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    • 11. 发明公开
    • 질화물계 반도체 소자
    • 基于氮化物的半导体器件
    • KR1020140012584A
    • 2014-02-03
    • KR1020130049618
    • 2013-05-02
    • 삼성전자주식회사
    • 전우철박기열박영환신재광오재준
    • H01L29/778H01L21/335
    • Disclosed are a nitride based semiconductor diode and a nitride based semiconductor device including the same. The nitride based semiconductor device includes a substrate; a first semiconductor layer made of nitride based semiconductor and prepared on the substrate; a second semiconductor layer made of nitride based semiconductor prepared on the first semiconductor layer and having a first part of which thickness is thinner than that of a second part; an insulating layer prepared on the second semiconductor layer; a first electrode covering the first part of the second semiconductor layer and forming an ohmic contact with the first semiconductor layer; and a second electrode separated from the first electrode and forming an ohmic contact with the first semiconductor layer.
    • 公开了一种基于氮化物的半导体二极管和包括其的氮化物基半导体器件。 氮化物基半导体器件包括衬底; 由氮化物基半导体制成的第一半导体层,并在衬底上制备; 由氮化物基半导体制成的第二半导体层,其制备在第一半导体层上,其第一部分的厚度比第二部分的厚度薄; 在所述第二半导体层上制备的绝缘层; 覆盖第二半导体层的第一部分并与第一半导体层形成欧姆接触的第一电极; 以及与所述第一电极分离并与所述第一半导体层形成欧姆接触的第二电极。
    • 20. 发明公开
    • 전력 전자소자 및 그 제조방법
    • 电力电子设备及其制造方法
    • KR1020110032845A
    • 2011-03-30
    • KR1020090090561
    • 2009-09-24
    • 삼성전자주식회사
    • 김종섭홍기하오재준최혁순황인준신재광
    • H01L29/778
    • H01L29/207H01L29/2003H01L29/66462H01L29/7787
    • PURPOSE: A power electronic device and a method of manufacturing the same are provided to increase productivity by removing an additional material layer for making the certain area of 2DEG channel open and simplifying a process step. CONSTITUTION: In a power electronic device and a method of manufacturing the same, a lower semiconductor layer and upper semiconductor layer are successively laminated in a substrate(10). A gate(40), a source(50), and a drain(60) are separated on the semiconductor layer. A 2DEG channel is formed in the interface of the upper and lower semiconductor layers. The gate is located on the top side of the upper semiconductor layer. A buffer layer(15) is interposed between the substrate and the lower semiconductor layer.
    • 目的:提供一种电力电子设备及其制造方法,以通过去除用于使2DEG通道的特定区域打开并简化处理步骤的附加材料层来提高生产率。 构成:在功率电子器件及其制造方法中,下半导体层和上半导体层依次层叠在基板(10)中。 在半导体层上分离栅极(40),源极(50)和漏极(60)。 在上半导体层和下半导体层的界面中形成2DEG沟道。 栅极位于上半导体层的顶侧。 在衬底和下半导体层之间插入缓冲层(15)。