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11. 发明授权

US5565460A Therapeutic purine agents for parkinson's disease 失效
标题翻译：治疗帕金森病的嘌呤药物
公开(公告)号：US5565460A
公开(公告)日：1996-10-15
申请号：US367346
申请日：1995-03-03
申请人： Fumio Suzuki , Junichi Shimada , Nobuaki Koike , Shunji Ichikawa , Joji Nakamura , Tomoyuki Kanda , Shigeto Kitamura
发明人： Fumio Suzuki , Junichi Shimada , Nobuaki Koike , Shunji Ichikawa , Joji Nakamura , Tomoyuki Kanda , Shigeto Kitamura
IPC分类号： A61K31/505 , A61K31/53 , C07D487/04 , A61K31/535 , A61K31/54
CPC分类号： C07D487/04 , A61K31/505 , A61K31/53
摘要： The present invention relates to a therapeutic agent for Parkinson's disease containing as an active ingredient a polycyclic compound or a pharmaceutically acceptable salt thereof, the compound being represented by the following Formula (I): ##STR1## and A represents N or CR.sup.5 (in which R.sup.5 represents hydrogen, or substituted or unsubstituted lower alkyl), or represented by the following Formula (II): ##STR2## wherein Y, R.sup.6 and R.sup.8 are as defined herein and B and the adjacent two carbon atoms are combined to form a substituted or unsubstituted, partially saturated or unsaturated, monocyclic or bicyclic, carbocyclic or heterocyclic group.
摘要翻译： PCT No.PCT / JP94 / 01196 Sec。 371日期1995年3月3日 102（e）1995年3月3日PCT PCT 1994年7月20日PCT公布。公开号WO95 / 03806 日期：1995年2月9日本发明涉及含有作为活性成分的多环化合物或其药学上可接受的盐的帕金森病治疗剂，该化合物由下式（I）表示：＆lt; IMAGE＆gt;（I）和 A表示N或CR 5（其中R 5表示氢或取代或未取代的低级烷基），或由下式（II）表示：其中Y，R 6和R 8如本文所定义，B和相邻的两个碳原子结合形成取代或未取代的，部分饱和或不饱和的单环或双环，碳环或杂环基团。

12. 发明授权

US5319085A Quinoline derivative having serotonin-3 receptor antagonizing activity 失效
标题翻译：具有5-羟色胺-3受体拮抗活性的喹啉衍生物
公开(公告)号：US5319085A
公开(公告)日：1994-06-07
申请号：US039131
申请日：1993-04-16
申请人： Fumio Suzuki , Hiroaki Hayashi , Yoshikazu Miwa , Takeshi Kuroda , Akio Ishii , Shunji Ichikawa , Ichiro Miki , Katsuichi Shuto
发明人： Fumio Suzuki , Hiroaki Hayashi , Yoshikazu Miwa , Takeshi Kuroda , Akio Ishii , Shunji Ichikawa , Ichiro Miki , Katsuichi Shuto
IPC分类号： C07D451/04 , C07D451/12 , C07D451/14 , C07D403/12 , C07D401/12
CPC分类号： C07D451/14 , C07D451/04 , C07D451/12
摘要： Quinoline derivatives represented by formula (I): ##STR1## wherein A-B-D represents --C(COO--Y).dbd.CH--C(OR).dbd. (wherein Y represents 8-methyl-8-azabicyclo[3.2.1]oct-3-yl group and R represents alkyl) or --C(OH).dbd.C(COX--Y)--CH.dbd. (wherein X represents --O-- or --NH--; and Y has the same meaning as described above), or a pharmaceutically acceptable salt thereof, possess potent 5HT.sub.3 antagonizing activity and are useful as antiemetic agents.
摘要翻译： PCT No.PCT / JP91 / 01758 Sec。 371日期：1993年04月16日 102（e）日期1993年4月16日PCT 1991年12月25日PCT公布。出版物WO92 / 12150 PCT （I）表示的喹啉衍生物：其中ABD表示-C（COO-Y）= CH-C（OR）=（其中Y表示8-甲基-8- 氮杂双环[3.2.1]辛-3-基，R代表烷基）或-C（OH）= C（COX-Y）-CH =（其中X表示-O-或-NH-; Y具有相同意义如上所述）或其药学上可接受的盐具有有效的5HT3拮抗活性，并且可用作止吐剂。

