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    • 12. 发明申请
    • ELECTRICAL INSULATION SYSTEM
    • 电绝缘系统
    • WO2011095208A1
    • 2011-08-11
    • PCT/EP2010/051298
    • 2010-02-03
    • ABB RESEARCH LTDKORNMANN, XavierSCHMIDT, Lars, E.KRIVDA, AndrejGREUTER, FelixCARLEN, Martin
    • KORNMANN, XavierSCHMIDT, Lars, E.KRIVDA, AndrejGREUTER, FelixCARLEN, Martin
    • H01B3/30H01B3/40C08K9/06
    • C08K3/22B82Y30/00C08K3/36H01B3/40Y10T428/2982
    • Electrical insulation system with improved electrical breakdown strength, said electrical insulation system comprising a hardened polymer component having incorporated therein a conventional filler material and a selected nano-scale sized filler material, wherein (a) said hardened polymer component is selected from epoxy resin compositions, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclopentadiene, and preferably is a hardened epoxy resin system; (b) said conventional filler material is a known filler material having an average grain size distribution within the range of 1 μm-500 μm, being present in a quantity within the range of 40%-65% by weight, calculated to the total weight of the insulator system; and (c) said selected nano-scale sized silica powder is a pretreated nano-scale sized filler material, having been produced by a sol- gel process; wherein said selected nano-scale sized silica powder is present within the electrical insulation system in an amount of about l%-20% by weight, calculated to the weight of the conventional filler material present in the electrical insulator system; method of preparing said insulations; and electrical insulation system containing the components (a) and (c) only.
    • 具有改善的电击穿强度的电绝缘系统,所述电绝缘系统包括硬化的聚合物组分,其中掺入了常规的填充材料和选定的纳米尺寸的填充材料,其中(a)所述硬化的聚合物组分选自环氧树脂组合物, 聚酯,聚酰胺,聚对苯二甲酸丁二醇酯,聚氨酯和聚二环戊二烯,优选为硬化环氧树脂体系; (b)所述常规填充材料是已知的平均粒度分布在1μm〜500μm范围内的填充材料,其以总重量计算在40重量%-65重量%的范围内 的绝缘子系统; 和(c)所选择的纳米尺寸二氧化硅粉末是经溶胶 - 凝胶法生产的经预处理的纳米级填料; 其中所述选定的纳米尺寸二氧化硅粉末以约1%-20%(重量)的量存在于电绝缘系统内,其量计算为存在于电绝缘体系统中的常规填料材料的重量; 制备所述绝缘体的方法; 和包含组分(a)和(c)的电绝缘体系。
    • 13. 发明申请
    • CURABLE EPOXY RESIN COMPOSITION
    • 可固化环氧树脂组合物
    • WO2011023227A1
    • 2011-03-03
    • PCT/EP2009/061038
    • 2009-08-27
    • ABB RESEARCH LTDSINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • SINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • C08G59/42C08G59/58
    • C08G59/4284C08G59/58C08L63/00H01B3/40
    • A curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, characterized in that: (a) said epoxy resin component is a conventional epoxy resin compound or a mixture of such compounds; (b) said hardener component comprises (b1) an aliphatic and cycloaliphatic or aromatic poly-carbonic acid anhydride, preferably a phthalic acid anhydride; and (b2) a polyether-amine of the general formula (I) : H 2 N-(C n H 2n -O) m -C n H 2n -NH 2 (I) wherein n is an integer from 2 to 8; and m is from about 3 to about 100; wherein (c) the polycarbonic acid anhydride, preferably the phthalic acid anhydride [component (b1) ] is present in the curable epoxy resin composition in a concentration of 0.60 MoI to 0.93 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and (d) the polyether-amine of the general formula (I) [component (b2) ] is present in the curable epoxy resin composition in a concentration of about 0.02 MoI to about 0.1 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and electrical articles comprising an insulation material made therefrom.
    • 一种可固化环氧树脂组合物,其至少包含环氧树脂组分和硬化剂组分,以及任选的其它添加剂,其特征在于:(a)所述环氧树脂组分是常规的环氧树脂化合物或这些化合物的混合物; (b)所述固化剂组分包含(b1)脂族和脂环族或芳族聚碳酸酐,优选邻苯二甲酸酐; 和(b2)通式(I)的聚醚 - 胺:H 2 N-(C n H 2n-O)m -C n H 2n-NH 2(I)其中n是2至8的整数; m为约3至约100; 其中(c)聚碳酸酐,优选邻苯二甲酸酐[组分(b1)]以0.60摩尔至0.93摩尔的浓度存在于可固化环氧树脂组合物中,每环氧树脂组合物中存在的环氧基重量当量计算 组分的组分; 和(d)通式(I)[组分(b2)]的聚醚胺存在于可固化环氧树脂组合物中,其浓度约为0.02MoI至约0.1MoI,按每个环氧基重量当量存在 组合物的环氧树脂组分; 以及包括由其制成的绝缘材料的电气制品。
    • 14. 发明申请
    • ELECTRICAL INSULATION SYSTEM WITH IMPROVED ELECTRICAL BREAKDOWN STRENGTH
    • 具有改进的电气断开强度的电气绝缘系统
    • WO2009043376A1
    • 2009-04-09
    • PCT/EP2007/060504
    • 2007-10-03
    • ABB Research LtdCARLEN, MartinKORNMANN, XavierKRIVDA, AndrejGREUTER, Felix
    • CARLEN, MartinKORNMANN, XavierKRIVDA, AndrejGREUTER, Felix
    • H01B3/40C08K3/34C08L63/00
    • H01B3/40H01B3/006H01B3/302H01B3/305H01B3/421H01B3/441
    • Electrical insulation system with improved electrical breakdown strength, said electrical insulation system comprising a hardened polymer component having incorporated therein a conventional filler material and a selected pretreated filler material, wherein (a) the hardened polymer component is selected from epoxy resin systems, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclopentadiene; (b) the conventional filler material is a known filler material having an average grain size distribution within the range of 1 µm- 500 µm, being present in a quantity within the range of 40 %- 65 % by weight, calculated to the total weight of the insulator system; and (c) the selected pretreated filler material is selected from silica, quartz, or a silicate, or is a mixture of these compounds, having an average grain size distribution within the range of 1 µm-500 µm, wherein said selected filler material has been pretreated with an intercalating compound and wherein said pretreated filler material is present in an amount of 1 %-30 % by weight, calculated to the weight of the conventional filler material present in the insulator system.
