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11. 发明申请

US20070171515A1 Electroabsorption duplexer 有权
标题翻译：电吸收双工器
公开(公告)号：US20070171515A1
公开(公告)日：2007-07-26
申请号：US11451743
申请日：2006-06-13
申请人： Young Shik Kang , Je Ha Kim , Sung Bock Kim , Yong Duck Chung , Kwang Seong Choi
发明人： Young Shik Kang , Je Ha Kim , Sung Bock Kim , Yong Duck Chung , Kwang Seong Choi
IPC分类号： H01S3/00 , G02B6/10
CPC分类号： H01S5/026 , H01S5/0262 , H01S5/0265 , H01S5/1014 , H01S5/22 , H01S5/50
摘要： An electroabsorption (EA) duplexer in which an optical amplifier, a photodetector, and an optical modulator are monolithically integrated to obtain a high radio frequency (RF) gain in radio-over fiber (RoF) link optical transmission technology is provided. The EA duplexer includes a substrate, a separation area, an optical detection/modulation unit, and an optical amplification unit. The separation area includes a first epitaxial layer formed of at least one material layer on the substrate. The first epitaxial layer functions as a first optical waveguide. The optical detection/modulation unit includes a second epitaxial layer formed of at least one material layer on the first epitaxial layer to detect and modulate an optical signal. The second epitaxial layer functions as a second optical waveguide. The optical amplification unit includes the second optical waveguide and a third epitaxial layer formed of at least one material layer on the second epitaxial layer to amplify an optical signal. The third epitaxial layer functions as a third optical waveguide. The optical amplification unit is electrically separated from the optical detection/modulation unit by the separation area and is disposed on at least one side of the optical detection/modulation unit.
摘要翻译：提供了其中光放大器，光电检测器和光调制器被单片集成以获得无线电光纤（RoF）链路光传输技术中的高射频（RF）增益的电吸收（EA）双工器。 EA双工器包括基板，分离区，光检测/调制单元和光放大单元。分离区域包括由衬底上的至少一个材料层形成的第一外延层。第一外延层用作第一光波导。光检测/调制单元包括由第一外延层上的至少一个材料层形成的第二外延层，以检测和调制光信号。第二外延层用作第二光波导。光放大单元包括第二光波导和由第二外延层上的至少一个材料层形成的第三外延层，以放大光信号。第三外延层用作第三光波导。光放大单元通过分离区域与光检测/调制单元电分离，并设置在光检测/调制单元的至少一侧。

12. 发明授权

US07012939B2 Wavelength stabilization module having light-receiving element array and method of manufacturing the same 失效
标题翻译：具有光接收元件阵列的波长稳定模块及其制造方法
公开(公告)号：US07012939B2
公开(公告)日：2006-03-14
申请号：US10648238
申请日：2003-08-27
申请人： Kwang Seong Choi , Heung Woo Park , Ho Gyeong Yun , Byung Seok Choi , Yong Sung Eom , Jong Hyun Lee , Jong Tae Moon
发明人： Kwang Seong Choi , Heung Woo Park , Ho Gyeong Yun , Byung Seok Choi , Yong Sung Eom , Jong Hyun Lee , Jong Tae Moon
IPC分类号： H01S3/13 , G01B9/02
CPC分类号： H04B10/572
摘要： A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed. The wavelength stabilization module having a laser diode which irradiates a laser beam at the front side and the rear side thereof comprises a collimator for paralleling the laser beam irradiated at the rear side; a beam splitter for splitting the laser beam passed through the collimator into the two directional laser beams; a light-receiving element for receiving one of the split laser beams; a filter for transmitting a specific wavelength of the other of the split laser beams; a light-receiving element array for receiving the laser beam passed through the filter; and a controller for controlling the output wavelength of the laser diode by using the signals output from the light-receiving element and the light-receiving element array, and the filter and the light-receiving element array are tilted at a predetermined angle with respect to the laser beam and lock the wavelength by using an incident angle dependency of the laser beam passed through the filter.
摘要翻译：公开了具有光接收元件阵列的波长稳定模块及其制造方法。具有在其前侧和后侧照射激光束的激光二极管的波长稳定模块包括用于与在后侧照射的激光束并联的准直器; 用于将穿过准直器的激光束分成两个定向激光束的分束器; 用于接收所述分离激光束中的一个的光接收元件; 用于传输另一个分离激光束的特定波长的滤波器; 用于接收通过过滤器的激光束的光接收元件阵列; 以及控制器，用于通过使用从光接收元件和光接收元件阵列输出的信号来控制激光二极管的输出波长，并且滤光器和光接收元件阵列相对于激光束并通过使用通过过滤器的激光束的入射角依赖性来锁定波长。