13. 发明授权

US5155115A Thienopyridine derivatives 失效
标题翻译：噻吩衍生物
公开(公告)号：US5155115A
公开(公告)日：1992-10-13
申请号：US847670
申请日：1992-03-04
申请人： Fumio Suzuki , Yoshikazu Miwa , Hiroaki Hayashi , Akio Ishii , Shunji Ichikawa , Ichiro Miki
发明人： Fumio Suzuki , Yoshikazu Miwa , Hiroaki Hayashi , Akio Ishii , Shunji Ichikawa , Ichiro Miki
IPC分类号： A61K31/46 , A61K31/439 , A61P1/08 , A61P25/04 , A61P25/06 , A61P25/18 , A61P25/20 , A61P25/22 , A61P25/24 , A61P25/28 , A61P25/30 , A61P43/00 , C07D495/04 , C07D519/00
CPC分类号： C07D519/00
摘要： Disclosed is a thienopyridine derivative represented by formula (I): ##STR1## wherein one of A and B represents --S-- and the other represents --CH.dbd.; X represents --O-- or --NH--; R.sup.1 represents hydrogen or lower alkyl; R.sup.2 represents lower alkyl; and n represents 0 or 1; or a pharmaceutically acceptable salt thereof.The thienopyridine derivative is useful as anti-emetics and suppressant of migraine.

14. 发明申请

US20130127075A1 GAS-LIQUID CONTACTING PLATE, GAS-LIQUID CONTACTING LAMINATED BLOCK BODY, GAS-LIQUID CONTACTING LAMINATED STRUCTURE AND GAS PURIFICATION DEVICE 有权
标题翻译：气液接触板，气液接触层压体，气液接触层压结构和气体净化装置
公开(公告)号：US20130127075A1
公开(公告)日：2013-05-23
申请号：US13813359
申请日：2011-12-08
申请人： Tatsuya Tsujiuchi , Hiromitsu Nagayasu , Hiroshi Tanaka , Takuya Hirata , Keiji Fujikawa , Ryuji Yoshiyama , Yuichiro Sato , Toyoshi Nakagawa , Tsuyoshi Oishi , Motomichi Ochiai , Kei Shioya , Shunji Ichikawa , Akihiro Kojima
发明人： Tatsuya Tsujiuchi , Hiromitsu Nagayasu , Hiroshi Tanaka , Takuya Hirata , Keiji Fujikawa , Ryuji Yoshiyama , Yuichiro Sato , Toyoshi Nakagawa , Tsuyoshi Oishi , Motomichi Ochiai , Kei Shioya , Shunji Ichikawa , Akihiro Kojima
IPC分类号： B01D53/18
CPC分类号： B01D53/18 , B01D3/28 , B01D53/1406 , B01D53/185 , B01D2257/204 , B01D2257/406 , B01D2257/504 , B01F3/04078 , B01J19/32 , B01J2219/32206 , B01J2219/32227 , B01J2219/32241 , B01J2219/32244 , B01J2219/32251 , B01J2219/32258 , B01J2219/32262 , B01J2219/32272 , B01J2219/32483 , B01J2219/3325
摘要： A gas-liquid contacting plate of the present invention in which a treatment liquid flows from an upper side to a lower side direction of a substrate and a part of gas being in contact with the treatment liquid is absorbed into the treatment liquid, includes a downward protruding saw teeth-shaped portion in which a lower end side of the substrate has pitches at predetermined gaps. Further, a pore group for liquid dispersion having a predetermined gap is provided in a plurality of lines, in the substrate. An arrangement thereof is a zigzag arrangement.
摘要翻译：本发明的气液接触板，其中处理液体从基板的上侧向下侧流动，并且与处理液接触的一部分气体被吸收到处理液中，包括向下突出的锯齿形部分，其中衬底的下端侧具有预定间隙的间距。此外，在基板中以多条线设置具有预定间隙的分散液孔组。其布置是锯齿形布置。

