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11. 发明申请

US20110304248A1 ELECTRIC CONTROL DEVICE 有权
标题翻译：电控装置
公开(公告)号：US20110304248A1
公开(公告)日：2011-12-15
申请号：US13202848
申请日：2010-09-27
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K5/03 , H05K5/02
CPC分类号： H05K5/0056 , B62D5/0406 , H05K5/0052 , H05K5/0213
摘要： An electronic control device includes: an accommodation element; a cover element; a connection element for fixing the cover element to the accommodation element; an extending protrusion extending and protruding to an outside from a contact portion between the cover element and the accommodation element; and a control element formed in the accommodation space. The extending protrusion includes a protrusion portion, which protrudes toward a bottom side or a cover element side and is formed to cover the contact portion. A clearance having predetermined dimensions is formed between the protrusion portion and one of an outer wall of the cover element and an outer wall of the accommodation element, which is near the contact portion.
摘要翻译：电子控制装置包括：容纳元件; 盖元件用于将盖元件固定到容纳元件的连接元件; 从所述盖元件和所述容纳元件之间的接触部分延伸并突出到外部的延伸突起; 以及形成在容纳空间中的控制元件。延伸突起包括突出部分，突出部分朝向底侧或覆盖元件侧突出并且形成为覆盖接触部分。具有预定尺寸的间隙形成在突出部分与覆盖元件的外壁中的一个和接触部分附近的容纳元件的外壁之间。

12. 发明授权

US09320178B2 Electronic control unit and method of manufacturing the same 有权
标题翻译：电子控制单元及其制造方法
公开(公告)号：US09320178B2
公开(公告)日：2016-04-19
申请号：US13611203
申请日：2012-09-12
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20 , B60R16/023 , H01L23/36 , H01L23/367 , H01L23/40 , H01L23/42 , H01L25/16 , H05K1/02 , H01L23/34 , H05K5/00 , H05K3/00 , H05K3/42
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，第一散热装置设置在树脂板与动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

13. 发明申请

US20120326295A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：US20120326295A1
公开(公告)日：2012-12-27
申请号：US13607872
申请日：2012-09-10
申请人： Shinsuke OOTA
发明人： Shinsuke OOTA
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L23/047 , H01L23/4334 , H01L23/49562 , H01L25/115 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module includes a semiconductor chip having a switching function, a resin portion that covers the chip, terminals, and a heat dissipation portion. The resin portion includes first and second surfaces, which are opposed to each other and expand generally parallel to an imaginary plane; and a substrate is located on a first surface-side of the resin portion. The terminals project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate. The heat dissipation portion is disposed on a second surface-side of the resin portion to release heat generated in the chip. One of the terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the terminals to the heat dissipation portion.
摘要翻译：半导体模块包括具有开关功能的半导体芯片，覆盖芯片的树脂部分，端子和散热部分。树脂部分包括第一和第二表面，它们彼此相对并且大致平行于假想平面膨胀; 并且衬底位于树脂部分的第一表面侧上。端子从假想平面的方向从树脂部分突出并焊接到基板上。散热部设置在树脂部的第二表面侧，以释放在芯片中产生的热量。其中一个端子连接到散热部分，使得热量从一个端子传递到散热部分。

14. 发明申请

US20110013365A1 ELECTRONIC CONTROL UNIT 有权
标题翻译：电子控制单元
公开(公告)号：US20110013365A1
公开(公告)日：2011-01-20
申请号：US12834950
申请日：2010-07-13
申请人： Shinsuke OOTA
发明人： Shinsuke OOTA
IPC分类号： H05K7/20
CPC分类号： B62D5/0406 , H01L25/115 , H01L25/16 , H01L2924/0002 , H02K11/33 , H05K7/20463 , H05K7/20854 , H01L2924/00
摘要： An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns.
摘要翻译：电子控制单元包括电路板，多个电路图案，多个半导体器件，多个引线和至少一个导热限制部分。每个半导体器件安装到形成在电路板上的对应电路图案。每个引线电和机械地将每个半导体器件连接到相应的电路图案。可以限制从半导体器件产生的热的传导的热传导限制部分被放置在相应的两个电路图案之间。

