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11. 发明授权

US06989969B2 Integrated lead suspension and method of construction 失效
公开(公告)号：US06989969B2
公开(公告)日：2006-01-24
申请号：US10963704
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
IPC分类号： G11B21/22 , G11B5/54 , H05K1/11
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

12. 发明申请

US20050078415A1 Integrated lead suspension and method of construction 失效
公开(公告)号：US20050078415A1
公开(公告)日：2005-04-14
申请号：US10964224
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
IPC分类号： G11B5/60 , G11B5/48 , G11B21/21 , H05K1/18 , H05K3/34
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

13. 发明申请

US20050028353A1 Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly 失效
标题翻译：底盘结构，传送系统以及用于组装头万向架组件的方法和装置
公开(公告)号：US20050028353A1
公开(公告)日：2005-02-10
申请号：US10929322
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： G11B21/21 , G11B5/48 , G11B21/20 , G11B5/012 , G11B17/00
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.
摘要翻译：用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接其上的端子。当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。因此，需要其数量至少等于在各个组装过程中保留的未完成的HG组件的数量的组装。因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

14. 发明申请

US20110149440A1 HEAD GIMBAL ASSEMBLY AND DISK DRIVE WITH A PIEZOELECTRIC ELEMENT 有权
标题翻译： HEAD GIMBAL组装和磁盘驱动与压电元件
公开(公告)号：US20110149440A1
公开(公告)日：2011-06-23
申请号：US12973745
申请日：2010-12-20
申请人： Yoshio Uematsu , Tatsumi TSUCHIYA , Tadaaki TOMIYAMA
发明人： Yoshio Uematsu , Tatsumi TSUCHIYA , Tadaaki TOMIYAMA
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , G11B5/4873
摘要： A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.
摘要翻译：一种头部万向架组件，其具有固定到头部滑块的台架。一种压电元件，包括：上表面，第一侧表面，第二侧表面，下表面，第一电极，第二电极和下表面上的第一和第二电极之间的间隙，压电元件通过延伸或收缩移动台根据施加到第一和第二电极的电压。具有用于压电元件的连接焊盘的传输线路部分。用于物理上和电气上交叉连接第一电极和连接垫的交叉连接器。一种粘合剂固定部件，其由绝缘粘合剂形成并且将所述压电元件的下表面在所述间隙处的所述第二电极的端部与所述交叉连接器之间粘合地固定到所述传输线路部分。

15. 发明授权

US07859793B2 Magnetic head assembly that facilitates recovery of a magnetic head slider 有权
标题翻译：磁头组件有助于磁头滑块的恢复
公开(公告)号：US07859793B2
公开(公告)日：2010-12-28
申请号：US11804035
申请日：2007-05-15
申请人： Yoshio Uematsu , Kenjirou Watanabe , Tatsumi Tsuchiya , Yukihiro Nakamura
发明人： Yoshio Uematsu , Kenjirou Watanabe , Tatsumi Tsuchiya , Yukihiro Nakamura
IPC分类号： G11B5/60
CPC分类号： G11B5/4826 , G11B5/6011
摘要： A magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and a gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the spacer. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.
摘要翻译：一种磁头组件，其中滑块可以被抑制的悬架的变形移除，并且可以稳定地保持磁头的姿态角度以及安装有磁头组件的磁盘驱动器。根据实施例的头万向架组件（HGA）包括悬架，设置有磁头元件部分的磁头滑动器和保持滑块并连接到悬架的万向架。万向节包括在导电粘合剂施加区域周围形成的间隔物。在间隔物的外侧形成具有不大于导电性粘合剂涂布区域的平面尺寸的非导电性粘合剂涂敷区域。万向架和滑块通过施加到导电粘合剂施加区域上的导电粘合剂导通，并且用施加到非导电粘合剂施加区域的非导电粘合剂彼此粘合。

16. 发明申请

US20090213498A1 Disk drive device 有权
标题翻译：磁盘驱动器
公开(公告)号：US20090213498A1
公开(公告)日：2009-08-27
申请号：US12313641
申请日：2008-11-20
申请人： Hiroyuki Suzuki , Yoshio Uematsu
发明人： Hiroyuki Suzuki , Yoshio Uematsu
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , B23K1/0016 , B23K1/008 , B23K35/262 , B23K2101/36 , C22C13/00
摘要： Embodiments of the present invention provide a highly reliable hard disk drive (HDD). In an HDD according to an embodiment of the present invention, solder at a solder joint for joining a pad of a head slider and a pad of a transmission wiring comprises the main component of Sn and atomic percent to atomic percent of indium. The solder exhibits they phase within the range of −150° C. to 120° C. Accordingly, even if the HDD is left at a low temperature for a long time, the solder joint is not broken.
摘要翻译：本发明的实施例提供了一种高度可靠的硬盘驱动器（HDD）。在根据本发明的实施例的HDD中，用于连接磁头滑块的焊盘和传输线的焊盘的焊接点处的焊料包括Sn的主要成分和铟的原子百分比。焊料表现出相位在-150℃至120℃的范围内。因此，即使HDD长时间处于低温下，焊点也不会断裂。

