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11. 发明授权

US07370536B2 Pressure sensor device and pressure sensor cell thereof 有权
标题翻译：压力传感器装置及其压力传感器单元
公开(公告)号：US07370536B2
公开(公告)日：2008-05-13
申请号：US11372465
申请日：2006-03-10
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.
摘要翻译：压力传感器装置包括压力传感器单元，该压力传感器单元包括具有压电电阻的隔膜的传感器芯片，放大电路和各种调节电路，以及传感器芯片接合的基座构件，隔膜面向通孔的基础成员。基部构件和金属构件与接合构件接合在一起，使得它们各自的通孔彼此连通。保护膜或填充物覆盖基部构件和金属管构件之间的接合构件。金属管构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片通过引线接合电连接在一起，从而形成压力传感器单元。金属管构件突出超过树脂壳体的端面以支撑负载。

12. 发明申请

US20070290761A1 Signal amplifier circuit 有权
标题翻译：信号放大电路
公开(公告)号：US20070290761A1
公开(公告)日：2007-12-20
申请号：US11783327
申请日：2007-04-09
申请人： Mutsuo Nishikawa , Katsumichi Ueyanagi , Katsuyuki Uematsu , Yuko Fujimoto
发明人： Mutsuo Nishikawa , Katsumichi Ueyanagi , Katsuyuki Uematsu , Yuko Fujimoto
IPC分类号： H03F1/34
CPC分类号： H03F3/45 , G01D3/021 , G01D3/028 , G01L27/007
摘要： A signal amplifier circuit includes a negative feedback amplifier circuit having an output terminal, a first voltage limiting device for limiting the output voltage from the negative feedback amplifier circuit, a second voltage limiting device for limiting the output voltage from the negative feedback amplifier circuit, a first reference voltage supply applying a first reference voltage to the first voltage limiting device, a second reference voltage supply applying a second reference voltage to the second voltage limiting device. The first voltage limiting device is configured to fix a lower limit saturation voltage at the first reference voltage. The second voltage limiting device is configured to fix an upper limit saturation voltage at the second reference voltage.
摘要翻译：信号放大器电路包括具有输出端子的负反馈放大器电路，用于限制来自负反馈放大器电路的输出电压的第一电压限制装置，用于限制来自负反馈放大器电路的输出电压的第二电压限制装置，将第一参考电压施加到所述第一电压限制装置的第一参考电压源，向所述第二电压限制装置施加第二参考电压的第二参考电压电源。第一限压装置被配置为固定第一参考电压的下限饱和电压。第二电压限制装置被配置为将第二参考电压的上限饱和电压固定。

13. 发明授权

US07046013B2 Open-circuit failure detection circuit 有权
公开(公告)号：US07046013B2
公开(公告)日：2006-05-16
申请号：US10401772
申请日：2003-03-31
申请人： Katsuyuki Uematsu , Mutsuo Nishikawa , Katsumichi Ueyanagi
发明人： Katsuyuki Uematsu , Mutsuo Nishikawa , Katsumichi Ueyanagi
IPC分类号： G01R31/08
CPC分类号： H02H5/10 , G01R31/025 , G01R31/316
摘要： A broken-wire-failure detection circuit connected to a higher circuit includes a power line, a signal line, a ground line, and at least one of the first resistance device connected between the power line and the signal line and the second resistance device connected between the signal line and the ground line. The broken-wire-failure detection circuit also includes the third resistance device connected between the power line and the ground line, and a signal output circuit connected to the second power line, the second signal line and the second ground line.

14. 发明申请

US20050087020A1 Pressure sensor device and cell thereof 有权
标题翻译：压力传感器及其单元
公开(公告)号：US20050087020A1
公开(公告)日：2005-04-28
申请号：US10926797
申请日：2004-08-26
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L19/14 , G01L9/00 , G01L9/04 , G01L19/00 , H01L29/84
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/143 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.
摘要翻译：一种压力传感器装置包括：压力传感器芯片，其包含隔膜，压电电阻器，放大电路和各种调节电路;以及传感器芯片接合的基座构件，隔膜面向基座构件的通孔。基部构件和金属构件接合，使得它们各自的通孔彼此连通。将金属构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片电连接以形成压力传感器单元。通过将O形环连接到金属构件并且从上方按压树脂壳体，压力传感器单元固定到例如油封块的外壳上。使用具有弯曲部分和螺纹部分的连接器，压力传感器单元可以通过弯曲压力传感器单元上的弯曲部分而固定到连接器。螺纹部分可以拧入外壳。

