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11. 发明专利

DE102012105955A1 Lampenhalter für Lampenröhre 未知
公开(公告)号：DE102012105955A1
公开(公告)日：2013-02-07
申请号：DE102012105955
申请日：2012-07-04
申请人： SUN MING-HAI
发明人： SUN MING-HAI
IPC分类号： F21V19/04
摘要： Die Erfindung betrifft einen Lampenhalter für eine Lampenröhre, der einen Grundkörper (1), ein Federelement (2), ein Druckelement (3), einen Deckel (4) und eine Metallklammer (6) umfasst, wobei der Grundkörper einen Oberteil (11) aufweist, in dem eine querverlaufende hohle Stütze (12) vorgesehen ist, die durch zwei gegenüberliegende Seitenwände (120) gebildet ist, wobei das Federelement in der Stütze angeordnet ist, wobei die Seitenwände der Stütze durch das Druckelement geführt sind, das von dem Federelement gedrückt wird, wobei der Deckel einen Deckteil (41) aufweist, der eine Öffnung (410) besitzt, wobei der Deckel mit dem Grundkörper verbunden ist, wodurch der Deckteil und der Oberteil die Aufnahme (5) bilden, in der die Metallklammer angeordnet ist.

12. 发明专利

SG11201602768PA PRESSURE SWING ADSORPTION APPARATUS 未知
公开(公告)号：SG11201602768PA
公开(公告)日：2016-05-30
申请号：SG11201602768P
申请日：2013-11-06
申请人： ZHOU XIAOSHAN , SUN MING , LEI JI
发明人： ZHOU XIAOSHAN , SUN MING , LEI JI
IPC分类号： B01D53/047

13. 发明公开

EP3069783A1 MEMBRANE SEPARATION APPARATUS 有权
标题翻译： MEMBRANABSCHEIDER
公开(公告)号：EP3069783A1
公开(公告)日：2016-09-21
申请号：EP13897278.1
申请日：2013-11-19
申请人： Zhou, Xiaoshan , Sun, Ming , Lei, Ji
发明人： Zhou, Xiaoshan , Sun, Ming , Lei, Ji
IPC分类号： B01D63/08 , B01D63/02
CPC分类号： B01D63/16 , B01D53/22 , B01D63/02 , B01D63/08 , B01D63/087 , B01D2313/20 , B01D2313/24 , B01D2313/243 , B01D2315/02
摘要： A membrane separation apparatus comprises: a shell (1), wherein an inner surface (11) of the shell is an arc surface, and at least one medium inlet and at least one medium outlet used for discharging a medium that is separated are arranged on the shell (1); a rotor (2) arranged inside the shell (1), wherein at least two contact ends (24, 26) that are always in slidably contact with the inner surface (11) of the shell are arranged on an outer surface of the rotor (2), the outer surface of the rotor (2) and the inner surface (11) of the shell form sealed separate cavities between the adjacent contact ends (24, 26), and an empty part inside the rotor (2) is used as a medium storage chamber; and separation chambers (32, 34, 36) arranged inside the rotor (2), wherein insides of the separation chambers (32, 34, 36) are filled with a membrane (6), one-way valves corresponding to the separate cavities are arranged on outer walls of the separation chambers (32, 34, 36) for communicating with the separate cavities, medium outlets corresponding to the medium storage chamber are arranged on inner walls of the separation chambers (32, 34, 36), and the medium storage chamber is communicated with the medium outlet of the shell (1).
摘要翻译：一种膜分离装置，包括：壳体（1），其中壳体的内表面（11）是弧形表面，并且至少一个用于排出分离介质的介质入口和至少一个介质出口布置在壳（1）; 布置在所述壳体（1）内的转子（2），其中总是与所述壳体的内表面（11）滑动接触的至少两个接触端部（24,26）设置在所述转子的外表面如图2所示，转子（2）的外表面和壳体的内表面（11）在相邻的接触端（24,26）之间形成密封的分开的空腔，转子（2）内部的空的部分用作介质储存室; 和分离室（32,34,36），其设置在转子（2）内部，其中分离室（32,34,36）的内部填充有膜（6），与分开的空腔对应的单向阀设置在分离室（32,34,36）的外壁上，用于与分离的空腔连通，对应于介质储存室的介质出口被布置在分离室（32,34,36）的内壁上，介质储存室与壳体（1）的介质出口连通。

