底上形成多个堆叠存储器级的单片三维存储器阵列。