15. 发明授权

US06747346B2 Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device 失效
标题翻译：用于半导体传感器的容器，其制造方法和半导体传感器装置
公开(公告)号：US06747346B2
公开(公告)日：2004-06-08
申请号：US10121431
申请日：2002-04-12
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
IPC分类号： H01L2312
CPC分类号： G01L19/142 , G01L19/147 , H01L23/057 , H01L23/10 , H01L23/24 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A container for a semiconductor sensor includes a housing body and a cover. On the upper surface of the housing body outer than the pressure detection room, a groove is provided to trap the gel protective material overflowed from the pressure detection room. The housing body and the cover are respectively provided with a recess portion and a protruding portion, engaging with each other, to secure adhesion of the cover to the housing body. The clearance between the housing body and the lead terminal is filled with filler that is formed by applying and curing polyimide resin. The sensor-mounting pit is provided with a relief portion for releasing excess portion of the adhesive, which is used for adhering the pedestal. The excess adhesive is released into the relief portion, to suppress creeping up of the adhesive.
摘要翻译：用于半导体传感器的容器包括壳体和盖。在壳体的比压力检测室以外的上表面设置有用于捕获从压力检测室溢出的凝胶保护材料的槽。壳体和盖分别设置有彼此接合的凹部和突出部分，以确保盖与壳体的粘附。壳体与引线端子之间的间隙填充有通过涂覆和固化聚酰亚胺树脂形成的填料。传感器安装凹坑设置有用于释放用于粘附基座的粘合剂的多余部分的释放部分。多余的粘合剂被释放到浮雕部分中，以抑制粘合剂的蠕变。

16. 发明授权

US06446507B2 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor 失效
标题翻译：半导体传感器芯片及其制造方法，以及用于组装传感器的半导体传感器和封装
公开(公告)号：US06446507B2
公开(公告)日：2002-09-10
申请号：US09957504
申请日：2001-09-21
申请人： Katsumichi Ueyanagi , Mutsuo Nishikawa , Mitsuo Sasaki
发明人： Katsumichi Ueyanagi , Mutsuo Nishikawa , Mitsuo Sasaki
IPC分类号： G01P1500
CPC分类号： G01P1/023 , G01P15/0802 , G01P15/0888 , G01P15/11 , G01P15/123 , G01P21/00 , H01F10/126 , H01F10/265 , H05K1/18
摘要： The present invention is an acceleration sensor chip having characterized a third layer formed on a first layer of a support substrate through an insulating second layer, where the third layer has a sensor structure. The second layer between the detection surface of the sensor structure and the first layer is removed. A beam part with a detection device, and a weight part with a plurality of cutouts of a same width are formed over the entire detection surface.
摘要翻译：本发明是一种加速度传感器芯片，其特征在于通过绝缘的第二层形成在支撑基板的第一层上的第三层，其中第三层具有传感器结构。传感器结构的检测表面与第一层之间的第二层被去除。具有检测装置的梁部分和具有相同宽度的多个切口的重量部分形成在整个检测表面上。

17. 发明申请

US20080150102A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的半导体器件和制造方法
公开(公告)号：US20080150102A1
公开(公告)日：2008-06-26
申请号：US11872867
申请日：2007-10-16
申请人： Toshiyuki Yokomae , Katsumichi Ueyanagi , Eiji Mochizuki , Yoshinari Ikeda
发明人： Toshiyuki Yokomae , Katsumichi Ueyanagi , Eiji Mochizuki , Yoshinari Ikeda
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L25/072 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/84 , H01L25/162 , H01L25/18 , H01L25/50 , H01L2224/05553 , H01L2224/37011 , H01L2224/371 , H01L2224/37111 , H01L2224/37144 , H01L2224/37147 , H01L2224/3754 , H01L2224/40137 , H01L2224/45124 , H01L2224/48091 , H01L2224/48175 , H01L2224/48227 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83224 , H01L2224/83801 , H01L2224/84801 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electrical connection inside a semiconductor device is established by lead frames formed of plural conductor plates. The lead frames are disposed three-dimensionally so that the respective weld parts thereof are exposed toward a laser light source used in the laser welding. The laser welding is then performed by irradiating a laser beam. According to the above, welding can be performed readily in a reliable manner. The productivity of the semiconductor device and the manufacturing method of the semiconductor device can be thus enhanced. In addition, because the lead frames have the cooling effect, they have the capability of a heat spreader. It is thus possible to provide a semiconductor device and a manufacturing method of the semiconductor device with high productivity.
摘要翻译：通过由多个导体板形成的引线框架建立半导体器件内部的电连接。引线框架三维地设置，使得其各个焊接部分朝向激光焊接中使用的激光源曝光。然后通过照射激光束来进行激光焊接。根据上述，可以容易地以可靠的方式进行焊接。因此可以提高半导体器件的生产率和半导体器件的制造方法。另外，由于引线框具有冷却效果，因此具有散热器的能力。因此，可以以高生产率提供半导体器件的半导体器件和制造方法。