15. 发明申请

US20100254093A1 ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子控制单元及其制造方法
公开(公告)号：US20100254093A1
公开(公告)日：2010-10-07
申请号：US12752534
申请日：2010-04-01
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20 , H01R43/00
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，所述第一散热装置设置在所述树脂板与所述动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

16. 发明授权

US08420966B2 Electronic control apparatus 有权
标题翻译：电子控制装置
公开(公告)号：US08420966B2
公开(公告)日：2013-04-16
申请号：US12905305
申请日：2010-10-15
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K7/20
CPC分类号： H05K5/0047 , B62D5/04 , B62D5/0406 , H05K5/069
摘要： An electronic control apparatus includes a housing, a lid, a fastener, and a controller. The lid covers the opening of the housing to form a closed space defined by the lid and the housing. The fastener fixes the lid to the housing. The controller is located in the space. An isolation member is provided with an outer surface of one of the lid and the bottom of the housing. The outer surface has a liquid drip area where liquid is expected to drip. The isolation member causes the liquid dripped on the liquid drip area to flow down the outer surface in such a manner that the liquid avoids the fastener.
摘要翻译：电子控制装置包括壳体，盖子，紧固件和控制器。盖子覆盖壳体的开口以形成由盖子和壳体限定的封闭空间。紧固件将盖子固定到壳体上。控制器位于空间中。隔离构件设置有盖的一个的外表面和壳体的底部。外表面具有液体滴注区域，液体预期会滴落。隔离构件使得滴落在液滴区域上的液体以使得液体避免紧固件的方式沿着外表面流下。

17. 发明授权

US08243454B2 Electronic control unit 有权
标题翻译：电子控制单元
公开(公告)号：US08243454B2
公开(公告)日：2012-08-14
申请号：US12834944
申请日：2010-07-13
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K7/20
CPC分类号： H05K7/20454 , H01L23/42 , H01L23/4334 , H01L25/072 , H01L25/16 , H01L2224/06181 , H01L2224/32245 , H01L2924/13091 , H01L2924/00
摘要： In an electronic control unit, a semiconductor device that is installed to a circuit board includes a semiconductor chip, multiple leads and a resin body. The semiconductor chip is electrically connected to the circuit board through the leads and is molded in the resin body. A case receives the semiconductor device. A heat releasing gel contacts the semiconductor device, and conducts heat generated from the semiconductor device to a first cover of the case located on one side of the semiconductor device, which is opposite from the circuit board. A groove portion as a movement limiting means is placed at a location between the circuit board and the first cover. Therefore, movement of the heat releasing gel is limited, and heat can be released to a side of the case through the heat releasing gel with high efficiency.
摘要翻译：在电子控制单元中，安装到电路板的半导体器件包括半导体芯片，多个引线和树脂体。半导体芯片通过引线电连接到电路板，并且被模制在树脂体中。壳体接收半导体器件。散热凝胶与半导体器件接触，并且将从半导体器件产生的热传导到位于半导体器件的与电路板相对的一侧上的壳体的第一盖。作为移动限制装置的槽部被放置在电路板和第一盖之间的位置处。因此，释热凝胶的移动受到限制，并且可以通过高效率的散热凝胶将热量释放到壳体的一侧。

