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11. 发明申请

US20050148121A1 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device 有权
标题翻译：薄膜集成电路器件的制造方法和非接触式薄膜集成电路器件的制造方法
公开(公告)号：US20050148121A1
公开(公告)日：2005-07-07
申请号：US11007645
申请日：2004-12-09
申请人： Shunpei Yamazaki , Toru Takayama , Yohei Kanno
发明人： Shunpei Yamazaki , Toru Takayama , Yohei Kanno
IPC分类号： G06K19/07 , G06K19/077 , H01L21/00 , H01L21/68 , H01L21/82 , H01L23/02 , H01L23/498 , H01L27/00
CPC分类号： H01L21/6835 , G06K19/0704 , G06K19/0723 , G06K19/07703 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , G06K19/07758 , G06K19/07779 , G06K19/07781 , G06K19/07783 , H01L23/49855 , H01L2221/68318 , H01L2221/68359 , H01L2221/68368 , H01L2224/45147 , H01L2224/49171 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/12044 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/48 , H01L2924/00011
摘要： With non-contact and contact IC chips becoming common, it is necessary to mass-produce enormous amount of IC chips, which are utilizable for human beings, animals and plants, commercial products, banknotes, and the like, at low cost. For example, it is necessary to manufacture IC chips to be applied to commercial products, banknotes, and the like at a cost of 1 to several yen per IC chip, preferably, at a cost less than 1 yen, and it is desired to realize a structure of an IC chip that can be mass-produced at low cost and a manufacturing process of the IC chip. A method of-manufacturing a thin film integrated circuit device according to the present invention includes steps of forming a peel-off layer over a thermally oxidized silicon substrate, forming a plurality of thin film integrated circuit devices over the peel-off layer with a base film interposed therebetween, forming a groove between the plurality of thin film integrated circuit devices, and separating the plurality of thin film integrated circuit devices by introducing one of a gas and a liquid including halogen fluoride into the groove to remove the peel-off layer.
摘要翻译：随着非接触式和接触式IC芯片的普及，需要大量生产大量可用于人类，动植物，商业产品，纸币等的IC芯片，成本低廉。例如，以IC成本为1〜数日元的成本，优选以不到1日元的成本为代价，制造适用于商品，纸币等的IC芯片是有必要的。可以低成本大量生产的IC芯片的结构和IC芯片的制造工艺。根据本发明的制造薄膜集成电路器件的方法包括以下步骤：在热氧化硅衬底上形成剥离层，在剥离层上形成多个薄膜集成电路器件，基底在所述多个薄膜集成电路器件之间形成沟槽，并且通过将含有卤素氟化物的气体和液体中的一种引入到所述沟槽中以除去所述剥离层来分离所述多个薄膜集成电路器件。

12. 发明授权

US06568385B2 Cutting machine 有权
公开(公告)号：US06568385B2
公开(公告)日：2003-05-27
申请号：US09933945
申请日：2001-08-22
申请人： Kazuma Sekiya , Naoki Omiya , Yohei Kanno
发明人： Kazuma Sekiya , Naoki Omiya , Yohei Kanno
IPC分类号： B28D102
CPC分类号： B23Q11/0841 , B23Q11/0816 , B28D5/0076 , B28D5/024
摘要： A cutting machine of a type having bellows means disposed at least on one side of a chuck table to be reciprocated. A protective sheet covering the upper surface of the bellows means is disposed. One end of the protective sheet is reciprocated in accordance with the reciprocation of the chuck table, while the other end of the protective sheet is connected to winding means. When the chuck table is moved forward or backward, the protective sheet is gradually wound up by the winding means. When the chuck table is moved backward or forward, the protective sheet is gradually wound off from the winding means.

13. 发明授权

US08518728B2 Semiconductor element, method for manufacturing the same, liquid crystal display device, and method for manufacturing the same 有权
标题翻译：半导体元件及其制造方法，液晶显示装置及其制造方法
公开(公告)号：US08518728B2
公开(公告)日：2013-08-27
申请号：US12983336
申请日：2011-01-03
申请人： Yohei Kanno , Gen Fujii
发明人： Yohei Kanno , Gen Fujii
IPC分类号： H01L21/00 , H01L21/84 , H01L51/40
CPC分类号： H01L29/66765 , H01L27/12 , H01L27/1285 , H01L27/1292 , H01L29/42384 , H01L29/78603 , H01L29/78696
摘要： In case that a conventional TFT is formed to have an inversely staggered type, a resist mask is required to be formed by an exposing, developing, and droplet discharging in forming an island-like semiconductor region. It resulted in the increase in the number of processes and the number of materials. According to the present invention, a process can be simplified since after forming a source region and a drain region, a portion serving as a channel region is covered by an insulating film serving as a channel protecting film to form an island-like semiconductor film, and so a semiconductor element can be manufactured by using only metal mask without using a resist mask.
摘要翻译：在常规TFT形成为具有反交错型的情况下，需要通过在形成岛状半导体区域中的曝光，显影和液滴放电来形成抗蚀剂掩模。这导致过程数量和材料数量的增加。根据本发明，由于在形成源极区域和漏极区域之后，由于作为沟道区域的部分被用作沟道保护膜的绝缘膜覆盖以形成岛状半导体膜，因此可以简化工艺，因此可以仅使用金属掩模而不使用抗蚀剂掩模来制造半导体元件。