13. 发明授权

US07009716B2 System for monitoring optical output/wavelength 失效
标题翻译：监控光输出/波长的系统
公开(公告)号：US07009716B2
公开(公告)日：2006-03-07
申请号：US10802095
申请日：2004-03-15
申请人： Jong-Deog Kim , Byung-Seok Choi , Jong-Hyun Lee , Hogyeong Yun , Kwang-Seong Choi , Jong-Tae Moon
发明人： Jong-Deog Kim , Byung-Seok Choi , Jong-Hyun Lee , Hogyeong Yun , Kwang-Seong Choi , Jong-Tae Moon
IPC分类号： G01B9/02 , H01S3/04
CPC分类号： H01S5/0612 , H01S5/0683 , H01S5/0687
摘要： A system for monitoring an optical output/wavelength is employed to be used for a WDM system having a narrow channel space by structuring an etalon and photodiode as an integrated structure. The system includes: a laser source control unit for controlling the laser source; an optical/wavelength monitoring unit for monitoring an optical output/wavelength of the controlled laser source; a TEC control unit for controlling a TEC in order to constantly maintain the laser source of the optical output/wavelength monitoring unit to have a predetermined temperature; a temperature control unit for controlling a heater and a thermistor to set an etalon to a predetermined temperature, wherein the heater is attached on the optical output/wavelength monitoring unit and the thermistor is attached on the heater; a comparison unit for comparing the optical output signal and the wavelength signal, each of which is monitored by the optical output/wavelength monitoring unit; and a processing unit for comparing values of the compared signals with a preset value to control an input current or a temperature of the laser source.
摘要翻译：用于监测光输出/波长的系统被用于通过构造标准具和光电二极管作为一体结构而具有窄通道空间的WDM系统。该系统包括：用于控制激光源的激光源控制单元; 用于监测受控激光源的光输出/波长的光/波长监测单元; 用于控制TEC的TEC控制单元，以便将光输出/波长监视单元的激光源恒定地保持为预定温度; 温度控制单元，用于控制加热器和热敏电阻以将标准具设定到预定温度，其中加热器安装在光输出/波长监测单元上，热敏电阻附着在加热器上; 比较单元，用于比较光输出信号和波长信号，每个波长信号由光输出/波长监测单元监视; 以及处理单元，用于将比较的信号的值与预设值进行比较，以控制激光源的输入电流或温度。

14. 发明授权

US06580162B2 Ball grid array (BGA) semiconductor package improving solder joint reliability 有权
标题翻译：球栅阵列（BGA）半导体封装提高了焊点的可靠性
公开(公告)号：US06580162B2
公开(公告)日：2003-06-17
申请号：US10097350
申请日：2002-03-15
申请人： Kwang-Seong Choi
发明人： Kwang-Seong Choi
IPC分类号： H01L2302
CPC分类号： H01L24/85 , H01L21/4846 , H01L21/568 , H01L21/6835 , H01L23/49816 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/16 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85001 , H01L2924/00014 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1433 , H01L2924/15311 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A BGA semiconductor package including: a semiconductor chip on which a chip pad is formed; a flexible member formed on the semiconductor chip; a metal pattern formed on one surface of the flexible member; a connection member for electrically connecting the pad and the metal pattern; and an external terminal electrically connected to the metal pattern. A method for fabricating the BGA semiconductor package including the steps of: fabricating a flexible member; forming a metal pattern on one surface of the flexible member; forming a pad on one surface of the semiconductor chip; attaching the flexible member onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.
摘要翻译：一种BGA半导体封装，包括：形成有芯片焊盘的半导体芯片; 形成在半导体芯片上的柔性部件; 形成在所述柔性构件的一个表面上的金属图案; 用于电连接所述垫和所述金属图案的连接构件; 以及电连接到金属图案的外部端子。一种制造BGA半导体封装的方法，包括以下步骤：制造柔性元件; 在柔性构件的一个表面上形成金属图案; 在所述半导体芯片的一个表面上形成焊盘; 将所述柔性构件以所述垫暴露的方式附接到所述半导体芯片上; 电连接焊盘和金属图案; 以及将外部端子附接到所述金属图案的预定区域上。

