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    • 12. 发明授权
    • Method of forming CMOS device with improved lightly doped drain structure
    • 用改进的轻掺杂漏极结构形成CMOS器件的方法
    • US06175136B1
    • 2001-01-16
    • US09039487
    • 1998-03-16
    • Ryuichi Okamura
    • Ryuichi Okamura
    • H01L218238
    • H01L21/823814H01L21/823864
    • A semiconductor device has at least a p-channel MOS field effect transistor and at least an n-channel MOS field effect transistor, both of which are integrated on a single semiconductor substrate. The p-channel MOS field effect transistor has at least a first p-type lightly doped diffusion region adjacent to a p-type drain diffusion region. The n-channel MOS field effect transistor has at least a first n-type lightly doped diffusion region adjacent to an n-type drain diffusion region. The first p-type lightly doped diffusion region of the p-channel MOS field effect transistor is shorter in a direction parallel to a channel length direction than a first n-type lightly doped diffusion region of the n-channel MOS field effect transistor.
    • 半导体器件至少具有p沟道MOS场效应晶体管和至少n沟道MOS场效应晶体管,它们都集成在单个半导体衬底上。 p沟道MOS场效应晶体管具有与p型漏极扩散区域相邻的至少第一p型轻掺杂扩散区域。 n沟道MOS场效应晶体管具有与n型漏极扩散区域相邻的至少第一n型轻掺杂扩散区域。 p沟道MOS场效应晶体管的第一p型轻掺杂扩散区域在平行于沟道长度方向的方向上比n沟道MOS场效应晶体管的第一n型轻掺杂扩散区域短。
    • 18. 发明授权
    • Semiconductor device having a barrier film formed to prevent the entry
of moisture and method of manufacturing the same
    • 具有形成为防止湿气进入的阻挡膜的半导体装置及其制造方法
    • US6011308A
    • 2000-01-04
    • US874359
    • 1997-06-13
    • Ryuichi Okamura
    • Ryuichi Okamura
    • H01L23/522H01L21/28H01L21/768H01L23/00H01L23/29H01L23/532
    • H01L21/76802H01L21/76831H01L23/291H01L23/564H01L2924/0002
    • A semiconductor device includes a silicon substrate, a first insulating film, a barrier film, a contact hole, a protective film, a barrier metal, and an interconnection metal. A semiconductor element is formed on the silicon substrate. The first insulating film is formed on the silicon substrate. The barrier film is formed on the first insulating film to prevent moisture from externally entering. The contact hole is formed through the barrier film and the insulating film to a depth at which the silicon substrate is exposed. The protective film is formed on the side surface of the contact hole to protect the first insulating film against etching which is performed to remove a spontaneous oxide film formed on a surface of the silicon substrate which is exposed on a bottom surface of the contact hole. The barrier metal is continuously formed on at least the side and bottom surfaces of the contact hole and serves as a buffer conductor. The interconnection metal is buried in the contact hole on which the barrier metal is formed. A semiconductor device manufacturing method is also disclosed.
    • 半导体器件包括硅衬底,第一绝缘膜,阻挡膜,接触孔,保护膜,阻挡金属和互连金属。 在硅衬底上形成半导体元件。 第一绝缘膜形成在硅衬底上。 阻挡膜形成在第一绝缘膜上,以防止水分从外部进入。 接触孔通过阻挡膜和绝缘膜形成到硅衬底暴露的深度。 保护膜形成在接触孔的侧表面上,以保护第一绝缘膜不被蚀刻,以除去形成在暴露于接触孔底面的硅衬底表面上的自发氧化膜。 阻挡金属连续地形成在接触孔的至少侧面和底面上并用作缓冲导体。 互连金属被埋在形成阻挡金属的接触孔中。 还公开了半导体器件制造方法。