14. 发明专利

NZ720020A Membrane separation apparatus 未知
公开(公告)号：NZ720020A
公开(公告)日：2016-11-25
申请号：NZ72002013
申请日：2013-11-19
申请人： ZHOU XIAOSHAN , SUN MING , LEI JI
发明人： ZHOU XIAOSHAN , SUN MING , LEI JI
IPC分类号： B01D63/08 , B01D33/35 , B01D33/37 , B01D35/26 , B01D35/30 , B01D61/00 , B01D63/02
摘要： The invention relates to a membrane separation device that may be applied to separation process for gas or liquid mediums. The invention provides a membrane separation device having simple and compact structure in which gas compression or liquid pumping is integrated with separation chambers of the device without the need for a complex gas or liquid pipeline. The device is characterized by high integration, high permeability per unit volume, and low cost. The membrane separation device comprises: a housing having an arc-shaped inner surface, the housing being provided with at least one medium inlet and at least one medium outlet used for discharging a separated medium; a rotor provided in the housing, the rotor being provided with at least two contact ends on an outer surface thereof, the at least two contact ends being constantly in sliding contact with the inner surface of the housing, the outer surface of the rotor and the inner surface of the housing forming sealed separate cavities between the adjacent contact ends, the separate cavities being separated by the contact ends, the inside of the rotor being hollow, and a hollow part inside the rotor being used as a medium storage chamber; separation chambers, provided inside the rotor as a part of the rotor, one separation chamber being defined between the adjacent contact ends, each of the separation chambers being filled with a membrane therein for dividing the separation chamber into two parts, one inner part and one outer part, one-way valves corresponding to the separate cavities being provided on outer walls of the separation chambers for communicating with the separate cavities, medium outlets corresponding to the medium storage chamber being provided on inner walls of the separation chambers, the medium storage chamber being in communication with the medium outlets on the housing; wherein during the rotation of the rotor, a medium entering the separate cavities through the medium inlets on the housing enters the separation chambers through the one-way valves under pressure, and the separated medium passes through the membranes and enters the medium storage chamber from the medium outlets on the inner walls of the separation chambers, and then exits through the medium outlets on the housing.

15. 发明专利

DE20009731U1 未知
公开(公告)号：DE20009731U1
公开(公告)日：2000-08-03
申请号：DE20009731
申请日：2000-05-27
申请人： SUN MING HAN
IPC分类号： H04R1/10 , H04R1/02

16. 发明申请

WO2008137001A3 SEMICONDUCTOR PACKAGE HAVING DIMPLED PLATE INTERCONNECTIONS 审中-公开
标题翻译：具有切割板互连的半导体封装
公开(公告)号：WO2008137001A3
公开(公告)日：2010-03-11
申请号：PCT/US2008005563
申请日：2008-04-30
申请人： ALPHA & OMEGA SEMICONDUCTOR , SUN MING , SHI LEI , LIU KAI
发明人： SUN MING , SHI LEI , LIU KAI
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译：公开了半导体封装。封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接，源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂的半导体管芯和漏极，源极和栅极引线。

17. 发明申请

WO2009099834A2 WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE 审中-公开
标题翻译：晶片级芯片级封装和制造工艺
公开(公告)号：WO2009099834A2
公开(公告)日：2009-08-13
申请号：PCT/US2009/032242
申请日：2009-01-28
申请人： ALPHA & OMEGA SEMICONDUCTOR, LTD. , FENG, Tao , HEBERT, Francois , SUN, Ming , HO, Yueh-Se
发明人： FENG, Tao , HEBERT, Francois , SUN, Ming , HO, Yueh-Se
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L29/7827 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/81 , H01L29/0657 , H01L29/41741 , H01L29/4175 , H01L29/45 , H01L29/49 , H01L29/7802 , H01L2224/02371 , H01L2224/03464 , H01L2224/0347 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/06183 , H01L2224/16225 , H01L2224/16227 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/30105 , H01L2924/30107 , H01L2924/00
摘要： Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of the device, which is convenient for mounting to a printed circuit board (PCB) with solder paste.
摘要翻译：封装了功率晶圆级芯片尺寸封装（CSP）和制造工艺。功率晶圆级芯片尺寸封装包括位于器件一侧的所有源极，栅极和漏极电极，便于用锡膏安装到印刷电路板（PCB）上。