15. 发明授权

US08335200B2 Device and method for separation/conversion of multiband signal 有权
标题翻译：用于分离/转换多频段信号的装置和方法
公开(公告)号：US08335200B2
公开(公告)日：2012-12-18
申请号：US12676749
申请日：2008-05-23
申请人： Yong Duck Chung , Kwang Seong Choi , Jae Sik Sim , Yong Hwan Kwon , Sung Bok Kim , Je Ha Kim
发明人： Yong Duck Chung , Kwang Seong Choi , Jae Sik Sim , Yong Hwan Kwon , Sung Bok Kim , Je Ha Kim
IPC分类号： H04H1/00
CPC分类号： H04B10/25759 , H04W88/10
摘要： Provided are a method and device for separating and converting multiband signals. The device includes a photoelectric converter for converting an externally received optical signal into an electrical signal, a first switch for separating the converted electrical signal into signals according to frequency bands, a first mobile communication band-pass amplifier for amplifying a mobile communication network signal of the signals separated by the first switch, a broadband up-converter for up-converting a baseband signal of the signals separated by the first switch into a broadband signal, a first broadband amplifier for amplifying the broadband signal output from the broadband up-converter, and a transmitter for wirelessly transmitting the signals amplified by the first mobile communication band-pass amplifier and the first broadband amplifier.
摘要翻译：提供了用于分离和转换多频带信号的方法和装置。该装置包括用于将外部接收的光信号转换为电信号的光电转换器，用于根据频带将转换后的电信号分离为信号的第一开关，用于放大移动通信网络信号的第一移动通信带通放大器由第一开关分离的信号，用于将由第一开关分离的信号的基带信号上变频为宽带信号的宽带上变频器，用于放大从宽带上变频器输出的宽带信号的第一宽带放大器，以及用于无线地发送由第一移动通信带通放大器和第一宽带放大器放大的信号的发射机。

16. 发明申请

US20120240727A1 METHOD OF MANUFACTURING SOLDER POWDER HAVING DIAMETER OF SUB-MICROMETERS OR SEVERAL MICROMETERS 审中-公开
标题翻译：制造具有小分子或多个微细颗粒的直径的焊料粉末的方法
公开(公告)号：US20120240727A1
公开(公告)日：2012-09-27
申请号：US13364347
申请日：2012-02-02
申请人： Yong Sung EOM , Jong Tae MOON , Kwang Seong CHOI
发明人： Yong Sung EOM , Jong Tae MOON , Kwang Seong CHOI
IPC分类号： B22F9/04
CPC分类号： B22F9/04 , B22F9/06 , B22F2998/10 , B23K35/0244 , C22C1/0483 , B22F1/0059 , B22F1/0077 , B22F2202/01
摘要： Disclosed is a method of manufacturing a solder powder having a diameter of sub-micrometers or several micrometers, the method including: mixing solder powder having a diameter of 10 to 1000 micrometers with a polymer resin to obtain a mixture; heating the mixture to a temperature higher than a melting point of the solder powder in the mixture; applying ultrasonic waves to the heated mixture so that the diameter of the solder powder becomes 0.1 to 10 micrometers; and cooling the mixture to the room temperature without exposing the solder powder of 0.1 to 10 micrometers to the air.
摘要翻译：公开了一种制造直径为亚微米或几微米的焊料粉末的方法，该方法包括：将具有10至1000微米直径的焊料粉末与聚合物树脂混合以获得混合物; 将混合物加热到高于混合物中焊料粉末的熔点的温度; 向加热的混合物施加超声波，使得焊料粉末的直径为0.1至10微米; 并将混合物冷却至室温，而不会将0.1至10微米的焊料粉末暴露于空气中。

17. 发明申请

US20110018670A1 ELECTRONIC DEVICE INCLUDING LTCC INDUCTOR 失效
标题翻译：包括LTCC电感器的电子器件
公开(公告)号：US20110018670A1
公开(公告)日：2011-01-27
申请号：US12648117
申请日：2009-12-28
申请人： Hyun-Cheol BAE , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
发明人： Hyun-Cheol BAE , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/002 , H01L2224/48091 , H01L2224/73257 , H01L2924/19107 , H01L2924/00014
摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.
摘要翻译：提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