14. 发明申请

US20130009289A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130009289A1
公开(公告)日：2013-01-10
申请号：US13617483
申请日：2012-09-14
申请人： Yasuyuki ARAI , Yuko TACHIMURA , Yohei KANNO , Mai AKIBA
发明人： Yasuyuki ARAI , Yuko TACHIMURA , Yohei KANNO , Mai AKIBA
IPC分类号： H01L23/66
CPC分类号： H01L27/1266 , G06K19/025 , G06K19/07728 , G06K19/07749 , H01L27/1214 , H01L27/13 , H01L2221/6835 , H01L2224/73204
摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.
摘要翻译：本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。第一和第三绝缘膜是无机绝缘膜。

15. 发明授权

US07975926B2 Paper money, coin, valuable instrument, certificates, tag, label, card, packing containers, documents, respectively installed with integrated circuit 有权
标题翻译：纸币，硬币，贵重仪器，证书，标签，标签，卡片，包装容器，文件，分别装有集成电路
公开(公告)号：US07975926B2
公开(公告)日：2011-07-12
申请号：US11017791
申请日：2004-12-22
申请人： Shunpei Yamazaki , Yasuyuki Arai , Yohei Kanno
发明人： Shunpei Yamazaki , Yasuyuki Arai , Yohei Kanno
IPC分类号： G06K19/00
CPC分类号： G07F7/1008 , G06K19/07309 , G06K19/07749 , G06Q20/346
摘要： Although a product having such the IC chip has been diffused, information on the product may be capable of being perceived, abstracted, falsified, or the like by a third person with his external device during distribution of the product or after purchase of the product. Further, privacy may be seriously infringed. Paper money, various products, and the like are disclosed according to the present invention with an integrated circuit device having a switching memory for controlling reading and writing of information (lock/unlock of information) in order to protect the information recorded and stored in the integrated circuit such as an IC chip installed to the product or the like.
摘要翻译：虽然具有这样的IC芯片的产品已经被散布，但是在产品分发期间或购买产品之后，产品的信息可能被外部设备的第三人在被感知，抽象，伪造等方面被感知，抽象化，伪造等。此外，隐私可能会严重侵犯。根据本发明公开了纸币，各种产品等，其具有集成电路装置，具有用于控制信息的读取和写入（信息的锁定/解锁）的切换存储器，以便保护记录和存储在信息中的信息集成电路，例如安装在产品上的IC芯片等。

16. 发明授权

US07868957B2 Thin film transistor, display device and liquid crystal display device and method for manufacturing the same 有权
标题翻译：薄膜晶体管，显示装置和液晶显示装置及其制造方法
公开(公告)号：US07868957B2
公开(公告)日：2011-01-11
申请号：US10573775
申请日：2004-11-30
申请人： Shunpei Yamazaki , Shinji Maekawa , Yohei Kanno
发明人： Shunpei Yamazaki , Shinji Maekawa , Yohei Kanno
IPC分类号： G02F1/1368 , H01L21/336 , H01L21/288
CPC分类号： H01L21/288 , H01L21/28008 , H01L21/76838 , H01L27/1292 , H01L29/66765 , H01L29/78669 , H01L29/78678 , H01L2224/73265
摘要： As a wiring becomes thicker, discontinuity of an insulating film covering the wiring has become a problem. It is difficult to form a wiring with width thin enough for a thin film transistor used for a current high definition display device. As a wiring is made thinner, signal delay due to wiring resistance has become a problem. In view of the above problems, the invention provides a structure in which a conductive film is formed in a hole of an insulating film, and the surfaces of the conductive film and the insulating film are flat. As a result, discontinuity of thin films covering a conductive film and an insulating film can be prevented. A wiring can be made thinner by controlling the width of the hole. Further, a wiring can be made thicker by controlling the depth of the hole.
摘要翻译：随着布线变厚，覆盖布线的绝缘膜的不连续性成为问题。对于用于当前的高分辨率显示装置的薄膜晶体管，难以形成宽度足够薄的布线。由于布线变薄，由于布线电阻引起的信号延迟已经成为问题。鉴于上述问题，本发明提供一种在绝缘膜的孔中形成导电膜，并且导电膜和绝缘膜的表面平坦的结构。结果，可以防止覆盖导电膜和绝缘膜的薄膜的不连续性。通过控制孔的宽度可以使布线更薄。此外，通过控制孔的深度，可以使布线变厚。

