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    • 13. 发明授权
    • Method of attaching a semiconductor microchip to a circuit board
    • 将半导体微芯片连接到电路板的方法
    • US5745985A
    • 1998-05-05
    • US546054
    • 1995-10-20
    • Prosenjit GhoshSunil Thomas
    • Prosenjit GhoshSunil Thomas
    • H01L21/60H05K13/04H05K3/32
    • H01L24/29H01L24/31H01L24/83H05K13/0469H01L2224/81801H01L2224/83101H01L2224/83951H01L2924/01006H01L2924/01033H01L2924/01082H01L2924/14Y10T29/49133Y10T29/49144Y10T29/49146
    • A method of attaching a microchip onto a circuit board is described. The method may include: forming a core portion of thermally conductive and electrically conductive material 50; forming a perimeter portion of thermally conductive and electrically nonconductive material 54; placing the core portion of thermally conductive and electrically conductive material 50 at a site on a circuit board 58 where the microchip 56 will be bonded; placing the perimeter portion of thermally conductive and electrically non-conductive material 54 around the core portion 50 on the circuit board; and attaching microchip component 56 to the core portion 50 and the perimeter portion 54. The method may also include applying a catalyst on the circuit board before attaching the core and perimeter portions. The method may also include curing the core portion and the perimeter portion at 90 degrees C. for 10 minutes and then applying a catalyst on the core portion and the perimeter portion. The materials may once again be cured at 90 degrees C. for 10 minutes. Other devices, systems and methods are also disclosed.
    • 描述了将微芯片附接到电路板上的方法。 该方法可以包括:形成导热和导电材料的芯部分50; 形成导热和非导电材料54的周边部分; 将导热导电材料50的核心部分放置在电路板58上,微芯片56将被接合的位置处; 将导热和非导电材料54的周边部分围绕电路板上的芯部分50放置; 并将微芯片组件56连接到芯部分50和周边部分54.该方法还可以包括在安装芯部和周边部分之前在电路板上施加催化剂。 该方法还可以包括在90℃固化芯部分和周边部分10分钟,然后在芯部分和周边部分上施加催化剂。 材料可再次在90℃下固化10分钟。 还公开了其他装置,系统和方法。