18. 发明申请

US20100320596A1 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME 有权
标题翻译：用于制造半导体封装的方法和使用该半导体封装的半导体封装
公开(公告)号：US20100320596A1
公开(公告)日：2010-12-23
申请号：US12565171
申请日：2009-09-23
申请人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
发明人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/81 , H01L21/486 , H01L21/563 , H01L23/29 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/1134 , H01L2224/1152 , H01L2224/73104 , H01L2224/73203 , H01L2224/81192 , H01L2224/818 , H01L2224/81801 , H01L2224/83194 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Provided is a method for fabricating semiconductor package and a semiconductor package fabricated using the same. The method for fabricating semiconductor package dopes a mixture including the polymer material and the solder particle on the substrate in which the terminal is formed and applies heat, and thus the solder particle flows (or diffuses) toward the terminal in the heated polymer resin to adhere to the exposed surface of the terminal, i.e., the side surface and upper surface of the terminal, thereby forming the solder layer. The solder layer improves the adhesive strength between the terminal of the semiconductor chip and the terminal of the substrate in the subsequent flip chip bonding process.
摘要翻译：提供一种制造半导体封装的方法和使用其制造的半导体封装。制造半导体封装的方法在形成端子的基板上涂覆包括聚合物材料和焊料颗粒的混合物，并施加热量，从而焊料颗粒向加热的聚合物树脂中的端子流动（或扩散）以粘附到端子的暴露表面，即端子的侧表面和上表面，从而形成焊料层。焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子和衬底的端子之间的粘合强度。

19. 发明申请

US20080297299A1 VERTICALLY FORMED INDUCTOR AND ELECTRONIC DEVICE HAVING THE SAME 失效
标题翻译：垂直形成的电感器和具有该电感器的电子器件
公开(公告)号：US20080297299A1
公开(公告)日：2008-12-04
申请号：US12053716
申请日：2008-03-24
申请人： Ho Gyeong Yun , Kwang Seong Choi , Jong Tae Moon
发明人： Ho Gyeong Yun , Kwang Seong Choi , Jong Tae Moon
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F17/0033 , H01F27/34 , H01F2017/002
摘要： Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.
摘要翻译：提供了一种垂直形成的电感器，以及具有电感器的电子器件，更具体地说，一种电感器，其能够通过在多个绝缘层中垂直形成电感器来最小化表面积的损失并实现高效率阻抗，以及具有该电子设备的电子设备。电感器包括布置在绝缘层中的多条导线; 以及在绝缘层中垂直形成的通孔，以电连接多条导线。当制造包括由本发明提出的电感器的电路板或电子设备时，电感器可以在提供高电感的同时占据电子设备或电路板中的最小面积。特别地，电感器占用的电子设备或板的表面积可以显着降低，从而降低制造成本。

20. 发明授权

US07298933B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US07298933B2
公开(公告)日：2007-11-20
申请号：US11148906
申请日：2005-06-09
申请人： Kwang Seong Choi , Jong Hyun Lee , Yong Duck Chung , Young Shik Kang , Jong Tae Moon , Je Ha Kim
发明人： Kwang Seong Choi , Jong Hyun Lee , Yong Duck Chung , Young Shik Kang , Jong Tae Moon , Je Ha Kim
IPC分类号： G02F1/01 , G02F1/35
CPC分类号： G02F1/0356
摘要： Provided is an optical module including a microstrip line, a traveling wave type optical device positioned in the end of the microstrip line, and at least one balanced open stub connected to the microstrip line for the impedance matching at a specific frequency such as 40 GHz and 60 GHz. For the fine tuning, laser trimming can be applied to the stub. A transition region is formed between the optical device and the microstrip line. A termination resistor is formed to face the microstrip line with the optical device therebetween. A bandwidth can be controlled at a specific frequency by adjusting a number of the stubs or a value of the termination resistor.
摘要翻译：提供了一种光学模块，其包括微带线，位于微带线的端部的行波型光学器件和连接到微带线的至少一个平衡的开路短路，用于在特定频率例如40GHz的阻抗匹配，以及 60 GHz。对于微调，激光修剪可以应用于存根。在光学器件和微带线之间形成过渡区域。形成终端电阻器，以便在其间具有光学器件来面对微带线。可以通过调整短路的数量或终端电阻的值来控制带宽在特定频率。

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