会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 18. 发明授权
    • Deposited semiconductor structure to minimize n-type dopant diffusion and method of making
    • 沉积半导体结构以使n型掺杂剂扩散最小化和制备方法
    • US07648896B2
    • 2010-01-19
    • US12181317
    • 2008-07-28
    • S. Brad Herner
    • S. Brad Herner
    • H01L21/04
    • H01L45/08H01L27/1021H01L27/2409H01L27/2463H01L29/161H01L29/165H01L45/04H01L45/1233H01L45/145H01L45/146
    • In deposited silicon, n-type dopants such as phosphorus and arsenic tend to seek the surface of the silicon, rising as the layer is deposited. When a second undoped or p-doped silicon layer is deposited on n-doped silicon with no n-type dopant provided, a first thickness of this second silicon layer nonetheless tends to include unwanted n-type dopant which has diffused up from lower levels. This surface-seeking behavior diminishes when germanium is alloyed with the silicon. In some devices, it may not be advantageous for the second layer to have significant germanium content. In the present invention, a first heavily n-doped semiconductor layer (preferably at least 10 at % germanium) is deposited, followed by a silicon-germanium capping layer with little or no n-type dopant, followed by a layer with little or no n-type dopant and less than 10 at % germanium. The germanium in the first layer and the capping layer minimizes diffusion of n-type dopant into the germanium-poor layer above.
    • 在沉积的硅中,诸如磷和砷的n型掺杂剂倾向于寻求硅的表面,随着层的沉积而上升。 当在没有提供n型掺杂剂的n掺杂硅上沉积第二未掺杂或p掺杂的硅层时,该第二硅层的第一厚度倾向于包括从较低水平扩散的不期望的n型掺杂剂。 当锗与硅合金化时,这种表面寻找行为减弱。 在一些设备中,对于第二层可能不是有利的具有显着的锗含量。 在本发明中,沉积第一重n掺杂的半导体层(优选至少10原子%的锗),随后是几乎没有或没有n型掺杂剂的硅 - 锗覆盖层,之后是几乎没有或没有 n型掺杂剂和少于10at%的锗。 第一层和覆盖层中的锗使n型掺杂剂的扩散最小化到上述的锗贫层中。