15. 发明授权

US07629193B2 Method of producing acceleration sensor chip package 失效
标题翻译：生产加速度传感器芯片封装的方法
公开(公告)号：US07629193B2
公开(公告)日：2009-12-08
申请号：US12005370
申请日：2007-12-27
申请人： Shunji Ichikawa
发明人： Shunji Ichikawa
IPC分类号： H01L21/00
CPC分类号： G01P1/023 , G01P15/123 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
摘要翻译：加速度传感器芯片封装包括加速度传感器芯片; 传感器控制芯片; 重新布线层; 外部终端; 密封部分; 和基底。加速度传感器芯片包括框架部分; 可移动结构; 检测元件; 和电极垫。再布线层具有连接到电极焊盘的布线部分。电极焊盘电连接到导电凸块。传感器控制芯片具有电连接到导电凸块的传感器控制电极焊盘。外部端子连接到布线部分并且设置在外部区域中。密封部密封传感器控制芯片，电极焊盘和再布线层，使得可移动结构是可移动的。衬底附接到加速度传感器芯片以密封开口部分。

16. 发明申请

US20080131989A1 Method of producing acceleration sensor chip package 失效
标题翻译：生产加速度传感器芯片封装的方法
公开(公告)号：US20080131989A1
公开(公告)日：2008-06-05
申请号：US12005370
申请日：2007-12-27
申请人： Shunji Ichikawa
发明人： Shunji Ichikawa
IPC分类号： H01L21/50
CPC分类号： G01P1/023 , G01P15/123 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
摘要翻译：加速度传感器芯片封装包括加速度传感器芯片; 传感器控制芯片; 重新布线层; 外部终端; 密封部分; 和基材。加速度传感器芯片包括框架部分; 可移动结构; 检测元件; 和电极垫。再布线层具有连接到电极焊盘的布线部分。电极焊盘电连接到导电凸块。传感器控制芯片具有电连接到导电凸块的传感器控制电极焊盘。外部端子连接到布线部分并且设置在外部区域中。密封部密封传感器控制芯片，电极焊盘和再布线层，使得可移动结构是可移动的。衬底附接到加速度传感器芯片以密封开口部分。

17. 发明授权

US07334476B2 Acceleration sensor chip package 有权
标题翻译：加速度传感器芯片封装
公开(公告)号：US07334476B2
公开(公告)日：2008-02-26
申请号：US11253543
申请日：2005-10-20
申请人： Shunji Ichikawa
发明人： Shunji Ichikawa
IPC分类号： G01P15/08
CPC分类号： G01P1/023 , G01P15/123 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
摘要翻译：加速度传感器芯片封装包括加速度传感器芯片; 传感器控制芯片; 重新布线层; 外部终端; 密封部分; 和基材。加速度传感器芯片包括框架部分; 可移动结构; 检测元件; 和电极垫。再布线层具有连接到电极焊盘的布线部分。电极焊盘电连接到导电凸块。传感器控制芯片具有电连接到导电凸块的传感器控制电极焊盘。外部端子连接到布线部分并且设置在外部区域中。密封部密封传感器控制芯片，电极焊盘和再布线层，使得可移动结构是可移动的。衬底附接到加速度传感器芯片以密封开口部分。