18. 发明申请

US20110221432A1 SENSOR UNIT AND MAGNETIC FLUX CONCENTRATING MODULE 有权
标题翻译：传感器单元和磁通量集中模块
公开(公告)号：US20110221432A1
公开(公告)日：2011-09-15
申请号：US13042665
申请日：2011-03-08
申请人： Shinsuke OOTA
发明人： Shinsuke OOTA
IPC分类号： G01R33/06
CPC分类号： G01L3/104 , G01R33/0011 , G01R33/072
摘要： A sensor unit includes a printed circuit board, a Hall IC, a terminal member, and a capacitor. The printed circuit board has a conductive pattern. The Hall IC is disposed on the printed circuit board. The Hall IC includes an element part that detects magnetic flux. The element part is arranged in parallel with the printed circuit board and is away from the conductive pattern. The terminal member is disposed on an end portion of the printed circuit board and is configured to be electrically coupled with an external device. The capacitor is disposed on the printed circuit board.
摘要翻译：传感器单元包括印刷电路板，霍尔IC，端子构件和电容器。印刷电路板具有导电图案。霍尔IC布置在印刷电路板上。霍尔IC包括检测磁通量的元件部分。元件部分与印刷电路板平行布置并远离导电图案。端子构件设置在印刷电路板的端部上并且被配置为与外部设备电耦合。电容器设置在印刷电路板上。

19. 发明申请

US20110013370A1 ELECTRONIC CONTROL UNIT 有权
标题翻译：电子控制单元
公开(公告)号：US20110013370A1
公开(公告)日：2011-01-20
申请号：US12834944
申请日：2010-07-13
申请人： Shinsuke OOTA
发明人： Shinsuke OOTA
IPC分类号： H05K5/02
CPC分类号： H05K7/20454 , H01L23/42 , H01L23/4334 , H01L25/072 , H01L25/16 , H01L2224/06181 , H01L2224/32245 , H01L2924/13091 , H01L2924/00
摘要： In an electronic control unit, a semiconductor device that is installed to a circuit board includes a semiconductor chip, multiple leads and a resin body. The semiconductor chip is electrically connected to the circuit board through the leads and is molded in the resin body. A case receives the semiconductor device. A heat releasing gel contacts the semiconductor device, and conducts heat generated from the semiconductor device to a first cover of the case located on one side of the semiconductor device, which is opposite from the circuit board. A groove portion as a movement limiting means is placed at a location between the circuit board and the first cover. Therefore, movement of the heat releasing gel is limited, and heat can be released to a side of the case through the heat releasing gel with high efficiency.
摘要翻译：在电子控制单元中，安装到电路板的半导体器件包括半导体芯片，多个引线和树脂体。半导体芯片通过引线电连接到电路板，并且被模制在树脂体中。壳体接收半导体器件。散热凝胶与半导体器件接触，并且将从半导体器件产生的热传导到位于半导体器件的与电路板相对的一侧上的壳体的第一盖。作为移动限制装置的槽部被放置在电路板和第一盖之间的位置处。因此，释热凝胶的移动受到限制，并且可以通过高效率的散热凝胶将热量释放到壳体的一侧。

20. 发明申请

US20110012256A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：US20110012256A1
公开(公告)日：2011-01-20
申请号：US12834941
申请日：2010-07-13
申请人： Shinsuke OOTA
发明人： Shinsuke OOTA
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L23/047 , H01L23/4334 , H01L23/49562 , H01L25/115 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module includes a semiconductor chip having a switching function, a resin portion that covers the chip, terminals, and a heat dissipation portion. The resin portion includes first and second surfaces, which are opposed to each other and expand generally parallel to an imaginary plane; and a substrate is located on a first surface-side of the resin portion. The terminals project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate. The heat dissipation portion is disposed on a second surface-side of the resin portion to release heat generated in the chip. One of the terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the terminals to the heat dissipation portion.
摘要翻译：半导体模块包括具有开关功能的半导体芯片，覆盖芯片的树脂部分，端子和散热部分。树脂部分包括第一和第二表面，它们彼此相对并且大致平行于假想平面膨胀; 并且衬底位于树脂部分的第一表面侧上。端子从假想平面的方向从树脂部分突出并焊接到基板上。散热部设置在树脂部的第二表面侧，以释放在芯片中产生的热。其中一个端子连接到散热部分，使得热量从一个端子传递到散热部分。

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