17. 发明授权

US07633145B2 Semiconductor device with antenna and separating layer 有权
标题翻译：具有天线和分离层的半导体器件
公开(公告)号：US07633145B2
公开(公告)日：2009-12-15
申请号：US10586339
申请日：2005-01-11
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： H01L23/02
CPC分类号： H01L27/1266 , G06K19/073 , G06K19/07726 , G06K19/07749 , G06K19/0776 , G06K19/07798 , G06K2017/0064 , H01L23/49855 , H01L27/1214 , H01L27/13 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention provides a semiconductor device which can reliably restrict transmission/reception of signals or a power source voltage between a reader/writer when peeled off after stuck to an object. The semiconductor device of the invention includes an integrated circuit and an antenna formed on a support base. In the semiconductor device of the invention, a separating layer which is overlapped with the integrated circuit and the antenna sandwiching an insulating film is formed on the support base. A wiring for electrically connecting the integrated circuit and the antenna, a wiring for electrically connecting semiconductor elements in an integrated circuit, or a wiring which forms the antenna passes through the separating layer.
摘要翻译：本发明提供了一种半导体器件，其能够在卡住对象之后剥离时可靠地限制读取器/写入器之间的信号的发送/接收或电源电压。本发明的半导体器件包括形成在支撑基座上的集成电路和天线。在本发明的半导体器件中，在支撑基体上形成有与集成电路重叠的分离层和夹着绝缘膜的天线。用于电连接集成电路和天线的布线，用于电连接集成电路中的半导体元件的布线或形成天线的布线通过分离层。

18. 发明授权

US07598129B2 Light-emitting device and method for manufacturing the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US07598129B2
公开(公告)日：2009-10-06
申请号：US10576692
申请日：2004-11-05
申请人： Yohei Kanno , Gen Fujii
发明人： Yohei Kanno , Gen Fujii
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： H01L27/12 , H01L27/1285 , H01L27/1292 , H01L29/42384 , H01L29/66765 , H01L29/78696
摘要： Especially in case that a light-emitting element composed of layers containing organic compounds or inorganic compounds is driven by a thin film transistor (TFT), a structure having at least two transistors installed with a drive TFT is required to prevent irregularities of ON current of a switching TFT provided to a pixel region. Hence, the simplification of a semiconductor element structure and a process for manufacturing a semiconductor element becomes an urgent task as a large substrate is frequently used. According to the present invention, after that a source region and a drain region are formed, an insulating film serving as a channel protective film is formed to cover a portion for serving as a channel region, then, an island-like semiconductor film is formed. Accordingly, a semiconductor element can be manufactured by using only a metallic mask without forming a resist mask, and so the process can be simplified.
摘要翻译：特别是在由薄膜晶体管（TFT）驱动由含有有机化合物或无机化合物的层构成的发光元件的情况下，需要具有安装有驱动TFT的至少两个晶体管的结构来防止导通电流的不均匀性提供给像素区域的开关TFT。因此，通常使用大的基板，半导体元件结构的简化和半导体元件的制造工艺成为迫切的任务。根据本发明，在形成源极区域和漏极区域之后，形成作为沟道保护膜的绝缘膜覆盖用作沟道区域的部分，然后形成岛状半导体膜。因此，可以仅使用金属掩模而不形成抗蚀剂掩模来制造半导体元件，因此可以简化该工艺。

19. 发明申请

US20070164413A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070164413A1
公开(公告)日：2007-07-19
申请号：US10586339
申请日：2005-01-11
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： H01L23/02
CPC分类号： H01L27/1266 , G06K19/073 , G06K19/07726 , G06K19/07749 , G06K19/0776 , G06K19/07798 , G06K2017/0064 , H01L23/49855 , H01L27/1214 , H01L27/13 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention provides a semiconductor device which can reliably restrict transmission/reception of signals or a power source voltage between a reader/writer when peeled off after stuck to an object. The semiconductor device of the invention includes an integrated circuit and an antenna formed on a support base. In the semiconductor device of the invention, a separating layer which is overlapped with the integrated circuit and the antenna sandwiching an insulating film is formed on the support base. A wiring for electrically connecting the integrated circuit and the antenna, a wiring for electrically connecting semiconductor elements in an integrated circuit, or a wiring which forms the antenna passes through the separating layer.
摘要翻译：本发明提供了一种半导体器件，其能够在卡住对象之后剥离时可靠地限制读取器/写入器之间的信号的发送/接收或电源电压。本发明的半导体器件包括形成在支撑基座上的集成电路和天线。在本发明的半导体器件中，在支撑基体上形成有与集成电路重叠的分离层和夹着绝缘膜的天线。用于电连接集成电路和天线的布线，用于电连接集成电路中的半导体元件的布线或形成天线的布线通过分离层。

20. 发明申请

US20070159335A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070159335A1
公开(公告)日：2007-07-12
申请号：US10587237
申请日：2005-02-01
申请人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
发明人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
IPC分类号： G08B13/14 , H01L23/02
CPC分类号： H01L27/1266 , G06K19/025 , G06K19/07728 , G06K19/07749 , H01L27/1214 , H01L27/13 , H01L2221/6835 , H01L2224/73204
摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.
摘要翻译：本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。第一和第三绝缘膜是无机绝缘膜。

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