18. 发明申请

US20080110273A1 PRESSURE SENSOR APPARATUS AND PRESSURE SENSOR HOUSING 有权
标题翻译：压力传感器装置和压力传感器外壳
公开(公告)号：US20080110273A1
公开(公告)日：2008-05-15
申请号：US11939077
申请日：2007-11-13
申请人： Kazunori SAITO , Kimihiro ASHINO , Katsumichi UEYANAGI
发明人： Kazunori SAITO , Kimihiro ASHINO , Katsumichi UEYANAGI
IPC分类号： G01L7/00
CPC分类号： G01L19/0038 , G01L19/0627 , G01L19/141
摘要： A pressure sensor apparatus and a pressure sensor housing are provided that are capable of preventing the occurrence of frozen moisture, swelling of a gel-like coating member and damage of a pressure sensor element without accumulating moisture, oil, gasoline or the like on a protective wall even when the pressure sensor apparatus is disposed obliquely. The protective wall prevents entry of foreign matter into the pressure detection chamber, or a pressure sensor housing of the pressure sensor apparatus. The protective wall has an inclined surface that is provided with an angle θ8a in which a second angle θ2 is acquired between a horizontal line HL and the inclined surface that slopes downward when the pressure sensor apparatus is disposed obliquely by a first angle θ1 with respect to the horizontal line HL.
摘要翻译：提供一种压力传感器装置和压力传感器壳体，其能够防止冻结的水分的发生，凝胶状涂层部件的膨胀和压力传感器元件的损坏，而不会将水分，油，汽油等积聚在保护即使压力传感器装置倾斜地设置。保护壁防止异物进入压力检测室或压力传感器装置的压力传感器外壳。保护壁具有倾斜表面，其具有角度θ8a，其中在水平线HL和向下倾斜的倾斜表面之间获取第二角度θ2 < 当压力传感器装置相对于水平线HL倾斜地设置第一角度θ1时。

19. 发明授权

US07119657B2 Polysilicon resistor semiconductor device 有权
标题翻译：多晶硅电阻半导体器件
公开(公告)号：US07119657B2
公开(公告)日：2006-10-10
申请号：US10120211
申请日：2002-04-10
申请人： Katsumichi Ueyanagi , Mutsuo Nishikawa , Katsuyuki Uematsu
发明人： Katsumichi Ueyanagi , Mutsuo Nishikawa , Katsuyuki Uematsu
IPC分类号： H01C1/012 , H01C7/06
CPC分类号： H01L28/20 , H01L23/522 , H01L27/0802 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes a polysilicon resistor that can suppress variations in resistance value in environments with an ambient temperature higher than room temperature. The resistance value Rcon of a polysilicon contact is reduced to 2% or less of the sum of the resistance value Rcon of the polysilicon contact and the resistance value Rpoly of a polysilicon resistor. Hence, a semiconductor device that is not significantly affected by a variation in the resistance of the polysilicon contact is realized. This device suppresses variations in resistance value in environments with an ambient temperature higher than room temperature.
摘要翻译：半导体器件包括可以抑制环境温度高于室温的环境中的电阻值变化的多晶硅电阻器。多晶硅接触的电阻值R SUB降低到多晶硅接触的电阻值R OUT的总和的2％以下，电阻值R _{多晶硅电阻器的多晶硅。因此，实现了不受多晶硅接触电阻变化的显着影响的半导体器件。该装置抑制环境温度高于室温的环境中的电阻值的变化。}

20. 发明申请

US20060213276A1 Pressure sensor device and pressure sensor cell thereof 有权
标题翻译：压力传感器装置及其压力传感器单元
公开(公告)号：US20060213276A1
公开(公告)日：2006-09-28
申请号：US11372465
申请日：2006-03-10
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.
摘要翻译：压力传感器装置包括压力传感器单元，该压力传感器单元包括具有压电电阻的隔膜的传感器芯片，放大电路和各种调节电路，以及传感器芯片接合的基座构件，隔膜面向通孔的基础成员。基部构件和金属构件与接合构件接合在一起，使得它们各自的通孔彼此连通。保护膜或填充物覆盖基部构件和金属管构件之间的接合构件。金属管构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片通过引线接合电连接在一起，从而形成压力传感器单元。金属管构件突出超过树脂壳体的端面以支撑负载。

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