    • 所述电绝缘系统包括硬化聚合物组分,其中掺入了常规的填充材料和选择的预处理填料,其中(a)硬化的聚合物组分选自环氧树脂体系,聚酯,聚酰胺 ,聚对苯二甲酸丁二醇酯,聚氨酯和聚二环戊二烯; (b)常规的填充材料是平均粒度分布在1μm〜500μm的范围内的已知填料,按照总重量计算在40〜65重量%的范围内 的绝缘子系统; 和(c)选择的预处理填料材料选自二氧化硅,石英或硅酸盐,或者是这些化合物的混合物,其平均粒度分布在1μm〜500μm的范围内,其中所述选择的填充材料具有 用嵌入化合物进行预处理,其中所述预处理的填充材料以存在于绝缘体体系中的常规填充材料的重量计为1%-30%重量的量存在。
    • 15. 发明申请
    • VARISTOR-BASED FIELD CONTROL TAPE
    • 基于VARISTOR的现场控制带
    • WO2006136040A1
    • 2006-12-28
    • PCT/CH2006/000315
    • 2006-06-12
    • ABB RESEARCH LTDDONZEL, LiseKORNMANN, XavierGREUTER, Felix
    • DONZEL, LiseKORNMANN, XavierGREUTER, Felix
    • H01B3/00H01B17/42H01C7/112H02K3/40
    • H02K3/40H01C7/1006H01C7/112Y10T428/25Y10T428/28
    • The invention relates to a nonlinear field control tape containing ZnO microvaristor particles. The doped ZnO particles are produced by crushing a sintered ZnO block, by desagglomeration or crushing of calcinated granulated particles, or by crushing of a calcined or sintered tape (tape casting). Embodiments, among other things, relate to: hollow ZnO microvaristor particles produced by granulation technique, having reduced average density and having diameters in a range well below 90 µm; and compounding the ZnO filler in binders that are used to impregnate tapes. Compared to nonlinear field control tapes with conventional embedded nonlinear filler particles, a stronger and more reliable nonlinear resistivity is achieved and the ZnO filler is simpler to produce and to compound in the binder. The resulting tapes are flexible, preferably self-adhesive and have a strong nonlinear electrical resistivity. The tapes are useful to protect high field-stress regions in electrical components.
    • 本发明涉及含有ZnO微电阻颗粒的非线性场控制带。 掺杂的ZnO颗粒是通过粉碎烧结的ZnO块,通过烧结或粉碎煅烧的造粒颗粒,或通过粉碎煅烧或烧结带(带铸)来制备的。 实施例尤其涉及:通过造粒技术制备的中空ZnO微电阻颗粒,具有降低的平均密度并且具有在远低于90μm的范围内的直径; 并将ZnO填料与用于浸渍带的粘合剂混合。 与具有常规嵌入式非线性填料颗粒的非线性场控制带相比,实现了更强和更可靠的非线性电阻率,并且ZnO填料更容易在粘合剂中生产和复合。 所得到的带是柔性的,优选是自粘性的并且具有很强的非线性电阻率。 磁带可用于保护电气部件中的高场应力区域。
    • 20. 发明公开
    • CURABLE SOL-GEL COMPOSITION
    • 可固化溶胶 - 凝胶组合物
    • EP2427515A1
    • 2012-03-14
    • EP09779404.4
    • 2009-05-05
    • ABB Research Ltd.
    • TZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • C08K3/34H01B3/40
    • H01B3/40
    • Curable sol-gel composition useful for modifying the surface of a conventional electrical insulation system and providing said surface with an improved tracking and erosion resistance, characterized in that said sol-gel composition comprises: (a) cyclo-aliphatic epoxy resin compound containing at least two 1,2-epoxy groups per molecule [component (a) ]; (b) a glycidoxypropane-tri (Ci-4) alkoxysilane [component (b) ]; (c) a gamma-aminopropyl-tri (C1-4) alkoxysilane [component (c) ]; (d) a mineral filler material [component (d) ]; and (e) a hydrophobic compound [component (e) ] or a mixture of such hydrophobic compounds being selected from the group comprising fluorinated or chlorinated hydrocarbons or organopolysiloxanes; wherein the ratio of the epoxy equivalents of component (a) to the epoxy equivalents of component (b) is from 9:1 to 6:4; the molar ratio of component (c) to the epoxy equivalents of the sum of [component (a) ] and [component (b) ] is from about 0.9 to 1.1; the mineral filler material [component (d) ] is present in a quatity of about 55% by weight to about 85% by weight, calculated to the total weight of the cured composition; the hydrophobic compound [component (e) ] is present in a quantity of about 1.0% by weight to about 10% by weight, calculated to the total weight of the cured composition; whereby the curable sol-gel composition optionally contains further additives; electrical insulation system comprising said cured composition.