18. 发明申请

WO2006135874A3 DFN SEMICONDUCTOR PACKAGE HAVING REDUCED ELECTRICAL RESISTANCE 审中-公开
标题翻译： DFN半导体封装具有降低的电阻
公开(公告)号：WO2006135874A3
公开(公告)日：2009-04-16
申请号：PCT/US2006022909
申请日：2006-06-12
申请人： ALPHA & OMEGA SEMICONDUCTOR , SUN MING , ZHANG XIAOTIAN , LIU KAI
发明人： SUN MING , ZHANG XIAOTIAN , LIU KAI
IPC分类号： H01L23/34
CPC分类号： H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/0603 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A DFN semiconductor package is disclosed, the package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.
摘要翻译：公开了一种DFN半导体封装，封装包括具有与漏极引线，源极引线接合区域和栅极引线接合区域一体形成的管芯接合焊盘的引线框架，源极引线接合区域和栅极引线接合区域增加区域，耦合到管芯接合焊盘的管芯，耦合到源极引线接合区域的管芯源极接合区域和耦合到栅极引线接合区域的管芯栅极结合区域，以及至少部分地覆盖管芯，漏极引线，栅极引线接合面积和源极引线接合面积。

19. 发明申请

WO2007033243A3 SEMICONDUCTOR PACKAGE HAVING PLATE INTERCONNECTIONS 审中-公开
标题翻译：具有板互连的半导体封装
公开(公告)号：WO2007033243A3
公开(公告)日：2007-12-06
申请号：PCT/US2006035641
申请日：2006-09-12
申请人： ALPHA & OMEGA SEMICONDUCTOR , SUN MING , SHI LEI , HO YUEH-SE , LIU KAI , ZHANG XIAOTIAN
发明人： SUN MING , SHI LEI , HO YUEH-SE , LIU KAI , ZHANG XIAOTIAN
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having metalized source and gate areas separated by a passivation area, a patterned source connection coupling the source lead to the semiconductor die metalized source area, a patterned gate connection coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译：公开了半导体封装。该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有金属化源的半导体管芯和由钝化区域分开的栅极区域，将源极引线耦合到半导体管芯金属化源将栅极引线耦合到半导体管芯金属化栅极区域的图案化栅极连接，耦合到漏极引线的半导体管芯漏极区域以及覆盖半导体管芯和漏极，源极和栅极引线的至少一部分的密封剂。

20. 发明申请

WO2007108908A2 RFID TAG DATA RETENTION VERIFICATION AND REFRESH 审中-公开
标题翻译： RFID标签数据保留验证和刷新
公开(公告)号：WO2007108908A2
公开(公告)日：2007-09-27
申请号：PCT/US2007/005196
申请日：2007-03-01
申请人： SYMBOL TECHNOLOGIES, INC. , DRAGO, Randall, Allen , SUN, Ming-Hao , BAIR, Chun-Huei , POWELL, Kevin, J. , ROSHAN-AFSHAR, Omid , HOCKEY, Theodore , PFEIFER, Jonathan
发明人： DRAGO, Randall, Allen , SUN, Ming-Hao , BAIR, Chun-Huei , POWELL, Kevin, J. , ROSHAN-AFSHAR, Omid , HOCKEY, Theodore , PFEIFER, Jonathan
IPC分类号： H04Q5/22 , G08B13/14
CPC分类号： G06K19/0723 , G06K5/00
摘要： Methods, systems, and apparatuses for monitoring and refreshing data stored in radio frequency identification (RFID) tags are described. A voltage margin for data stored in memory of a tag is checked. If the voltage margin has decreased to an undesirable level, the data stored in the tag is refreshed.
摘要翻译：描述了用于监视和刷新存储在射频识别（RFID）标签中的数据的方法，系统和装置。检查存储在标签存储器中的数据的电压余量。如果电压余量降低到不合需要的水平，则刷新存储在标签中的数据。

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