17. 发明授权

US07550695B2 Method for manufacturing a magnetic disk device with improved head gimbal assembly 失效
标题翻译：具有改进的头万向节组件的磁盘装置的制造方法
公开(公告)号：US07550695B2
公开(公告)日：2009-06-23
申请号：US11228670
申请日：2005-09-15
申请人： Yohtaroh Ichimura , Kohichiroh Naka , Yoshio Uematsu , Tatsushi Yoshida
发明人： Yohtaroh Ichimura , Kohichiroh Naka , Yoshio Uematsu , Tatsushi Yoshida
IPC分类号： B23K26/00 , G11B5/48
CPC分类号： G11B5/4826 , G11B5/4833 , G11B5/6005 , Y10T29/49025 , Y10T29/49027 , Y10T29/49032
摘要： Embodiments of the invention correct the static attitude of a head gimbal assembly (HGA) with high accuracy. In one embodiment, a vector group that constitutes the shortest path from the initial attitude of the HGA to the final anticipatory attitude is formed. The vector group is formed of the plural displacement vectors that give a variety of variations in static attitude when unit shots of laser light are performed on the HGA. Displacement vectors are synthesized while the displacement vectors each giving the anticipatory attitude closest to a target attitude are being selected in order from the initial attitude, toward the target attitude. Unit shots equivalent to the number of displacement vectors are performed on irradiating positions related to the displacement vectors included in the vector group. The static attitude existing after the unit shots is measured, then the displacement vectors are corrected, and a vector group constituting the new shortest path is formed. Highly accurate attitude correction is thus realized.
摘要翻译：本发明的实施例以高精度校正头万向节组件（HGA）的静态姿态。在一个实施例中，形成从HGA的初始姿态到最终预期态度构成最短路径的矢量组。矢量组由多个位移矢量形成，当在HGA上执行激光单元拍摄时，能够给出静态姿态的各种变化。合成位移矢量，同时从初始姿态到目标姿态依次选择各自给出最接近目标姿态的预期姿态的位移矢量。对与矢量组中包含的位移矢量有关的照射位置进行与位移矢量数相当的单位拍摄。测量在单元拍摄之后存在的静态姿态，然后校正位移矢量，并且形成构成新的最短路径的矢量组。从而实现了高精度的姿态校正。

18. 发明申请

US20080092365A1 Method of manufacturing a head gimbal assembly 失效
标题翻译：头部万向节组件的制造方法
公开(公告)号：US20080092365A1
公开(公告)日：2008-04-24
申请号：US11823242
申请日：2007-06-26
申请人： Kenjirou Watanabe , Yoshio Uematsu , Yousuke Fukumoto , Yohtaroh Ichimura
发明人： Kenjirou Watanabe , Yoshio Uematsu , Yousuke Fukumoto , Yohtaroh Ichimura
IPC分类号： G11B5/127
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49053
摘要： Embodiments of the present invention provide a head gimbal assembly manufacturing method which can attach another magnetic head slider to a suspension to be reused without addition of solder. According to one embodiment of the present invention, a head gimbal assembly (HGA) is attached to a jig. Both sides of a portion close to the rear end of a magnetic head slider are gripped with hot tweezers heated at about 200° C. They are heated for about four seconds while applying force in a direction of peeling off the magnetic head slider from gimbals, thus removing the magnetic head slider from the gimbals. When another magnetic head slider is attached to the suspension, an adhesive adhered to the gimbals is removed and another adhesive is applied to the gimbals. The back of another magnetic head slider is pressed to the adhesive, whereby the magnetic head slider is fixed to the gimbals. Next, the solder fillet left on the gimbals is irradiated with laser beams to be melted and joined to an electric terminal.
摘要翻译：本发明的实施例提供一种头万向架组件制造方法，其可以将另一个磁头滑动器附接到待重新使用的悬架上，而不添加焊料。根据本发明的一个实施例，一种头部万向架组件（HGA）附接到夹具。靠近磁头滑块的后端的部分的两侧用加热到约200℃的热镊子夹紧。它们在沿着从磁头剥离磁头滑块的方向施加力时被加热大约四秒钟，从而将磁头滑块从万向节上移除。当另一个磁头滑块连接到悬架上时，去除粘附到万向架上的粘合剂，并将另一个粘合剂施加到万向架上。将另一个磁头滑块的背面按压到粘合剂上，由此磁头滑块固定在万向节上。接着，用激光束照射留在万向架上的焊锡圆片，使其熔融并接合到电气端子上。

19. 发明申请

US20060238921A1 Head gimbal assembly and magnetic disk drive with solder ball connection 失效
标题翻译：磁头万向节组件和磁盘驱动器与焊球连接
公开(公告)号：US20060238921A1
公开(公告)日：2006-10-26
申请号：US11112719
申请日：2005-04-21
申请人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
发明人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
IPC分类号： G11B5/60 , G11B17/32 , G11B15/64 , G11B21/20
CPC分类号： G11B5/4826 , H01L2224/742 , H01L2924/01322 , H05K3/3442 , H05K2201/0397 , H05K2201/10727 , H05K2203/041 , H05K2203/0465 , Y02P70/613
摘要： Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2≧4S.
摘要翻译：本发明的实施例提供一种能够使用低能量实现焊球连接的头万向架组件（HGA）。在一个实施例中，HGA包括头/滑块。在头/滑块中，通过在激光束的辐射下回流焊球，滑块和引线焊盘彼此连接。引线层连接到磁头，电极柱分别连接到引线层，并且还连接到滑块。焊球的直径R（m）和电极柱的截面积S（m 2）之间的关系为R 2 2 / S 2 = 4S。

20. 发明授权

US06985335B2 Integrated lead suspension and method of construction 失效
公开(公告)号：US06985335B2
公开(公告)日：2006-01-10
申请号：US10964188
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
IPC分类号： G11B21/22 , G11B5/54 , H05K1/11
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

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