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    • 12. 发明申请
    • ELECTRONIC DEVICE INCLUDING AN ORGANIC DEVICE LAYER
    • 包括有机器件层的电子器件
    • WO2008082642A2
    • 2008-07-10
    • PCT/US2007/026467
    • 2007-12-28
    • E. I. DU PONT DE NEMOURS AND COMPANYPRAKASH, ShivaTRUONG, Nugent
    • PRAKASH, ShivaTRUONG, Nugent
    • H01L51/52
    • H01L51/0015H01L27/3295H01L51/5096Y10T428/24942
    • An electronic device can include an organic device layer having a first and a second portion. In one embodiment, the first portion can have a higher resistivity than the second portion and lie between a first and a second electrode and include not more than 15 mole percent basic material. In a particular embodiment, the first and the second electrode can be an anode and cathode of a pixel. In another particular embodiment, the first and the second electrode can be either both anodes or both cathodes of different pixels. In another embodiment, the organic device layer can include a large molecule material. In still another embodiment, a process of forming the electronic device can include selectively modifying the first portion of the organic device layer.
    • 电子设备可以包括具有第一和第二部分的有机器件层。 在一个实施例中,第一部分可以具有比第二部分更高的电阻率,并且位于第一和第二电极之间,并且包括不超过15摩尔%的基本材料。 在特定实施例中,第一和第二电极可以是像素的阳极和阴极。 在另一特定实施例中,第一和第二电极既可以是阳极,也可以是两个不同像素的阴极。 在另一个实施方案中,有机器件层可以包括大分子材料。 在另一个实施例中,形成电子设备的过程可以包括选择性地修改有机器件层的第一部分。
    • 14. 发明申请
    • ELECTRONIC DEVICES COMPRISING CONDUCTIVE MEMBERS THAT CONNECT ELECTRODES TO OTHER CONDUCTIVE MEMBERS WITHIN A SUBSTRATE AND PROCESSES FOR FORMING THE ELECTRONIC DEVICES
    • 包含将电极连接到基板中的其他导电构件的导电构件的电子装置和用于形成电子装置的工艺
    • WO2006072024A3
    • 2007-05-18
    • PCT/US2005047519
    • 2005-12-29
    • DU PONTYU GANGPRAKASH SHIVA
    • YU GANGPRAKASH SHIVA
    • H01L27/15H01L51/40
    • H01L27/3276H01L2227/323
    • An electronic device includes a substrate including a pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart, the first conductive member is connected to the pixel driving circuit, and the second conductive member can be part of a power transmission line. The electronic device also includes an electronic component that includes a first electrode that contacts the first conductive member, a second electrode that is connected to but does not contact the second conductive member, and an organic layer lying between the first and second electrodes. The electronic device also includes a third conductive member that is connected to the second electrode and the second conductive member, and contacts the second conductive member. In one embodiment, a process for forming the electronic device uses the second electrode as a hardmask when removing portions of the first organic layer.
    • 电子装置包括:基板,包括像素驱动电路,第一导电部件和第二导电部件。 第一和第二导电构件间隔开,第一导电构件连接到像素驱动电路,并且第二导电构件可以是电力传输线的一部分。 电子设备还包括电子部件,其包括接触第一导电部件的第一电极,与第二导电部件连接但不与第二导电部件接触的第二电极以及位于第一和第二电极之间的有机层。 电子设备还包括连接到第二电极和第二导电构件并与第二导电构件接触的第三导电构件。 在一个实施例中,当去除第一有机层的部分时,用于形成电子器件的工艺使用第二电极作为硬掩模。