18. 发明申请

US20060252679A1 Preventive and/or trerapeutic drgs for itch 审中-公开
标题翻译：预防和/或治疗性瘙痒
公开(公告)号：US20060252679A1
公开(公告)日：2006-11-09
申请号：US10525324
申请日：2003-08-22
申请人： Mayumi Saki , Hiromi Nonaka , Hiromasa Miyaji , Shunji Ichikawa , Chiemi Takashima , Tsutomu Matsumura , Hitoshi Arai , Katsutoshi Sasaki , Choei Kobatake , Yukihito Tsukumo , Kyoichiro Iida , Takeshi Kuboyama , Haruhiko Manabe
发明人： Mayumi Saki , Hiromi Nonaka , Hiromasa Miyaji , Shunji Ichikawa , Chiemi Takashima , Tsutomu Matsumura , Hitoshi Arai , Katsutoshi Sasaki , Choei Kobatake , Yukihito Tsukumo , Kyoichiro Iida , Takeshi Kuboyama , Haruhiko Manabe
IPC分类号： A61K38/17 , A61K48/00
CPC分类号： C07D401/14 , A61K31/519 , A61K31/55 , A61K31/7088 , A61K48/00 , C07D403/06 , C07D417/14 , C07D471/04 , G01N33/5088
摘要： The present invention provides an agent for prevention and/or treatment of itching comprising a substance capable of suppressing the function involved in signal transduction of GPR4 as an active ingredient. It also provides a nitrogen-containing tricyclic compound represented by the formula (I) or a quaternary ammonium salt thereof, or a pharmaceutically acceptable salt thereof; [wherein R1 represents substituted or unsubstituted lower alkyl, etc.; R2 represents hydrogen, substituted or unsubstituted lower alkyl, etc.; R3 and R4 are the same or different and each represents hydrogen, lower alkyl, etc.; n represents 0 or 1; X represents —(CH2)2—, etc.; and Y represents the formula (II); (wherein W represents CH or a nitrogen atom; Z1 and Z2 are the same or different and each represents hydrogen, substituted or unsubstituted lower alkyl, etc.; and Z3 represents hydrogen, substituted or unsubstituted lower alkyl, etc.)]
摘要翻译：本发明提供了用于预防和/或治疗瘙痒的药剂，其包含能够抑制作为活性成分的GPR4的信号转导所涉及的功能的物质。它还提供由式（I）表示的含氮三环化合物或其季铵盐或其药学上可接受的盐; [其中R 1表示取代或未取代的低级烷基等; R 2表示氢，取代或未取代的低级烷基等; R 3和R 4相同或不同，各自表示氢，低级烷基等; n表示0或1; X表示 - （CH 2 2）2 - 等; Y表示式（II）; （其中W表示CH或氮原子; Z 1和Z 2相同或不同，各自表示氢，取代或未取代的低级烷基等; Z 代表氢，取代或未取代的低级烷基等）]

19. 发明申请

US20060122198A1 Antiepileptic agent 审中-公开
标题翻译：抗癫痫剂
公开(公告)号：US20060122198A1
公开(公告)日：2006-06-08
申请号：US10560598
申请日：2004-06-25
申请人： Shunji Ichikawa , Chiemi Takashima , Hironori Imma , Junichi Shimada
发明人： Shunji Ichikawa , Chiemi Takashima , Hironori Imma , Junichi Shimada
IPC分类号： A61K31/522
CPC分类号： A61K31/522 , C07D473/12
摘要： An antiepileptic agent which contains either a xanthine derivative represented by the formula (I): (I) (wherein R1, R2, and R3 are the same or different and each represents hydrogen, lower alkyl, lower alkenyl, or lower alkynyl; R4 represents cycloalkyl, —(CH2)n.R5, or the formula (II); (II) and X1 and X2 are the same or different and each represents oxygen or sulfur) or a pharmacologically acceptable salt thereof as an active ingredient.
摘要翻译：含有由式（I）表示的黄嘌呤衍生物：（I）（其中R 1，R 2，R 2和R 3）的抗癫痫剂， SUP>相同或不同，各自表示氢，低级烷基，低级烯基或低级炔基; R 4表示环烷基， - （CH 2）n 或者式（II）;（II）和X 1和X 2相同或不同并且各自表示氧或硫）或其药理学上可接受的盐作为活性成分。

20. 发明申请

US20060086186A1 Acceleration sensor chip package and method of producing the same 有权
标题翻译：加速度传感器芯片封装及其制造方法
公开(公告)号：US20060086186A1
公开(公告)日：2006-04-27
申请号：US11253543
申请日：2005-10-20
申请人： Shunji Ichikawa
发明人： Shunji Ichikawa
IPC分类号： G01P15/08 , H01L21/28 , H01L21/301
CPC分类号： G01P1/023 , G01P15/123 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
摘要翻译：加速度传感器芯片封装包括加速度传感器芯片; 传感器控制芯片; 重新布线层; 外部终端; 密封部分; 和基材。加速度传感器芯片包括框架部分; 可移动结构; 检测元件; 和电极垫。再缠绕层具有连接到电极焊盘的布线部分。电极焊盘电连接到导电凸块。传感器控制芯片具有电连接到导电凸块的传感器控制电极焊盘。外部端子连接到布线部分并且设置在外部区域中。密封部密封传感器控制芯片，电极焊盘和再布线层，使得可移动结构是可移动的。衬底附接到加速度传感器芯片以密封开口部分。

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