专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20110042130A1 Multilayered wiring substrate and manufacturing method thereof 审中-公开
标题翻译：多层布线基板及其制造方法
公开(公告)号：US20110042130A1
公开(公告)日：2011-02-24
申请号：US12654529
申请日：2009-12-22
申请人： Chang Hyun Lim , Tae Hoon Kim , Young Ki Lee , Tae Hyun Kim , Ki Ho Seo
发明人： Chang Hyun Lim , Tae Hoon Kim , Young Ki Lee , Tae Hyun Kim , Ki Ho Seo
IPC分类号： H05K1/11 , H01K3/10 , H05K3/36
CPC分类号： H05K3/4641 , H05K1/053 , H05K3/445 , H05K3/4623 , H05K2203/0315 , Y10T29/49126 , Y10T29/49162
摘要： A multilayered wiring substrate and a manufacturing method thereof are disclosed. The multilayered wiring substrate includes: a stacked body including an insulating member and first and second metal cores stacked with the insulating member interposed therebetween, and having a through hole penetrating the first and second metal cores; first and second insulation layers formed on an external surface, excluding an inner wall of the through hole, of the first and second metal cores, respectively; first and second inner layer circuit patterns and first and second outer layer circuit patterns formed on the first and second insulation layers, respectively; first and second via electrodes electrically connecting the first and second inner layer circuit patterns and the first and second outer layer circuit patterns; a third insulation layer formed on the inner wall of the through hole; and a through electrode made of a conductive material filled in the through hole and electrically connecting the first and second outer layer circuit patterns.
摘要翻译：公开了一种多层布线基板及其制造方法。所述多层布线基板包括：堆叠体，其包括绝缘部件和被插入其间的所述绝缘部件堆叠的第一和第二金属芯体，并且具有穿过所述第一和第二金属芯体的通孔; 第一和第二绝缘层分别形成在第一和第二金属芯的外表面上，不包括通孔的内壁; 分别形成在第一绝缘层和第二绝缘层上的第一和第二内层电路图案和第一和第二外层电路图案; 第一和第二通孔电极，电连接第一和第二内层电路图案以及第一和第二外层电路图案; 形成在所述通孔的内壁上的第三绝缘层; 以及由填充在所述通孔中的导电材料制成的电连接电连接所述第一外层电路图案和所述第二外层电路图案的贯通电极。

IPRDB

热门服务

关于我们

友情链接

联系方式